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Sockets for ICs, Transistors(4545)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Type | Features | Base Product Number | Termination | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | ECCN | HTSUS | Standard Package | Current Rating (Amps) | Housing Material | Material Flammability Rating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Convert From (Adapter End) | Convert To (Adapter End) | Number of Pins | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Material - Post | Termination Post Length | Contact Resistance | Board Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
37-PGM10012-10 | 13.0478 |  |
3520 | 0.00000000 | Aries Electronics | PGM | Bulk | Active | -55°C ~ 105°C | Through Hole | PGA | - | 37-PGM1 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.165" (4.19mm) | - | |||||
|
06-0503-21 | 4.2218 | |
7735 | 0.00000000 | Aries Electronics | 0503 | Bulk | Active | - | Through Hole | SIP | - | 06-0503 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA), Nylon, Glass Filled | UL94 HB | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 6 (1 x 6) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.360" (9.14mm) | - | |||||
|
19-0511-10 | 6.5958 | |
9006 | 0.00000000 | Aries Electronics | 511 | Bulk | Active | -55°C ~ 105°C | Through Hole | SIP | - | 19-0511 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 10 | 1 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 50.0µin (1.27µm) | Tin | 50.0µin (1.27µm) | 19 (1 x 19) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.150" (3.81mm) | - | |||||
|
39-0518-11H | 9.4606 | |
7630 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | SIP | Open Frame | 39-0518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 39 (1 x 39) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | |||||
|
361-PLS19001-12 | 142.6475 | |
5876 | 0.00000000 | Aries Electronics | PLS | Bulk | Active | -65°C ~ 125°C | Through Hole | PGA, ZIF (ZIP) | Closed Frame | 361-PLS | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS) | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.125" (3.18mm) | - | |||||
|
18-81180-610C | 11.6535 | |
7268 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame, Elevated | 18-8118 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 18 (2 x 9) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | |||||
|
28-C182-00 | 12.8587 | |
9875 | 0.00000000 | Aries Electronics | EJECT-A-DIP™ | Bulk | Active | -55°C ~ 105°C | Surface Mount | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 28-C182 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.040" (1.02mm) | - | |||||
|
30-9503-31 | 22.4484 | |
6996 | 0.00000000 | Aries Electronics | 503 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.9" (22.86mm) Row Spacing | Closed Frame | 30-9503 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 30 (2 x 15) | Beryllium Copper | 0.100" (2.54mm) | Phosphor Bronze | 0.500" (12.70mm) | - | |||||
|
40-3554-16 | 68.9886 | |
3372 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 40-3554 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |||||
|
28-6556-20 | 13.7463 | |
8026 | 0.00000000 | Aries Electronics | 6556 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 28-6556 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.283" (7.19mm) | - | |||||
|
14-354000-20 | 22.5795 | |
2446 | 0.00000000 | Aries Electronics | Correct-A-Chip® 354000 | Bulk | Active | - | Surface Mount | - | 14-3540 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | DIP, 0.3" (7.62mm) Row Spacing | SOIC | 14 | Beryllium Copper | 0.050" (1.27mm) | Brass | - | - | ||||
|
30-6822-90C | 13.3282 | |
7670 | 0.00000000 | Aries Electronics | Vertisockets™ 800 | Bulk | Active | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 30-6822 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 30 (2 x 15) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | |||||
|
36-6501-30 | 9.1808 | |
9571 | 0.00000000 | Aries Electronics | 501 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 36-6501 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1.5 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.690" (17.52mm) | - | |||||
|
06-6503-30 | 3.4138 | |
9193 | 0.00000000 | Aries Electronics | 503 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 06-650 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 6 (2 x 3) | Beryllium Copper | 0.100" (2.54mm) | Phosphor Bronze | 0.500" (12.70mm) | - | |||||
|
121-PRS13013-12 | 83.4633 | |
9174 | 0.00000000 | Aries Electronics | PRS | Bulk | Active | -65°C ~ 125°C | Through Hole | PGA, ZIF (ZIP) | Closed Frame | 121-PRS | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS) | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.125" (3.18mm) | - | |||||
|
12-350000-10-HT | 17.6546 | |
7501 | 0.00000000 | Aries Electronics | Correct-A-Chip® 350000 | Bulk | Active | - | Through Hole | - | 12-3500 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | - | - | 0.050" (1.27mm) | Tin | - | Tin-Lead | 200.0µin (5.08µm) | SOIC | DIP, 0.3" (7.62mm) Row Spacing | 12 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | Polyimide (PI) | |||||
|
08-0518-11H | 1.8422 | |
5421 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | SIP | Open Frame | 08-0518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 8 (1 x 8) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | |||||
|
44-6553-10 | 16.1246 | |
6322 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 44-6553 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |||||
|
18-3508-30 | 9.3627 | |
4391 | 0.00000000 | Aries Electronics | 508 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 18-3508 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 18 (2 x 9) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.360" (9.14mm) | - | |||||
|
13-0513-11H | 3.2926 | |
6367 | 0.00000000 | Aries Electronics | 0513 | Bulk | Active | - | Through Hole | SIP | - | 13-0513 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 13 (1 x 13) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | |||||
|
24-3575-11 | 19.4747 | |
1662 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 24-3575 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 10 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |||||
|
08-820-90C | 4.8551 | |
3021 | 0.00000000 | Aries Electronics | Vertisockets™ 800 | Bulk | Active | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame | 08-820 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | |||||
|
44-3575-11 | 32.6262 | |
7755 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 44-3575 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |||||
|
32-9513-11 | 10.0535 | |
4765 | 0.00000000 | Aries Electronics | Lo-PRO®file, 513 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.9" (22.86mm) Row Spacing | Closed Frame | 32-9513 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | |||||
|
12-3513-10H | 3.0906 | |
8086 | 0.00000000 | Aries Electronics | Lo-PRO®file, 513 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame | 12-3513 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 12 (2 x 6) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | |||||
|
68-PRS11033-16 | - | |
9681 | 0.00000000 | Aries Electronics | PRS | Bulk | Obsolete | -65°C ~ 200°C | Through Hole | PGA, ZIF (ZIP) | Closed Frame | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS) | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Nickel Bronze | 50.0µin (1.27µm) | - | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.125" (3.18mm) | - | ||||||
|
12-0503-31 | 9.0002 | |
3945 | 0.00000000 | Aries Electronics | 0503 | Bulk | Active | - | Through Hole | SIP | - | 12-0503 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA), Nylon, Glass Filled | UL94 HB | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 12 (1 x 12) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.500" (12.70mm) | - | |||||
|
40-6554-18 | 140.2957 | |
1353 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -55°C ~ 250°C | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 40-6554 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyetheretherketone (PEEK), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 40 (2 x 20) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | |||||
|
28-0508-31 | 18.0474 | |
5431 | 0.00000000 | Aries Electronics | 508 | Bulk | Active | -55°C ~ 125°C | Through Hole | SIP | - | 28-0508 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6 | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 28 (1 x 28) | Beryllium Copper | - | Brass | 0.500" (12.70mm) | - | |||||
|
10-8723-210C | - | |
9854 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.2" (5.08mm) Row Spacing | Closed Frame, Elevated | 10-8723 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 10 (2 x 5) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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