SIC
close
Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Accessory Type For Use With/Related Products Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Number of Positions Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
34-81250-610C Aries Electronics 34-81250-610C 17.9983
RFQ
ECAD 7238 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 34-8125 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 34 (2 x 17) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
24-8600-310C Aries Electronics 24-8600-310C 14.1819
RFQ
ECAD 3944 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 24-8600 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
20-81000-310C Aries Electronics 20-81000-310C 12.7829
RFQ
ECAD 1384 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 20-8100 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
24-6503-21 Aries Electronics 24-6503-21 17.0565
RFQ
ECAD 6594 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 24-650 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.360" (9.14mm) -
18-8545-310C Aries Electronics 18-8545-310C 11.4353
RFQ
ECAD 6367 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 18-8545 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
36-8750-310C Aries Electronics 36-8750-310C 18.9964
RFQ
ECAD 2840 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 36-8750 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
40-3551-16 Aries Electronics 40-3551-16 68.9886
RFQ
ECAD 2523 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 40-3551 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
6-513-10 Aries Electronics 6-513-10 -
RFQ
ECAD 4854 0.00000000 Aries Electronics 0513 Bulk Obsolete - Through Hole SIP - Solder download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8536.69.4040 60 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 6 (1 x 6) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
18-8470-610C Aries Electronics 18-8470-610C 11.6535
RFQ
ECAD 6738 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 18-8470 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
10-8440-610C Aries Electronics 10-8440-610C 7.5033
RFQ
ECAD 7813 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 10-8440 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
28-6551-11 Aries Electronics 28-6551-11 17.6589
RFQ
ECAD 7497 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 28-6551 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold - Gold - 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
22-0508-30 Aries Electronics 22-0508-30 8.7507
RFQ
ECAD 5982 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole SIP - 22-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 22 (1 x 22) Beryllium Copper - Brass 0.500" (12.70mm) -
24-8844-310C Aries Electronics 24-8844-310C 14.1819
RFQ
ECAD 3535 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 24-8844 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
18-6810-90T Aries Electronics 18-6810-90T 14.2200
RFQ
ECAD 94 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Vertical DIP, 0.6" (15.24mm) Row Spacing Closed Frame 18-6810 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 18 (2 x 9) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
40-6575-10 Aries Electronics 40-6575-10 17.0639
RFQ
ECAD 3076 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 40-6575 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
24-1508-20 Aries Electronics 24-1508-20 9.5182
RFQ
ECAD 3469 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 24-1508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
20-8375-310C Aries Electronics 20-8375-310C 12.7829
RFQ
ECAD 4613 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 20-8375 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
32-655000-10 Aries Electronics 32-655000-10 38.0087
RFQ
ECAD 7175 0.00000000 Aries Electronics Correct-A-Chip® 655000 Bulk Active - Through Hole - 32-6550 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 - - 0.020" (0.50mm) Silver - Tin-Lead 200.0µin (5.08µm) TSOP DIP, 0.6" (15.24mm) Row Spacing 32 Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
09-0503-30 Aries Electronics 09-0503-30 4.1208
RFQ
ECAD 1860 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 09-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 9 (1 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
18-1508-31 Aries Electronics 18-1508-31 13.5214
RFQ
ECAD 2516 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 18-1508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
20-0508-31 Aries Electronics 20-0508-31 13.7638
RFQ
ECAD 2744 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 20-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 20 (1 x 20) Beryllium Copper - Brass 0.500" (12.70mm) -
10-1508-31 Aries Electronics 10-1508-31 7.6952
RFQ
ECAD 8562 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 10-1508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
14-1508-20 Aries Electronics 14-1508-20 5.6419
RFQ
ECAD 5125 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 14-1508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
16-650-20 Aries Electronics 16-650-20 2.4846
RFQ
ECAD 9279 0.00000000 Aries Electronics 650 Bulk Active - 16-650 Cap (Cover) 0600 Series Header download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8538.90.8180 1 16
18-3508-202 Aries Electronics 18-3508-202 10.3625
RFQ
ECAD 4809 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 18-3508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
1107254-18 Aries Electronics 1107254-18 9.7264
RFQ
ECAD 1441 0.00000000 Aries Electronics Correct-A-Chip® 1107254 Bulk Active - Through Hole - 1107254 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing 18 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
40-0518-10H Aries Electronics 40-0518-10H 3.8380
RFQ
ECAD 3360 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 40-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 40 (1 x 40) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
24-3570-11 Aries Electronics 24-3570-11 20.3546
RFQ
ECAD 2958 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 24-3570 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
42-6554-16 Aries Electronics 42-6554-16 75.3414
RFQ
ECAD 5449 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 42-6554 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
20-6503-20 Aries Electronics 20-6503-20 9.1345
RFQ
ECAD 9016 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 20-650 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.360" (9.14mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse