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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
510-91-361-19-000003 Mill-Max Manufacturing Corp. 510-91-361-19-000003 44.4944
RFQ
ECAD 9564 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 510-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 361 (19 x 19) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
511-93-084-13-081003 Mill-Max Manufacturing Corp. 511-93-084-13-081003 -
RFQ
ECAD 1011 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 84 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
04-0511-10 Aries Electronics 04-0511-10 2.5452
RFQ
ECAD 8813 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 105°C Through Hole SIP - 04-0511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 45 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 50.0µin (1.27µm) 4 (1 x 4) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
APA-624-T-M Samtec Inc. APA-624-T-M 7.1089
RFQ
ECAD 6170 0.00000000 Samtec Inc. APA Tube Active - Through Hole - Open Frame APA-624 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 18 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 24 (2 x 12) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
110-47-318-41-001000 Mill-Max Manufacturing Corp. 110-47-318-41-001000 1.4400
RFQ
ECAD 522 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 110-47 Solder download ROHS3 Compliant Not Applicable REACH Unaffected ED11087 EAR99 8536.69.4040 22 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold Flash Tin 200.0µin (5.08µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) -
515-13-114-13-062003 Mill-Max Manufacturing Corp. 515-13-114-13-062003 -
RFQ
ECAD 9509 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 114 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
20-0518-00 Aries Electronics 20-0518-00 4.8000
RFQ
ECAD 10 0.00000000 Aries Electronics 518 Bulk Active - Surface Mount SIP Open Frame 20-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.046" (1.17mm) -
115-44-650-41-003000 Mill-Max Manufacturing Corp. 115-44-650-41-003000 15.2555
RFQ
ECAD 5464 0.00000000 Mill-Max Manufacturing Corp. 115 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 115-44 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 200.0µin (5.08µm) 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.095" (2.41mm) 10mOhm
510-13-084-11-041003 Mill-Max Manufacturing Corp. 510-13-084-11-041003 32.5422
RFQ
ECAD 3549 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 84 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
26-0518-10H Aries Electronics 26-0518-10H 2.8886
RFQ
ECAD 4814 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 26-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 26 (1 x 26) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
511-91-025-05-000002 Mill-Max Manufacturing Corp. 511-91-025-05-000002 -
RFQ
ECAD 9203 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 511-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 25 (5 x 5) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
116-83-632-41-006101 Preci-Dip 116-83-632-41-006101 3.1916
RFQ
ECAD 8455 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 13 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
110-83-640-41-105101 Preci-Dip 110-83-640-41-105101 3.8221
RFQ
ECAD 5167 0.00000000 Preci-Dip 110 Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame 110-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.118" (3.00mm) 10mOhm
8444-21B1-RK-TR 3M 8444-21B1-RK-TR 2.6600
RFQ
ECAD 8 0.00000000 3M 8400 Tape & Reel (TR) Active -40°C ~ 105°C Surface Mount PLCC Closed Frame 8444 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 360 1 A Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.050" (1.27mm) Tin 160.0µin (4.06µm) Tin 160.0µin (4.06µm) 44 (4 x 11) Copper Alloy 0.050" (1.27mm) Copper Alloy 0.132" (3.35mm) 15mOhm
44-6571-16 Aries Electronics 44-6571-16 58.6350
RFQ
ECAD 2137 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 44-6571 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 44 (2 x 22) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
515-91-181-15-041001 Mill-Max Manufacturing Corp. 515-91-181-15-041001 -
RFQ
ECAD 5193 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 181 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
515-91-085-10-031003 Mill-Max Manufacturing Corp. 515-91-085-10-031003 -
RFQ
ECAD 8469 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 85 (10 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
522-93-100-10-000002 Mill-Max Manufacturing Corp. 522-93-100-10-000002 -
RFQ
ECAD 8034 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 522-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 100 (10 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
116-83-320-41-001101 Preci-Dip 116-83-320-41-001101 2.6890
RFQ
ECAD 8693 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 21 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
714-43-232-31-018000 Mill-Max Manufacturing Corp. 714-43-232-31-018000 9.5300
RFQ
ECAD 2339 0.00000000 Mill-Max Manufacturing Corp. 714 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.1" (2.54mm) Row Spacing Carrier, Closed Frame 714-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected ED1307-32 EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) -
116-83-322-41-013101 Preci-Dip 116-83-322-41-013101 5.9531
RFQ
ECAD 4884 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 19 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
523-13-223-18-098002 Mill-Max Manufacturing Corp. 523-13-223-18-098002 -
RFQ
ECAD 5496 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 223 (18 x 18) - 0.100" (2.54mm) - 0.510" (12.95mm) -
614-13-144-15-082012 Mill-Max Manufacturing Corp. 614-13-144-15-082012 -
RFQ
ECAD 2436 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 144 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.136" (3.45mm) 10mOhm
146-83-322-41-035101 Preci-Dip 146-83-322-41-035101 2.5125
RFQ
ECAD 7323 0.00000000 Preci-Dip 146 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 146-83 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 18 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.150" (3.81mm) 10mOhm
216-3340-19-0602J 3M 216-3340-19-0602J 32.5200
RFQ
ECAD 27 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 216 Wire Wrap download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing 16 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.620" (15.75mm) -
40-3552-18 Aries Electronics 40-3552-18 140.2957
RFQ
ECAD 5147 0.00000000 Aries Electronics 55 Bulk Active -55°C ~ 250°C Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 40-3552 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyetheretherketone (PEEK), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
114-83-306-41-117101 Preci-Dip 114-83-306-41-117101 0.3874
RFQ
ECAD 2575 0.00000000 Preci-Dip 114 Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame 114-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 69 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass 0.047" (1.20mm) 10mOhm
20-PLS13120-12 Aries Electronics 20-PLS13120-12 65.5557
RFQ
ECAD 6852 0.00000000 Aries Electronics PLS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 20-PLS1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
714-43-230-31-018000 Mill-Max Manufacturing Corp. 714-43-230-31-018000 8.9300
RFQ
ECAD 3054 0.00000000 Mill-Max Manufacturing Corp. 714 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.1" (2.54mm) Row Spacing Carrier, Closed Frame 714-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected ED1307-30 EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 30 (2 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) -
612-83-950-41-001101 Preci-Dip 612-83-950-41-001101 6.0105
RFQ
ECAD 9630 0.00000000 Preci-Dip 612 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Carrier, Open Frame 612-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass 0.291" (7.39mm) 10mOhm
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse