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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Color Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status ECCN HTSUS Standard Package Connector Type Pitch Number of Rows Row Spacing Contact Finish Contact Finish Thickness Current Rating (Amps) Housing Material Material Flammability Rating Contact Type Pitch - Mating Number of Positions Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
40-3552-18 Aries Electronics 40-3552-18 140.2957
RFQ
ECAD 5147 0.00000000 Aries Electronics 55 Bulk Active -55°C ~ 250°C Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 40-3552 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyetheretherketone (PEEK), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
20-PLS13120-12 Aries Electronics 20-PLS13120-12 65.5557
RFQ
ECAD 6852 0.00000000 Aries Electronics PLS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 20-PLS1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
30-0508-21 Aries Electronics 30-0508-21 19.3073
RFQ
ECAD 8662 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole SIP - 30-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 30 (1 x 30) Beryllium Copper - Brass 0.360" (9.14mm) -
16-8250-310C Aries Electronics 16-8250-310C 10.0717
RFQ
ECAD 1367 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 16-8250 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
20-7712-10 Aries Electronics 20-7712-10 11.5988
RFQ
ECAD 5723 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 20-7712 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
36-6823-90 Aries Electronics 36-6823-90 15.7488
RFQ
ECAD 1583 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Horizontal DIP, 0.6" (15.24mm) Row Spacing Closed Frame 36-6823 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 36 (2 x 18) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
02-7400-11 Aries Electronics 02-7400-11 4.4238
RFQ
ECAD 7490 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 125°C Through Hole SIP Elevated 02-7400 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 2 (1 x 2) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
06-3508-21 Aries Electronics 06-3508-21 7.4842
RFQ
ECAD 7858 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 06-3508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
95-132I25-P Aries Electronics 95-132I25-P -
RFQ
ECAD 8986 0.00000000 Aries Electronics Correct-A-Chip® 95-132I25 Bulk Discontinued at SIC - Through Hole - 95-132I Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 42 - - 0.025" (0.64mm) Tin - Tin-Lead 200.0µin (5.08µm) QFP PGA 132 Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
12-350000-10-HT Aries Electronics 12-350000-10-HT 17.6546
RFQ
ECAD 7501 0.00000000 Aries Electronics Correct-A-Chip® 350000 Bulk Active - Through Hole - 12-3500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) Tin - Tin-Lead 200.0µin (5.08µm) SOIC DIP, 0.3" (7.62mm) Row Spacing 12 - 0.100" (2.54mm) Brass 0.125" (3.18mm) Polyimide (PI)
25-0508-20 Aries Electronics 25-0508-20 9.3808
RFQ
ECAD 4693 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole SIP - 25-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 25 (1 x 25) Beryllium Copper - Brass 0.360" (9.14mm) -
20-PRS13120-12 Aries Electronics 20-PRS13120-12 65.5557
RFQ
ECAD 4099 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 20-PRS1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
34-6621-30 Aries Electronics 34-6621-30 19.0618
RFQ
ECAD 1691 0.00000000 Aries Electronics 6621 Bulk Active -55°C ~ 105°C Through Hole, Bottom Entry; Through Board DIP, 0.6" (15.24mm) Row Spacing Closed Frame 34-6621 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 34 (2 x 17) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
14-8275-310C Aries Electronics 14-8275-310C 9.4798
RFQ
ECAD 9526 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 14-8275 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
40-6570-10 Aries Electronics 40-6570-10 17.8346
RFQ
ECAD 9682 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 40-6570 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
04-3625-11 Aries Electronics 04-3625-11 -
RFQ
ECAD 5287 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 04-3625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.300" (7.62mm) Gold 10.0µin (0.25µm) Forked 4
15-7500-10 Aries Electronics 15-7500-10 11.0898
RFQ
ECAD 5095 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 15-7500 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 15 (1 x 15) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
24-4508-31 Aries Electronics 24-4508-31 24.1665
RFQ
ECAD 1591 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 24-4508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse