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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Color Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status ECCN HTSUS Standard Package Connector Type Pitch Number of Rows Row Spacing Contact Finish Contact Finish Thickness Current Rating (Amps) Housing Material Material Flammability Rating Contact Type Pitch - Mating Number of Positions Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
12-350000-10-HT Aries Electronics 12-350000-10-HT 17.6546
RFQ
ECAD 7501 0.00000000 Aries Electronics Correct-A-Chip® 350000 Bulk Active - Through Hole - 12-3500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) Tin - Tin-Lead 200.0µin (5.08µm) SOIC DIP, 0.3" (7.62mm) Row Spacing 12 - 0.100" (2.54mm) Brass 0.125" (3.18mm) Polyimide (PI)
39-0518-11H Aries Electronics 39-0518-11H 9.4606
RFQ
ECAD 7630 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 39-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 39 (1 x 39) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
06-6503-30 Aries Electronics 06-6503-30 3.4138
RFQ
ECAD 9193 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 06-650 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.500" (12.70mm) -
36-6501-30 Aries Electronics 36-6501-30 9.1808
RFQ
ECAD 9571 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 36-6501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 36 (2 x 18) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
30-6822-90C Aries Electronics 30-6822-90C 13.3282
RFQ
ECAD 7670 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.6" (15.24mm) Row Spacing Closed Frame 30-6822 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 30 (2 x 15) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
121-PRS13013-12 Aries Electronics 121-PRS13013-12 83.4633
RFQ
ECAD 9174 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 121-PRS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
02-3625-71 Aries Electronics 02-3625-71 1.6887
RFQ
ECAD 1498 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 02-3625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header - 2 0.300" (7.62mm) Gold 10.0µin (0.25µm) Post 2
48-3572-10 Aries Electronics 48-3572-10 20.9433
RFQ
ECAD 4948 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 48-3572 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
18-81000-310C Aries Electronics 18-81000-310C 11.4353
RFQ
ECAD 2591 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 18-810 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
02-0625-51 Aries Electronics 02-0625-51 1.8736
RFQ
ECAD 2826 0.00000000 Aries Electronics 0625 Bulk Active Through Hole - 02-0625 Black Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Header Strip 0.100" (2.54mm) 1 - Gold 10.0µin (0.25µm) Forked 2
48-3551-16 Aries Electronics 48-3551-16 81.4717
RFQ
ECAD 3284 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 48-3551 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
34-3513-11H Aries Electronics 34-3513-11H 14.2168
RFQ
ECAD 7597 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 34-3513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 34 (2 x 17) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
08-810-90C Aries Electronics 08-810-90C 6.8891
RFQ
ECAD 7801 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Vertical DIP, 0.3" (7.62mm) Row Spacing Closed Frame 08-810 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
01-0625-51 Aries Electronics 01-0625-51 1.1322
RFQ
ECAD 2473 0.00000000 Aries Electronics 0625 Bulk Active Through Hole - 01-0625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Header Strip - 1 - Gold 10.0µin (0.25µm) Forked 1
44-3575-11 Aries Electronics 44-3575-11 32.6262
RFQ
ECAD 7755 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 44-3575 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
68-PRS11033-16 Aries Electronics 68-PRS11033-16 -
RFQ
ECAD 9681 0.00000000 Aries Electronics PRS Bulk Obsolete -65°C ~ 200°C Through Hole PGA, ZIF (ZIP) Closed Frame Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze 50.0µin (1.27µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
28-C182-00 Aries Electronics 28-C182-00 12.8587
RFQ
ECAD 9875 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 105°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Closed Frame 28-C182 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.040" (1.02mm) -
02-6625-71 Aries Electronics 02-6625-71 2.4038
RFQ
ECAD 1013 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 02-6625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header - 2 0.600" (15.24mm) Gold 10.0µin (0.25µm) Post 2
19-0511-10 Aries Electronics 19-0511-10 6.5958
RFQ
ECAD 9006 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 105°C Through Hole SIP - 19-0511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 50.0µin (1.27µm) 19 (1 x 19) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
18-81180-610C Aries Electronics 18-81180-610C 11.6535
RFQ
ECAD 7268 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 18-8118 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
07-0517-90C Aries Electronics 07-0517-90C 2.4442
RFQ
ECAD 8368 0.00000000 Aries Electronics 0517 Bulk Active - Through Hole, Right Angle SIP - 07-0517 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 - Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 7 (1 x 7) Beryllium Copper - Brass 0.125" (3.18mm) -
14-820-90T Aries Electronics 14-820-90T 8.9400
RFQ
ECAD 300 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 14-820 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
35-0511-10 Aries Electronics 35-0511-10 8.0407
RFQ
ECAD 4839 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 105°C Through Hole SIP - 35-0511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 50.0µin (1.27µm) 35 (1 x 35) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
38-3625-51 Aries Electronics 38-3625-51 36.2583
RFQ
ECAD 9693 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 38-3625 Black Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.300" (7.62mm) Gold 10.0µin (0.25µm) Forked 38
17-0625-11 Aries Electronics 17-0625-11 9.4990
RFQ
ECAD 6485 0.00000000 Aries Electronics 0625 Bulk Active Through Hole - 17-0625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Header Strip 0.100" (2.54mm) 1 - Gold 10.0µin (0.25µm) Forked 17
34-3625-10 Aries Electronics 34-3625-10 12.6882
RFQ
ECAD 7771 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 34-3625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.300" (7.62mm) Tin 200.0µin (5.08µm) Forked 34
80-PRL15072-12 Aries Electronics 80-PRL15072-12 -
RFQ
ECAD 7165 0.00000000 Aries Electronics PRL Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 80-PRL1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
20-6625-71 Aries Electronics 20-6625-71 9.5182
RFQ
ECAD 4454 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 20-6625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.600" (15.24mm) Gold 10.0µin (0.25µm) Post 20
14-35W000-11-RC Aries Electronics 14-35W000-11-RC -
RFQ
ECAD 2907 0.00000000 Aries Electronics Correct-A-Chip® 35W000 Bulk Active - Through Hole - 14-35W0 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 27 - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) SOIC-W DIP, 0.3" (7.62mm) Row Spacing 14 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
32-3571-16 Aries Electronics 32-3571-16 39.7994
RFQ
ECAD 5260 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 32-3571 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse