SIC
close
Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
24-354000-21-RC Aries Electronics 24-354000-21-RC 28.6007
RFQ
ECAD 2305 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 24-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 24 Beryllium Copper 0.050" (1.27mm) Brass 0.089" (2.28mm) -
1109800-12 Aries Electronics 1109800-12 -
RFQ
ECAD 2301 0.00000000 Aries Electronics Correct-A-Chip® 1109800 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Programmable 1109800 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 12 (2 x 6) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
16-3503-31 Aries Electronics 16-3503-31 12.8965
RFQ
ECAD 6386 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 16-3503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.500" (12.70mm) -
16-0501-21 Aries Electronics 16-0501-21 12.0169
RFQ
ECAD 6076 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole SIP - 16-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 16 (1 x 16) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.420" (10.67mm) -
08-0513-10H Aries Electronics 08-0513-10H 1.4585
RFQ
ECAD 9219 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 08-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 8 (1 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
30-6513-10T Aries Electronics 30-6513-10T 3.9592
RFQ
ECAD 9933 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 30-6513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 30 (2 x 15) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
44-6551-16 Aries Electronics 44-6551-16 78.9129
RFQ
ECAD 4426 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 44-6551 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
32-3552-10 Aries Electronics 32-3552-10 13.1180
RFQ
ECAD 2018 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 32-3552 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
48-6553-16 Aries Electronics 48-6553-16 81.4717
RFQ
ECAD 6534 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 48-6553 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
2485-111-13 Aries Electronics 2485-111-13 -
RFQ
ECAD 6344 0.00000000 Aries Electronics - - Active - - - - 2485-11 - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - - - - - - - - -
10-2513-10 Aries Electronics 10-2513-10 1.9900
RFQ
ECAD 60 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 10-2513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected Q3903202 EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
34-7350-10 Aries Electronics 34-7350-10 14.0250
RFQ
ECAD 5092 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 34-7350 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 34 (1 x 34) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
42-3553-10 Aries Electronics 42-3553-10 17.1786
RFQ
ECAD 1846 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 42-3553 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
08-6503-21 Aries Electronics 08-6503-21 6.9852
RFQ
ECAD 4921 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 08-650 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.360" (9.14mm) -
08-7970-10 Aries Electronics 08-7970-10 6.4479
RFQ
ECAD 5788 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 08-7970 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 30 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 8 (1 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
30-3503-31 Aries Electronics 30-3503-31 21.1395
RFQ
ECAD 4820 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 30-3503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 30 (2 x 15) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.500" (12.70mm) -
08-3503-30 Aries Electronics 08-3503-30 3.3532
RFQ
ECAD 4729 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 08-3503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.500" (12.70mm) -
12-0513-11 Aries Electronics 12-0513-11 2.5452
RFQ
ECAD 7625 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 12-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 12 (1 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
34-0501-31 Aries Electronics 34-0501-31 16.0150
RFQ
ECAD 8813 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole SIP - 34-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 34 (1 x 34) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
01-0508-31 Aries Electronics 01-0508-31 0.7999
RFQ
ECAD 5251 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 01-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 - Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 1 (1 x 1) Beryllium Copper - Brass 0.500" (12.70mm) -
44-3553-18 Aries Electronics 44-3553-18 153.9971
RFQ
ECAD 6336 0.00000000 Aries Electronics 55 Bulk Active -55°C ~ 250°C Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 44-3553 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyetheretherketone (PEEK), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 44 (2 x 22) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
09-0513-11H Aries Electronics 09-0513-11H 2.3230
RFQ
ECAD 4609 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 09-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 9 (1 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
10-7475-10 Aries Electronics 10-7475-10 9.1628
RFQ
ECAD 4030 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 10-7475 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 10 (1 x 10) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
40-9503-20 Aries Electronics 40-9503-20 15.7488
RFQ
ECAD 3989 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Closed Frame 40-9503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.360" (9.14mm) -
16-0508-31 Aries Electronics 16-0508-31 11.5260
RFQ
ECAD 2614 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 16-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 16 (1 x 16) Beryllium Copper - Brass 0.500" (12.70mm) -
08-7625-10 Aries Electronics 08-7625-10 6.4479
RFQ
ECAD 1017 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 08-7625 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 30 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 8 (1 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
22-0503-20 Aries Electronics 22-0503-20 10.1444
RFQ
ECAD 7599 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 22-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 22 (1 x 22) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
18-3518-10 Aries Electronics 18-3518-10 1.9900
RFQ
ECAD 631 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 18-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 21 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
16-6501-30 Aries Electronics 16-6501-30 6.3519
RFQ
ECAD 6808 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 16-650 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 22 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
17-0501-21 Aries Electronics 17-0501-21 12.8965
RFQ
ECAD 4754 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole SIP - 17-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 17 (1 x 17) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.420" (10.67mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse