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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
30-0518-11 Aries Electronics 30-0518-11 4.0400
RFQ
ECAD 4042 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 30-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 30 (1 x 30) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
64-9518-10H Aries Electronics 64-9518-10H 13.0844
RFQ
ECAD 8274 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.9" (22.86mm) Row Spacing Open Frame 64-9518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 64 (2 x 32) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
25-0501-31 Aries Electronics 25-0501-31 14.3386
RFQ
ECAD 4809 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole SIP - 25-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 25 (1 x 25) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
14-3508-201 Aries Electronics 14-3508-201 8.1173
RFQ
ECAD 2987 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 14-3508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
16-3518-00 Aries Electronics 16-3518-00 1.8559
RFQ
ECAD 2649 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 16-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 23 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
24-6573-16 Aries Electronics 24-6573-16 34.4582
RFQ
ECAD 2719 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 24-6573 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
14-810-90C Aries Electronics 14-810-90C 11.4400
RFQ
ECAD 120 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Vertical DIP, 0.3" (7.62mm) Row Spacing Closed Frame 14-810 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
08-3518-10M Aries Electronics 08-3518-10M 1.6311
RFQ
ECAD 7645 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 08-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 49 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
101-PLS14030-12 Aries Electronics 101-PLS14030-12 86.4340
RFQ
ECAD 1784 0.00000000 Aries Electronics PLS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 101-PLS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
08-2810-90C Aries Electronics 08-2810-90C 7.0296
RFQ
ECAD 2016 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Vertical DIP, 0.2" (5.08mm) Row Spacing Closed Frame 08-2810 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
35-0501-21 Aries Electronics 35-0501-21 19.1927
RFQ
ECAD 7872 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole SIP - 35-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 35 (1 x 35) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.420" (10.67mm) -
08-7445-10 Aries Electronics 08-7445-10 6.4479
RFQ
ECAD 6561 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 08-7445 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 30 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 8 (1 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
28-536-11 Aries Electronics 28-536-11 -
RFQ
ECAD 7710 0.00000000 Aries Electronics 536 - Obsolete - Through Hole PLCC, ZIF (ZIP) Open Frame - - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) Gold 12.0µin (0.30µm) - - 28 (4 x 7) - - - - -
85-PRS11008-12 Aries Electronics 85-PRS11008-12 77.1100
RFQ
ECAD 3826 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 85-PRS1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
10-7925-10 Aries Electronics 10-7925-10 9.1628
RFQ
ECAD 8431 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 10-7925 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 10 (1 x 10) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
28-3503-20 Aries Electronics 28-3503-20 11.6535
RFQ
ECAD 7557 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 28-3503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.360" (9.14mm) -
01-0518-10H Aries Electronics 01-0518-10H 0.2101
RFQ
ECAD 6936 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 01-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 1 (1 x 1) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
40-6621-30 Aries Electronics 40-6621-30 21.0745
RFQ
ECAD 7128 0.00000000 Aries Electronics 6621 Bulk Active -55°C ~ 105°C Through Hole, Bottom Entry; Through Board DIP, 0.6" (15.24mm) Row Spacing Closed Frame 40-6621 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
1109800-22 Aries Electronics 1109800-22 -
RFQ
ECAD 9873 0.00000000 Aries Electronics Correct-A-Chip® 1109800 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Programmable 1109800 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
36-6574-10 Aries Electronics 36-6574-10 16.1088
RFQ
ECAD 9888 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 36-6574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
10-3513-10 Aries Electronics 10-3513-10 1.9900
RFQ
ECAD 7955 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 10-3513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
14-7350-10 Aries Electronics 14-7350-10 10.7988
RFQ
ECAD 7831 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 14-7350 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 14 (1 x 14) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
24-8600-610C Aries Electronics 24-8600-610C 13.9031
RFQ
ECAD 6927 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 24-8600 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
26-8900-310C Aries Electronics 26-8900-310C 15.0531
RFQ
ECAD 1878 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 26-8900 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 26 (2 x 13) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
24-650000-11-RC Aries Electronics 24-650000-11-RC 38.1890
RFQ
ECAD 9571 0.00000000 Aries Electronics Correct-A-Chip® 650000 Tube Active - Through Hole - 24-650 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected A754 EAR99 8536.69.4040 20 - - 0.050" (1.27mm) Gold - Gold 10.0µin (0.25µm) SOIC DIP, 0.6" (15.24mm) Row Spacing 24 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
84-652000-11-RC Aries Electronics 84-652000-11-RC 68.0957
RFQ
ECAD 3514 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Active - Through Hole - 84-6520 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 84 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
34-0518-10 Aries Electronics 34-0518-10 3.1310
RFQ
ECAD 2798 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 34-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 34 (1 x 34) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
28-6554-11 Aries Electronics 28-6554-11 21.0800
RFQ
ECAD 375 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 28-6554 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold - Gold - 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
19-7400-10 Aries Electronics 19-7400-10 12.7829
RFQ
ECAD 5742 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 19-7400 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 19 (1 x 19) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
32-6508-311 Aries Electronics 32-6508-311 25.7375
RFQ
ECAD 8723 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 32-6508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse