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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
69-PLS13112-12 Aries Electronics 69-PLS13112-12 74.3117
RFQ
ECAD 8621 0.00000000 Aries Electronics PLS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 69-PLS1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
20-7415-10 Aries Electronics 20-7415-10 11.5988
RFQ
ECAD 1185 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 20-7415 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
13-0513-10 Aries Electronics 13-0513-10 1.6887
RFQ
ECAD 7587 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 13-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 13 (1 x 13) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
40-6518-10 Aries Electronics 40-6518-10 3.3800
RFQ
ECAD 456 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 40-6518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
18-0513-11 Aries Electronics 18-0513-11 3.1310
RFQ
ECAD 8187 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 18-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 18 (1 x 18) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
36-3572-16 Aries Electronics 36-3572-16 48.8311
RFQ
ECAD 4223 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 36-3572 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
08-7350-10 Aries Electronics 08-7350-10 6.4479
RFQ
ECAD 2846 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 08-7350 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 30 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 8 (1 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
192-PGM17025-11 Aries Electronics 192-PGM17025-11 44.9200
RFQ
ECAD 2335 0.00000000 Aries Electronics PGM Bulk Active -55°C ~ 125°C Through Hole PGA - 192-PGM Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
24-354000-10 Aries Electronics 24-354000-10 28.6007
RFQ
ECAD 1825 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 24-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 24 Beryllium Copper 0.050" (1.27mm) Brass - -
10-7860-10 Aries Electronics 10-7860-10 9.1628
RFQ
ECAD 6130 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 10-7860 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 10 (1 x 10) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
27-0508-21 Aries Electronics 27-0508-21 17.3929
RFQ
ECAD 8663 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 27-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 27 (1 x 27) Beryllium Copper - Brass 0.360" (9.14mm) -
19-0503-30 Aries Electronics 19-0503-30 9.2689
RFQ
ECAD 5820 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 19-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 19 (1 x 19) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
42-6556-11 Aries Electronics 42-6556-11 17.6708
RFQ
ECAD 2019 0.00000000 Aries Electronics 6556 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 42-6556 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
34-6501-21 Aries Electronics 34-6501-21 16.1856
RFQ
ECAD 7169 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 34-6501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 34 (2 x 17) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.410" (10.41mm) -
36-6511-10 Aries Electronics 36-6511-10 5.2965
RFQ
ECAD 5160 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 36-6511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 36 (2 x 18) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
10-1518-11 Aries Electronics 10-1518-11 1.3625
RFQ
ECAD 8024 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 10-1518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
28-6513-11H Aries Electronics 28-6513-11H 9.2900
RFQ
ECAD 3765 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 28-6513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
28-8830-610C Aries Electronics 28-8830-610C 16.0982
RFQ
ECAD 6434 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 28-8830 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
225-PLS18003-12 Aries Electronics 225-PLS18003-12 122.0450
RFQ
ECAD 6308 0.00000000 Aries Electronics PLS - Active - Through Hole PGA, ZIF (ZIP) Closed Frame 225-PLS Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected Q2318793 EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 225 (15 x 15) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
04-7360-10 Aries Electronics 04-7360-10 5.1429
RFQ
ECAD 3480 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 04-7360 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 60 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 4 (1 x 4) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
10-8350-210C Aries Electronics 10-8350-210C -
RFQ
ECAD 3673 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame, Elevated 10-8350 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
13-0518-10T Aries Electronics 13-0518-10T 1.3433
RFQ
ECAD 3177 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 13-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 13 (1 x 13) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
36-6501-31 Aries Electronics 36-6501-31 16.4293
RFQ
ECAD 9420 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 36-6501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 36 (2 x 18) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
23-0517-90C Aries Electronics 23-0517-90C 8.4437
RFQ
ECAD 9078 0.00000000 Aries Electronics 0517 Bulk Active - Through Hole, Right Angle SIP - 23-0517 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 - Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 23 (1 x 23) Beryllium Copper - Brass 0.125" (3.18mm) -
03-0501-30 Aries Electronics 03-0501-30 -
RFQ
ECAD 8555 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 105°C Through Hole SIP - 03-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 3 (1 x 3) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
22-0503-30 Aries Electronics 22-0503-30 10.1444
RFQ
ECAD 6430 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 22-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 22 (1 x 22) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
30-1518-10T Aries Electronics 30-1518-10T 3.0300
RFQ
ECAD 2113 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 30-1518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 30 (2 x 15) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
12-6621-30 Aries Electronics 12-6621-30 11.4715
RFQ
ECAD 3106 0.00000000 Aries Electronics 6621 Bulk Active -55°C ~ 105°C Through Hole, Bottom Entry; Through Board DIP, 0.6" (15.24mm) Row Spacing Closed Frame 12-6621 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 12 (2 x 6) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
24-0513-11 Aries Electronics 24-0513-11 5.3732
RFQ
ECAD 5159 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 24-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 24 (1 x 24) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
27-0511-11 Aries Electronics 27-0511-11 20.6162
RFQ
ECAD 7651 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 125°C Through Hole SIP - 27-0511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 27 (1 x 27) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse