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Sockets for ICs, Transistors(4545)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Type | Features | Base Product Number | Termination | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Current Rating (Amps) | Housing Material | Material Flammability Rating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Convert From (Adapter End) | Convert To (Adapter End) | Number of Pins | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Material - Post | Termination Post Length | Contact Resistance | Board Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
09-0518-10 | 0.8363 |  |
4633 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | SIP | Open Frame | 09-0518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 9 (1 x 9) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
34-3503-31 | 23.8722 | |
4165 | 0.00000000 | Aries Electronics | 503 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame | 34-3503 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 34 (2 x 17) | Beryllium Copper | 0.100" (2.54mm) | Phosphor Bronze | 0.500" (12.70mm) | - | ||||||
|
28-6508-202 | 13.3458 | |
9990 | 0.00000000 | Aries Electronics | 508 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 28-650 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.360" (9.14mm) | - | ||||||
|
24-6573-11 | 20.3546 | |
1107 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 24-6573 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 11 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
28-C212-30 | 18.4726 | |
9614 | 0.00000000 | Aries Electronics | EJECT-A-DIP™ | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 28-C212 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.040" (1.02mm) | - | ||||||
|
24-4518-10H | 6.0256 | |
9632 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | DIP, 0.4" (10.16mm) Row Spacing | Open Frame | 24-4518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
08-8370-310C | 6.4842 | |
2513 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame, Elevated | 08-8370 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 8 (2 x 4) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||||||
|
17-0513-11 | 3.5350 | |
1504 | 0.00000000 | Aries Electronics | 0513 | Bulk | Active | - | Through Hole | SIP | - | 17-0513 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 17 (1 x 17) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
42-6574-16 | 55.9738 | |
5115 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 42-6574 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 8 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
28-3573-11 | 22.0725 | |
5242 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 28-3573 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 10 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
16-304235-10 | 19.8962 | |
2324 | 0.00000000 | Aries Electronics | Correct-A-Chip® 304235 | Bulk | Active | 105°C | Through Hole | Socket Included | 16-3042 | Solder | - | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | Q2249621 | EAR99 | 8536.69.4040 | 1 | 1 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | - | Gold | 10.0µin (0.25µm) | Tin-Lead | 200.0µin (5.08µm) | DIP, 0.3" (7.62mm) Row Spacing | DIP, 0.3" (7.62mm) Row Spacing | 16 | Beryllium Copper | - | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||||
|
44-3553-11 | 27.2591 | |
6690 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 44-3553 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | - | Gold | - | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
40-6508-211 | 31.3007 | |
6224 | 0.00000000 | Aries Electronics | 508 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 40-650 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.500" (12.70mm) | - | ||||||
|
16-6820-90C | 10.4534 | |
1666 | 0.00000000 | Aries Electronics | Vertisockets™ 800 | Bulk | Active | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 16-6820 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 16 (2 x 8) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||||||
|
32-9503-30 | 14.8090 | |
4111 | 0.00000000 | Aries Electronics | 503 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.9" (22.86mm) Row Spacing | Closed Frame | 32-9503 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Phosphor Bronze | 0.500" (12.70mm) | - | ||||||
|
12-81250-610C | 8.6163 | |
8445 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame, Elevated | 12-8125 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 12 (2 x 6) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||||||
 |
12-0501-30 | 6.6781 | |
6908 | 0.00000000 | Aries Electronics | 501 | Bulk | Active | -55°C ~ 105°C | Through Hole | SIP | - | 12-0501 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 20 | 1 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 12 (1 x 12) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.690" (17.52mm) | - | ||||||
|
04-0503-31 | 2.8482 | |
5994 | 0.00000000 | Aries Electronics | 0503 | Bulk | Active | - | Through Hole | SIP | - | 04-0503 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA), Nylon, Glass Filled | UL94 HB | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 4 (1 x 4) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.500" (12.70mm) | - | ||||||
|
32-6552-10 | 13.1180 | |
7797 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 32-6552 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 8 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
 |
16-3513-10 | 2.7300 | |
26 | 0.00000000 | Aries Electronics | Lo-PRO®file, 513 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame | 16-3513 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 20 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 16 (2 x 8) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
 |
24-650000-11-RC | 38.1890 | |
9571 | 0.00000000 | Aries Electronics | Correct-A-Chip® 650000 | Tube | Active | - | Through Hole | - | 24-650 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | A754 | EAR99 | 8536.69.4040 | 20 | - | - | 0.050" (1.27mm) | Gold | - | Gold | 10.0µin (0.25µm) | SOIC | DIP, 0.6" (15.24mm) Row Spacing | 24 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | |||||
|
24-3518-11 | 3.8986 | |
2770 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 24-3518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 16 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
145-PGM15024-40 | 39.4818 | |
9519 | 0.00000000 | Aries Electronics | PGM | Bulk | Active | -55°C ~ 105°C | Through Hole | PGA | - | 145-PGM | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.165" (4.19mm) | - | ||||||
|
21-0503-20 | 9.6900 | |
3402 | 0.00000000 | Aries Electronics | 0503 | Bulk | Active | - | Through Hole | SIP | - | 21-0503 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA), Nylon, Glass Filled | UL94 HB | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 21 (1 x 21) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.360" (9.14mm) | - | ||||||
|
02-0518-10H | 0.3166 | |
7664 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | SIP | Open Frame | 02-0518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 2 (1 x 2) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
15-0513-10H | 2.7472 | |
5774 | 0.00000000 | Aries Electronics | 0513 | Bulk | Active | - | Through Hole | SIP | - | 15-0513 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 15 (1 x 15) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
64-9518-11 | 10.3262 | |
7700 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | DIP, 0.9" (22.86mm) Row Spacing | Open Frame | 64-9518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 64 (2 x 32) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
03-0503-21 | 1.9266 | |
6017 | 0.00000000 | Aries Electronics | 0503 | Bulk | Active | - | Through Hole | SIP | - | 03-0503 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA), Nylon, Glass Filled | UL94 HB | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 3 (1 x 3) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.360" (9.14mm) | - | ||||||
|
16-8990-310C | 10.0717 | |
6317 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame, Elevated | 16-8990 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||||||
|
32-3575-10 | 15.9241 | |
7654 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 32-3575 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 8 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 32 (2 x 16) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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