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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Color Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status ECCN HTSUS Standard Package Connector Type Pitch Number of Rows Row Spacing Contact Finish Contact Finish Thickness Current Rating (Amps) Housing Material Material Flammability Rating Contact Type Pitch - Mating Number of Positions Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
25-0600-11 Aries Electronics 25-0600-11 3.9996
RFQ
ECAD 9953 0.00000000 Aries Electronics 0600 Bulk Active Through Hole - 25-0600 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 1 - Gold 10.0µin (0.25µm) Forked 25
48-6625-11 Aries Electronics 48-6625-11 20.1252
RFQ
ECAD 5736 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 48-6625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.600" (15.24mm) Gold 10.0µin (0.25µm) Forked 48
18-8560-610C Aries Electronics 18-8560-610C 11.6535
RFQ
ECAD 8167 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 18-8560 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
12-1518-11 Aries Electronics 12-1518-11 1.6312
RFQ
ECAD 3899 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 12-1518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 12 (2 x 6) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
42-6554-18 Aries Electronics 42-6554-18 147.1471
RFQ
ECAD 6173 0.00000000 Aries Electronics 55 Bulk Active -55°C ~ 250°C Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 42-6554 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyetheretherketone (PEEK), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 42 (2 x 21) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
05-0518-11H Aries Electronics 05-0518-11H 1.2282
RFQ
ECAD 6608 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 05-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 5 (1 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
07-0503-30 Aries Electronics 07-0503-30 3.2320
RFQ
ECAD 2139 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 07-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 7 (1 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
16-0518-10H Aries Electronics 16-0518-10H 1.7271
RFQ
ECAD 9486 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 16-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 16 (1 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
24-C300-00 Aries Electronics 24-C300-00 11.2717
RFQ
ECAD 7174 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 105°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Closed Frame 24-C300 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.040" (1.02mm) -
06-3518-10 Aries Electronics 06-3518-10 0.7272
RFQ
ECAD 9873 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 06-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 66 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
28-820-90C Aries Electronics 28-820-90C 13.5403
RFQ
ECAD 6695 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 28-820 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
12-8510-310C Aries Electronics 12-8510-310C 8.4437
RFQ
ECAD 4501 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 12-8510 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 12 (2 x 6) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
38-6625-51 Aries Electronics 38-6625-51 32.9039
RFQ
ECAD 2425 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 38-6625 Black Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.600" (15.24mm) Gold 10.0µin (0.25µm) Forked 38
06-0625-70 Aries Electronics 06-0625-70 2.2220
RFQ
ECAD 5400 0.00000000 Aries Electronics 0625 Bulk Active Through Hole - 06-0625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Header Strip 0.100" (2.54mm) 1 - Tin 200.0µin (5.08µm) Post 6
32-C300-10 Aries Electronics 32-C300-10 6.7165
RFQ
ECAD 1638 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 32-C300 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
19-0600-20 Aries Electronics 19-0600-20 2.5048
RFQ
ECAD 1016 0.00000000 Aries Electronics 0600 Bulk Active Through Hole - 19-0600 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 SIP, SIL - Header 0.100" (2.54mm) 1 - Tin 200.0µin (5.08µm) Post 19
30-820-90C Aries Electronics 30-820-90C 13.0478
RFQ
ECAD 2880 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 30-820 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 30 (2 x 15) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
28-6575-18 Aries Electronics 28-6575-18 128.2422
RFQ
ECAD 5616 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 28-6575 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
08-6503-20 Aries Electronics 08-6503-20 3.9390
RFQ
ECAD 2595 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 08-650 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.360" (9.14mm) -
38-6511-10 Aries Electronics 38-6511-10 5.5651
RFQ
ECAD 3137 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 38-6511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 38 (2 x 19) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
04-0625-31 Aries Electronics 04-0625-31 2.3432
RFQ
ECAD 6347 0.00000000 Aries Electronics 0625 Bulk Active Through Hole - 04-0625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Header Strip 0.100" (2.54mm) 1 - Gold 10.0µin (0.25µm) Solder Cup 4
16-C280-20 Aries Electronics 16-C280-20 12.8776
RFQ
ECAD 6428 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 16-C280 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.040" (1.02mm) -
32-6575-16 Aries Electronics 32-6575-16 40.1775
RFQ
ECAD 9319 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 32-6575 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
40-3553-18 Aries Electronics 40-3553-18 140.2957
RFQ
ECAD 1028 0.00000000 Aries Electronics 55 Bulk Active -55°C ~ 250°C Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 40-3553 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyetheretherketone (PEEK), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
16-3518-112 Aries Electronics 16-3518-112 5.7762
RFQ
ECAD 9451 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 16-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
48-6625-71 Aries Electronics 48-6625-71 18.8327
RFQ
ECAD 7857 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 48-6625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.600" (15.24mm) Gold 10.0µin (0.25µm) Post 48
225-PGM15001-10 Aries Electronics 225-PGM15001-10 22.9561
RFQ
ECAD 2332 0.00000000 Aries Electronics PGM Bulk Active -55°C ~ 105°C Through Hole PGA - 225-PGM Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
32-3553-10 Aries Electronics 32-3553-10 13.1180
RFQ
ECAD 3839 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 32-3553 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
19-0513-11 Aries Electronics 19-0513-11 3.9390
RFQ
ECAD 9252 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 19-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 19 (1 x 19) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
1107254-16 Aries Electronics 1107254-16 9.2111
RFQ
ECAD 7935 0.00000000 Aries Electronics Correct-A-Chip® 1107254 Bulk Active - Through Hole - 1107254 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing 16 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse