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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
02-7520-10 Aries Electronics 02-7520-10 4.3632
RFQ
ECAD 3458 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 02-7520 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 2 (1 x 2) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
242-1293-09-0602J 3M 242-1293-09-0602J 23.7717
RFQ
ECAD 1129 0.00000000 3M Textool™ Tube Active -55°C ~ 125°C Through Hole Closed Frame 242 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 42 Beryllium Copper 0.070" (1.78mm) Beryllium Copper 0.130" (3.30mm) -
DIP328-014BLF Amphenol ICC (FCI) DIP328-014BLF -
RFQ
ECAD 3600 0.00000000 Amphenol ICC (FCI) - Bag Obsolete - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame DIP328 Solder download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1,512 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
523-13-059-11-001001 Mill-Max Manufacturing Corp. 523-13-059-11-001001 -
RFQ
ECAD 4600 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 59 (11 x 11) - 0.100" (2.54mm) - 0.510" (12.95mm) -
546-83-365-17-091147 Preci-Dip 546-83-365-17-091147 41.7362
RFQ
ECAD 5174 0.00000000 Preci-Dip 546 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 546-83 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.050" (1.27mm) Gold 29.5µin (0.75µm) Tin - 365 (17 x 17) Beryllium Copper 0.100" (2.54mm) Bronze 0.098" (2.50mm) 10mOhm
546-87-148-15-063135 Preci-Dip 546-87-148-15-063135 13.6482
RFQ
ECAD 5338 0.00000000 Preci-Dip 546 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 546-87 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.050" (1.27mm) Gold Flash Tin - 148 (15 x 15) Beryllium Copper 0.100" (2.54mm) Bronze 0.098" (2.50mm) 10mOhm
116-87-428-41-009101 Preci-Dip 116-87-428-41-009101 3.1469
RFQ
ECAD 1615 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Elevated, Open Frame 116-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
510-13-056-09-041001 Mill-Max Manufacturing Corp. 510-13-056-09-041001 27.7548
RFQ
ECAD 9493 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 56 (9 x 9) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
25-0503-31 Aries Electronics 25-0503-31 16.6385
RFQ
ECAD 4841 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 25-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 25 (1 x 25) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
20-3513-11H Aries Electronics 20-3513-11H 6.9276
RFQ
ECAD 1658 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 20-3513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
10-9513-10H Aries Electronics 10-9513-10H 4.9510
RFQ
ECAD 6987 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Closed Frame 10-9513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
514-83-360M19-001148 Preci-Dip 514-83-360M19-001148 43.7037
RFQ
ECAD 7655 0.00000000 Preci-Dip 514 Bulk Active -55°C ~ 125°C Surface Mount BGA Open Frame 514-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 21 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 360 (19 x 19) Beryllium Copper 0.100" (2.54mm) Brass 0.055" (1.40mm) 10mOhm
210-44-640-41-001000 Mill-Max Manufacturing Corp. 210-44-640-41-001000 13.1402
RFQ
ECAD 3413 0.00000000 Mill-Max Manufacturing Corp. 210 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 210-44 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
614-91-324-31-018000 Mill-Max Manufacturing Corp. 614-91-324-31-018000 15.6109
RFQ
ECAD 6615 0.00000000 Mill-Max Manufacturing Corp. 614 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Carrier, Open Frame 614-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
514-83-078-13-061117 Preci-Dip 514-83-078-13-061117 9.2277
RFQ
ECAD 4006 0.00000000 Preci-Dip 514 Bulk Active -55°C ~ 125°C Surface Mount PGA Open Frame 514-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 78 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass 0.055" (1.40mm) 10mOhm
523-93-132-14-071001 Mill-Max Manufacturing Corp. 523-93-132-14-071001 -
RFQ
ECAD 3186 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 523-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 132 (14 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.510" (12.95mm) -
511-91-145-15-002001 Mill-Max Manufacturing Corp. 511-91-145-15-002001 -
RFQ
ECAD 2121 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 145 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
511-93-081-12-071003 Mill-Max Manufacturing Corp. 511-93-081-12-071003 -
RFQ
ECAD 4556 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 81 (12 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
16-350000-10-HT Aries Electronics 16-350000-10-HT 17.6546
RFQ
ECAD 6655 0.00000000 Aries Electronics Correct-A-Chip® 350000 Bulk Active - Through Hole - 16-3500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 24 - - 0.050" (1.27mm) Tin - Tin-Lead 200.0µin (5.08µm) SOIC DIP, 0.3" (7.62mm) Row Spacing 16 - 0.100" (2.54mm) Brass 0.125" (3.18mm) Polyimide (PI)
1640258-9 TE Connectivity AMP Connectors 1640258-9 -
RFQ
ECAD 2248 0.00000000 TE Connectivity AMP Connectors - - Obsolete - Surface Mount PGA Closed Frame 1640258 Solder - Not applicable 1 (Unlimited) Vendor Undefined EAR99 8536.69.4040 1 Polyamide (PA), Nylon UL94 V-0 0.039" (1.00mm) Gold - Gold - 576 (24 x 24) - 0.039" (1.00mm) - - -
116-87-320-41-012101 Preci-Dip 116-87-320-41-012101 2.0904
RFQ
ECAD 2775 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 21 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
511-13-144-15-082002 Mill-Max Manufacturing Corp. 511-13-144-15-082002 -
RFQ
ECAD 5548 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 144 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
2-2129710-6 TE Connectivity AMP Connectors 2-2129710-6 36.6600
RFQ
ECAD 1 0.00000000 TE Connectivity AMP Connectors - Tray Active - Surface Mount LGA Open Frame 2129710 Solder download ROHS3 Compliant Not Applicable Vendor Undefined EAR99 8536.69.4040 12 0.5 A Thermoplastic UL94 V-0 - Gold 30.0µin (0.76µm) - - 3647 Copper Alloy - Copper Alloy - -
116-93-964-41-001000 Mill-Max Manufacturing Corp. 116-93-964-41-001000 26.8548
RFQ
ECAD 2443 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Elevated, Open Frame 116-93 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 64 (2 x 32) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) -
8059-2G2 TE Connectivity AMP Connectors 8059-2G2 -
RFQ
ECAD 2317 0.00000000 TE Connectivity AMP Connectors 8059 Bulk Obsolete -55°C ~ 125°C Through Hole Transistor, TO-5 - 8059 Solder download RoHS non-compliant 1 (Unlimited) Vendor Undefined EAR99 8536.69.4020 100 3 A Polyamide (PA), Nylon - - Gold - Gold - 3 (Round) Copper Alloy - Copper Alloy 0.115" (2.92mm) 20mOhm
324-93-164-41-002000 Mill-Max Manufacturing Corp. 324-93-164-41-002000 27.2184
RFQ
ECAD 3300 0.00000000 Mill-Max Manufacturing Corp. 324 Tube Active -55°C ~ 125°C Through Hole SIP - 324-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 3 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 64 (1 x 64) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.630" (16.00mm) -
SIP050-1X16-160BLF Amphenol ICC (FCI) SIP050-1X16-160BLF -
RFQ
ECAD 3636 0.00000000 Amphenol ICC (FCI) SIP050-1x Bulk Obsolete - Through Hole SIP Closed Frame SIP050 Solder download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 750 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 16 (1 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.095" (2.41mm) -
44-6551-16 Aries Electronics 44-6551-16 78.9129
RFQ
ECAD 4426 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 44-6551 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
110-83-322-41-105101 Preci-Dip 110-83-322-41-105101 1.7251
RFQ
ECAD 4134 0.00000000 Preci-Dip 110 Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame 110-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 18 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.118" (3.00mm) 10mOhm
40-C212-11 Aries Electronics 40-C212-11 11.4170
RFQ
ECAD 6709 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 40-C212 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse