- RFQ
- BOM
-
Contact Us
Tel: +86-0755-83501315
Email: sales@sic-components.com
- Chinese
- English
- French
- German
- Portuguese
- Spanish
- Russian
- Japanese
- Korean
- Arabic
- Irish
- Greek
- Turkish
- Italian
- Danish
- Romanian
- Indonesian
- Czech
- Afrikaans
- Swedish
- Polish
- Basque
- Catalan
- Esperanto
- Hindi
- Lao
- Albanian
- Amharic
- Armenian
- Azerbaijani
- Belarusian
- Bengali
- Bosnian
- Bulgarian
- Cebuano
- Chichewa
- Corsican
- Croatian
- Dutch
- Estonian
- Filipino
- Finnish
- Frisian
- Galician
- Georgian
- Gujarati
- Haitian
- Hausa
- Hawaiian
- Hebrew
- Hmong
- Hungarian
- Icelandic
- Igbo
- Javanese
- Kannada
- Kazakh
- Khmer
- Kurdish
- Kyrgyz
- Latin
- Latvian
- Lithuanian
- Luxembou..
- Macedonian
- Malagasy
- Malay
- Malayalam
- Maltese
- Maori
- Marathi
- Mongolian
- Burmese
- Nepali
- Norwegian
- Pashto
- Persian
- Punjabi
- Serbian
- Sesotho
- Sinhala
- Slovak
- Slovenian
- Somali
- Samoan
- Scots Gaelic
- Shona
- Sindhi
- Sundanese
- Swahili
- Tajik
- Tamil
- Telugu
- Thai
- Ukrainian
- Urdu
- Uzbek
- Vietnamese
- Welsh
- Xhosa
- Yiddish
- Yoruba
- Zulu
- Kinyarwanda
- Tatar
- Oriya
- Turkmen
- Uyghur
Sockets for ICs, Transistors(23296)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Type | Features | Base Product Number | Termination | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Current Rating (Amps) | Housing Material | Material Flammability Rating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Material - Post | Termination Post Length | Contact Resistance |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
ICA-648-ZSTT | 6.9567 |  |
7771 | 0.00000000 | Samtec Inc. | ICA | Tube | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | Solder | download | ROHS3 Compliant | 612-ICA-648-ZSTT | 9 | 1 A | Polyester, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | - | Tin | - | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | Brass | 10mOhm | |||||||
|
38-0518-00 | 8.0790 | |
1604 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Surface Mount | SIP | Open Frame | 38-0518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 38 (1 x 38) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.046" (1.17mm) | - | ||
|
06-3518-10M | 1.0605 | |
9016 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 06-3518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 66 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 6 (2 x 3) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||
|
D3914-42 | - | |
2961 | 0.00000000 | Harwin Inc. | D39 | Bulk | Obsolete | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 50 | 1 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 196.9µin (5.00µm) | 14 (2 x 7) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.126" (3.20mm) | 10mOhm | |||
|
30-PLS16022-12 | 80.4067 | |
4349 | 0.00000000 | Aries Electronics | PLS | Bulk | Active | -65°C ~ 125°C | Through Hole | PGA, ZIF (ZIP) | Closed Frame | 30-PLS1 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS) | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.125" (3.18mm) | - | ||
|
1109927-48 | - | |
4068 | 0.00000000 | Aries Electronics | - | - | Active | - | - | - | - | 1109927 | - | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 6 | - | - | - | - | - | - | - | - | - | - | - | - | - | |||
|
36-3572-11 | 27.5047 | |
8171 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 36-3572 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||
|
ICO-320-NGT | 7.4736 | |
8652 | 0.00000000 | Samtec Inc. | ICO | Tube | Active | -55°C ~ 125°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | Solder | download | ROHS3 Compliant | 612-ICO-320-NGT | 22 | 1 A | Polyester, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 10.0µin (0.25µm) | 20 (2 x 10) | Beryllium Copper | 0.100" (2.54mm) | Brass | 10mOhm | |||||||
|
518-77-388M26-001106 | 55.8582 | |
7950 | 0.00000000 | Preci-Dip | 518 | Bulk | Active | -55°C ~ 125°C | Surface Mount | PGA | Open Frame | 518-77 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 15 | 1 A | FR4 Epoxy Glass | UL94 V-0 | 0.050" (1.27mm) | Gold | Flash | Gold | Flash | 388 (26 x 26) | Beryllium Copper | 0.050" (1.27mm) | Brass | 0.062" (1.57mm) | 10mOhm | ||
|
18-3518-01 | 8.8275 | |
2717 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 18-3518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 18 (2 x 9) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||
|
511-93-114-13-061001 | - | |
6912 | 0.00000000 | Mill-Max Manufacturing Corp. | 511 | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | Open Frame | 511-93 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 200.0µin (5.08µm) | 114 (13 x 13) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.170" (4.32mm) | 10mOhm | ||
|
551-90-101-13-061003 | - | |
8486 | 0.00000000 | Mill-Max Manufacturing Corp. | 551 | Tube | Active | - | Through Hole | PGA | Open Frame | 551-90 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 15 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Tin-Lead | 200.0µin (5.08µm) | 101 (13 x 13) | - | 0.100" (2.54mm) | Brass Alloy | 0.154" (3.91mm) | - | |||
 |
116-87-318-41-008101 | 1.6364 | |
4960 | 0.00000000 | Preci-Dip | 116 | Tube | Active | -55°C ~ 125°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Elevated, Open Frame | 116-87 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 23 | 1 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | Flash | Tin | - | 18 (2 x 9) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | 10mOhm | ||
|
37-0511-11 | 24.5924 | |
3021 | 0.00000000 | Aries Electronics | 511 | Bulk | Active | -55°C ~ 125°C | Through Hole | SIP | - | 37-0511 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 37 (1 x 37) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.150" (3.81mm) | - | ||
|
20-6511-10 | 4.1208 | |
7678 | 0.00000000 | Aries Electronics | 511 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 20-6511 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 19 | 1 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.150" (3.81mm) | - | ||
|
514-87-478M26-131148 | 45.1632 | |
3853 | 0.00000000 | Preci-Dip | 514 | Bulk | Active | -55°C ~ 125°C | Surface Mount | BGA | Open Frame | 514-87 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 15 | 1 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | Flash | Tin | - | 478 (26 x 26) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.055" (1.40mm) | 10mOhm | ||
|
614-87-044-08-031112 | 4.9743 | |
1604 | 0.00000000 | Preci-Dip | 614 | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | Carrier, Open Frame | 614-87 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 26 | 1 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | Flash | Tin | - | 44 (8 x 8) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.136" (3.45mm) | 10mOhm | ||
|
04-1518-00 | 0.5479 | |
2453 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | DIP, 0.2" (5.08mm) Row Spacing | Open Frame | 04-1518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 4 (2 x 2) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||
|
28-3575-16 | 37.3706 | |
8646 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 28-3575 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 9 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||
 |
410-83-224-10-002101 | 1.7987 | |
7515 | 0.00000000 | Preci-Dip | 410 | Bulk | Active | -55°C ~ 125°C | Through Hole | Zig-Zag, Right Stackable | - | 410-83 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 700 | 1 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | - | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | 10mOhm | ||
 |
612-83-422-41-001101 | 1.9415 | |
5081 | 0.00000000 | Preci-Dip | 612 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.4" (10.16mm) Row Spacing | Carrier, Open Frame | 612-83 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 18 | 1 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | - | 22 (2 x 11) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.291" (7.39mm) | 10mOhm | ||
|
84-PRS13125-12 | 76.9217 | |
4613 | 0.00000000 | Aries Electronics | PRS | Bulk | Active | -65°C ~ 125°C | Through Hole | PGA, ZIF (ZIP) | Closed Frame | 84-PRS1 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS) | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.125" (3.18mm) | - | ||
|
ICF-624-TL-O | 4.6500 | |
3950 | 0.00000000 | Samtec Inc. | ICF | Bulk | Active | -55°C ~ 125°C | Surface Mount | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | Solder | download | ROHS3 Compliant | 612-ICF-624-TL-O | 1 | Liquid Crystal Polymer (LCP) | - | 0.100" (2.54mm) | Tin | - | Tin | - | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | - | - | |||||||
|
14-6513-11H | 5.0085 | |
4089 | 0.00000000 | Aries Electronics | Lo-PRO®file, 513 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 14-6513 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 14 (2 x 7) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||
|
14-8350-310C | 9.4798 | |
6785 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame, Elevated | 14-8350 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 14 (2 x 7) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||
|
28-C182-31 | 22.7922 | |
2511 | 0.00000000 | Aries Electronics | EJECT-A-DIP™ | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 28-C182 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.040" (1.02mm) | - | ||
|
36-3553-11 | 22.9886 | |
8845 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 36-3553 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | - | Gold | - | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||
|
1109800-20 | - | |
6713 | 0.00000000 | Aries Electronics | Correct-A-Chip® 1109800 | Bulk | Active | - | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Programmable | 1109800 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 200.0µin (5.08µm) | 20 (2 x 10) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||
|
APA-322-G-N | - | |
3739 | 0.00000000 | Samtec Inc. | APA | Bulk | Active | - | Through Hole | - | Open Frame | APA-322 | Solder | download | ROHS3 Compliant | Not Applicable | EAR99 | 8536.69.4040 | 1 | Polybutylene Terephthalate (PBT), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 20.0µin (0.51µm) | 22 (2 x 11) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | - | - | ||||
|
515-13-120-13-061001 | - | |
9383 | 0.00000000 | Mill-Max Manufacturing Corp. | 515 | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | Open Frame | 515-13 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 120 (13 x 13) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.108" (2.74mm) | 10mOhm |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
Wishlist (0 Items)