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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
ICO-628-ZMGG Samtec Inc. ICO-628-ZMGG 11.4425
RFQ
ECAD 5785 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-628-ZMGG 16 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
ICA-648-ZSTT Samtec Inc. ICA-648-ZSTT 6.9567
RFQ
ECAD 7771 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-648-ZSTT 9 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
116-87-308-41-018101 Preci-Dip 116-87-308-41-018101 0.5171
RFQ
ECAD 6994 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 53 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
523-13-289-17-000003 Mill-Max Manufacturing Corp. 523-13-289-17-000003 -
RFQ
ECAD 2781 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 289 (17 x 17) - 0.100" (2.54mm) - 0.510" (12.95mm) -
14-8625-610C Aries Electronics 14-8625-610C 9.2536
RFQ
ECAD 2286 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 14-8625 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
0010182031 Molex 0010182031 -
RFQ
ECAD 7089 0.00000000 Molex 4038 - Obsolete - Through Hole Transistor, TO-220 Closed Frame 001018 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 Polyester, Glass Filled - 0.100" (2.54mm) Tin - Tin 100.0µin (2.54µm) 3 (Rectangular) Brass 0.100" (2.54mm) Brass 0.135" (3.43mm) -
38-0518-00 Aries Electronics 38-0518-00 8.0790
RFQ
ECAD 1604 0.00000000 Aries Electronics 518 Bulk Active - Surface Mount SIP Open Frame 38-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 38 (1 x 38) Beryllium Copper 0.100" (2.54mm) Brass 0.046" (1.17mm) -
115-87-324-41-001101 Preci-Dip 115-87-324-41-001101 1.0111
RFQ
ECAD 7622 0.00000000 Preci-Dip 115 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 115-87 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.095" (2.41mm) 10mOhm
524-AG11D-ES TE Connectivity AMP Connectors 524-AG11D-ES -
RFQ
ECAD 7906 0.00000000 TE Connectivity AMP Connectors 500 Bulk Obsolete -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 524 Solder download RoHS non-compliant 1 (Unlimited) Vendor Undefined EAR99 8536.69.4040 500 3 A Polyester UL94 V-0 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead - 24 (2 x 12) Copper Alloy 0.100" (2.54mm) Copper Alloy 0.125" (3.18mm) 10mOhm
D83084B-46 Harwin Inc. D83084B-46 -
RFQ
ECAD 9874 0.00000000 Harwin Inc. D830 Tube Obsolete -50°C ~ 105°C Surface Mount PLCC Board Guide, Closed Frame Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.050" (1.27mm) Tin - Tin - 84 (4 x 21) Phosphor Bronze 0.050" (1.27mm) Phosphor Bronze - 30mOhm
06-3518-10M Aries Electronics 06-3518-10M 1.0605
RFQ
ECAD 9016 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 06-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 66 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
522-93-179-18-117002 Mill-Max Manufacturing Corp. 522-93-179-18-117002 -
RFQ
ECAD 4789 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active - Through Hole PGA - 522-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 179 (18 x 18) - 0.100" (2.54mm) - 0.370" (9.40mm) -
614-93-308-31-012000 Mill-Max Manufacturing Corp. 614-93-308-31-012000 2.6700
RFQ
ECAD 345 0.00000000 Mill-Max Manufacturing Corp. 614 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Carrier, Open Frame 614-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 50 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.136" (3.45mm) -
110-93-952-41-001000 Mill-Max Manufacturing Corp. 110-93-952-41-001000 15.5788
RFQ
ECAD 3772 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Open Frame 110-93 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 52 (2 x 26) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) -
346-93-163-41-013000 Mill-Max Manufacturing Corp. 346-93-163-41-013000 11.0300
RFQ
ECAD 1796 0.00000000 Mill-Max Manufacturing Corp. 346 Bulk Active -55°C ~ 125°C Through Hole SIP - 346-93 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 63 (1 x 63) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.175" (4.45mm) -
7100148803 3M 7100148803 98.3900
RFQ
ECAD 4280 0.00000000 3M - Bulk Active - 19-7100148803 20
22-4518-10 Aries Electronics 22-4518-10 2.8800
RFQ
ECAD 225 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 22-4518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
299-87-316-10-001101 Preci-Dip 299-87-316-10-001101 2.9242
RFQ
ECAD 2291 0.00000000 Preci-Dip 299 Tube Active -55°C ~ 125°C Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 299-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 26 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.128" (3.24mm) 10mOhm
110-83-642-41-105161 Preci-Dip 110-83-642-41-105161 4.2489
RFQ
ECAD 8934 0.00000000 Preci-Dip 110 Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame 110-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Brass 0.118" (3.00mm) 10mOhm
12-0501-30 Aries Electronics 12-0501-30 6.6781
RFQ
ECAD 6908 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 105°C Through Hole SIP - 12-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 12 (1 x 12) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
D3914-42 Harwin Inc. D3914-42 -
RFQ
ECAD 2961 0.00000000 Harwin Inc. D39 Bulk Obsolete -55°C ~ 125°C Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 50 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 196.9µin (5.00µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.126" (3.20mm) 10mOhm
28-6554-10 Aries Electronics 28-6554-10 15.2200
RFQ
ECAD 70 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 28-6554 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
514-AG7D TE Connectivity AMP Connectors 514-AG7D -
RFQ
ECAD 7810 0.00000000 TE Connectivity AMP Connectors - Tube Obsolete - Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 514 Solder - RoHS Compliant 1 (Unlimited) REACH Affected 3-1437531-8 EAR99 8536.69.4040 2,040 - UL94 V-0 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 25.0µin (0.63µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
04-7445-10 Aries Electronics 04-7445-10 5.1429
RFQ
ECAD 4656 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 04-7445 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 60 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 4 (1 x 4) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
116-83-314-41-007101 Preci-Dip 116-83-314-41-007101 1.5484
RFQ
ECAD 3217 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 30 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
510-83-084-11-002101 Preci-Dip 510-83-084-11-002101 4.5932
RFQ
ECAD 8375 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 19 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 84 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
614-87-320-31-012101 Preci-Dip 614-87-320-31-012101 1.3457
RFQ
ECAD 4727 0.00000000 Preci-Dip 614 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Carrier, Open Frame 614-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.136" (3.45mm) 10mOhm
36-6503-20 Aries Electronics 36-6503-20 13.8159
RFQ
ECAD 8808 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 36-6503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.360" (9.14mm) -
1109042 Aries Electronics 1109042 66.0186
RFQ
ECAD 1156 0.00000000 Aries Electronics - - Active - - - - - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - - - - - - - - -
114-87-316-41-134161 Preci-Dip 114-87-316-41-134161 1.3600
RFQ
ECAD 2496 0.00000000 Preci-Dip 114 Tube Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame 114-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 25 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.047" (1.20mm) 10mOhm
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse