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Sockets for ICs, Transistors(4545)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Type | Features | Base Product Number | Termination | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Current Rating (Amps) | Housing Material | Material Flammability Rating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Convert From (Adapter End) | Convert To (Adapter End) | Number of Pins | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Material - Post | Termination Post Length | Contact Resistance | Board Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
40-8800-610C | 22.1379 |  |
3295 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame, Elevated | 40-8800 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||||||
|
36-6574-10 | 16.1088 | |
9888 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 36-6574 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
34-3503-31 | 23.8722 | |
4165 | 0.00000000 | Aries Electronics | 503 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame | 34-3503 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 34 (2 x 17) | Beryllium Copper | 0.100" (2.54mm) | Phosphor Bronze | 0.500" (12.70mm) | - | ||||||
|
10-2503-20 | 4.2622 | |
4174 | 0.00000000 | Aries Electronics | 503 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.2" (5.08mm) Row Spacing | Closed Frame | 10-2503 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 10 (2 x 5) | Beryllium Copper | 0.100" (2.54mm) | Phosphor Bronze | 0.360" (9.14mm) | - | ||||||
|
16-8800-310C | 10.0717 | |
5474 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame, Elevated | 16-8800 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||||||
|
20-820-90T | 9.2536 | |
4688 | 0.00000000 | Aries Electronics | Vertisockets™ 800 | Bulk | Active | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame | 20-820 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1.5 A | Polyamide (PA46), Nylon 4/6 | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.145" (3.68mm) | - | ||||||
|
42-6575-11 | 31.5623 | |
9740 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 42-6575 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
25-0518-11 | 3.3936 | |
3334 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | SIP | Open Frame | 25-0518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 25 (1 x 25) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
13-0501-30 | 9.1628 | |
5369 | 0.00000000 | Aries Electronics | 501 | Bulk | Active | -55°C ~ 105°C | Through Hole | SIP | - | 13-0501 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 13 (1 x 13) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.690" (17.52mm) | - | ||||||
|
20-3513-10T | 2.3028 | |
7866 | 0.00000000 | Aries Electronics | Lo-PRO®file, 513 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame | 20-3513 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 15 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
42-3575-11 | 31.5623 | |
5199 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 42-3575 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
42-3551-10 | 17.1786 | |
7122 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 42-3551 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
24-C182-11 | 7.5992 | |
7616 | 0.00000000 | Aries Electronics | EJECT-A-DIP™ | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 24-C182 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
16-3518-10E | 5.9489 | |
1092 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 16-3518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 24 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 16 (2 x 8) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
32-6551-16 | 58.3775 | |
3421 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 32-6551 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 8 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
06-6513-10T | 0.9721 | |
5668 | 0.00000000 | Aries Electronics | Lo-PRO®file, 513 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 06-6513 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 6 (2 x 3) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
 |
18-351000-11-RC | 23.7248 | |
9526 | 0.00000000 | Aries Electronics | Correct-A-Chip® 351000 | Tube | Active | - | Through Hole | - | 18-3510 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | A749 | EAR99 | 8536.69.4040 | 21 | - | - | 0.026" (0.65mm) | Gold | - | Gold | 10.0µin (0.25µm) | SSOP | DIP, 0.3" (7.62mm) Row Spacing | 18 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | |||||
|
14-3518-102 | 4.2622 | |
1121 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 14-3518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
40-6518-11 | 6.8125 | |
5534 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 40-6518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 12 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
28-6508-212 | 23.7083 | |
2004 | 0.00000000 | Aries Electronics | 508 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 28-650 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.500" (12.70mm) | - | ||||||
|
04-7950-10 | 5.1429 | |
7752 | 0.00000000 | Aries Electronics | 700 Elevator Strip-Line™ | Bulk | Active | -55°C ~ 105°C | Through Hole | SIP | Elevated | 04-7950 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 60 | 1.5 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 4 (1 x 4) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.150" (3.81mm) | - | ||||||
|
44-305263-20 | - | |
8907 | 0.00000000 | Aries Electronics | Correct-A-Chip® 305263 | Bulk | Active | - | Through Hole | - | 44-3052 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | - | - | 0.024" (0.60mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | QFP | PLCC | 44 | - | 0.050" (1.27mm) | Brass | 0.090" (2.29mm) | FR4 Epoxy Glass | ||||||
|
40-6572-16 | 47.0314 | |
7252 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 40-6572 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
 |
32-6574-11 | 24.6905 | |
9354 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 32-6574 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 10 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
16-6513-10H | 5.6611 | |
7953 | 0.00000000 | Aries Electronics | Lo-PRO®file, 513 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 16-6513 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 16 (2 x 8) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
48-6570-10 | 20.9433 | |
7366 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 48-6570 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
 |
40-9513-10 | 8.7300 | |
4 | 0.00000000 | Aries Electronics | Lo-PRO®file, 513 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.9" (22.86mm) Row Spacing | Closed Frame | 40-9513 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
24-8750-610C | 13.9031 | |
8853 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame, Elevated | 24-8750 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||||||
|
40-3513-10T | 5.3924 | |
4698 | 0.00000000 | Aries Electronics | Lo-PRO®file, 513 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame | 40-3513 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 10 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
42-6570-16 | 55.9738 | |
5300 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 42-6570 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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