Tel: +86-0755-83501315
Email: sales@sic-components.com
Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
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S00005-02 | - | ![]() |
5503 | 0.00000000 | Trenz Electronic GmbH | * | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-S00005-02 | 1 | ||||||||||||||
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TE0745-02-81C11-AK | - | ![]() |
7747 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-81C11-AK | OBSOLETE | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7035) | Board-to-Board (BTB) Socket - 480 | ||||
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SM-K26-XCL2GC | 422.5000 | ![]() |
180 | 0.00000000 | AMD | Zynq® UltraScale+™ Kria™ | Box | Active | 0°C ~ 85°C (TJ) | 3.030" L x 2.360" W (77.00mm x 60.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 122-SM-K26-XCL2GC | 5A992C | 8471.50.0150 | 1 | ARM® Cortex®-A53 | 533MHz, 1.333GHz | 4GB | 16GB eMMC, 64MB QSPI | FPGA Core | Arm® Cortex®-R5F | 2 x 240 Pin | |||
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TE0803-04-3AE11-A | 455.7000 | ![]() |
3521 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-3AE11-A | 1 | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
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OLPY001 | 32.7300 | ![]() |
2983 | 0.00000000 | Optimuslogic | - | Bag | Active | - | - | download | 1 (Unlimited) | REACH Unaffected | 3397-OLPY001 | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-M4F | 80MHz | 512KB | 2MB (NOR) | MCU, FPGA | - | 64-BGA, Pin(s) | |||
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MYC-Y6ULY2-V2-256N256D-50-I | 33.0000 | ![]() |
5 | 0.00000000 | MYIR Tech Limited | - | Box | Active | -40°C ~ 85°C | 1.540" L x 1.460" W (39.00mm x 37.00mm) | download | ROHS3 Compliant | 3309-MYC-Y6ULY2-V2-256N256D-50-I | 1 | MCIMX6Y2DVM05A | 528MHz | 256MB | 256MB | MPU Core | - | Header | ||||||
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MYC-Y6ULY2-V2-4E512D-50-I | 42.0000 | ![]() |
3 | 0.00000000 | MYIR Tech Limited | - | Box | Active | -40°C ~ 85°C | 1.540" L x 1.460" W (39.00mm x 37.00mm) | download | ROHS3 Compliant | 3309-MYC-Y6ULY2-V2-4E512D-50-I | 5A002A | 8542.31.0001 | 1 | MCIMX6Y2DVM05A | 528MHz | 512MB | 4GB | MPU Core | - | Header | ||||
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TE0720-03-S003C1 | - | ![]() |
5124 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-S003C1 | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | |||||
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TE0720-03-S002 | - | ![]() |
2053 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | - | - | - | Not Applicable | 1686-TE0720-03-S002 | OBSOLETE | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | |||||
TE0720-03-61Q33ML | - | ![]() |
7953 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-61Q33ML | 1 | ARM Cortex-A9 | - | 1GB | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||||||
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TE0720-03-S001C1 | - | ![]() |
6163 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | - | - | - | Not Applicable | 1686-TE0720-03-S001C1 | OBSOLETE | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | |||||
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TE0820-04-50121FA | - | ![]() |
6439 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-50121FA | OBSOLETE | 1 | - | - | - | - | - | - | |||||
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TE0820-04-SDR21FA | - | ![]() |
5988 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-SDR21FA | OBSOLETE | 1 | - | - | - | - | - | - | |||||
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TE0820-04-2BI21FL | - | ![]() |
2017 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2BI21FL | OBSOLETE | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784I | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||
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TE0820-04-2BI21M | - | ![]() |
8169 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2BI21M | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784I | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||||
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TE0820-04-40121MA | - | ![]() |
9547 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-40121MA | 1 | - | - | - | - | - | - | ||||||
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TE0823-01-S002 | - | ![]() |
8819 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0823-01-S002 | 1 | ARM Cortex-A53, ARM® Cortex®-R5 | - | - | - | MCU, FPGA | - | USB | |||||||
TE0741-04-B2C-1-A | 733.9500 | ![]() |
1228 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0741-04-B2C-1-A | 1 | |||||||||||||||
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TE0813-01-4BE11-A | 560.7000 | ![]() |
6586 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0813-01-4BE11-A | EAR99 | 8538.90.8180 | 1 | Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E | - | 2GB | 128MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||
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TE0741-04-G2C-1-A | 1.0000 | ![]() |
1197 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-G2C-1-A | 1 | Xilinx Kintex-7 FPGA XC7K410T-2FBG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||||
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TE0741-04-B3E-1-AF | - | ![]() |
6821 | 0.00000000 | Trenz Electronic GmbH | * | Box | Active | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-B3E-1-AF | 1 | ||||||||||||||
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TE0741-04-A2C-1-A | 450.4500 | ![]() |
9180 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-A2C-1-A | 1 | Xilinx Kintex-7 FPGA XC7K70T-2FBG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||||
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TE0741-04-B2C-1-AF | 880.9600 | ![]() |
4316 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-B2C-1-AF | 1 | Xilinx Kintex-7 FPGA XC7K160T-2FFG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||||
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S00014 | - | ![]() |
8803 | 0.00000000 | Trenz Electronic GmbH | * | Box | Obsolete | - | ROHS3 Compliant | 1 (Unlimited) | 1686-S00014 | OBSOLETE | 1 | |||||||||||||
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TE0720-04-31C33MA | 303.4500 | ![]() |
4909 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-31C33MA | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 766MHz | 1GB | 32MB | Ethernet Core | - | Board-to-Board (BTB) Socket | |||
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TE0720-04-62I33MA | 355.9500 | ![]() |
2065 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-62I33MA | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | - | 1GB | 32MB | Ethernet Core | - | Board-to-Board (BTB) Socket | |||
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MCV-6DB | 356.0000 | ![]() |
30 | 0.00000000 | ARIES Embedded | - | Box | Active | 0°C ~ 70°C | 2.910" L x 1.650" W (74.00mm x 42.00mm) | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | 3A991 | 8471.50.0150 | 1 | ARM Cortex-A9 (Dual Core) | 800MHz | 1GB | 4GB | FPGA | - | 360 Pin | |||
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MCV-X6DB | 458.0000 | ![]() |
30 | 0.00000000 | ARIES Embedded | - | Box | Active | 0°C ~ 70°C | 2.910" L x 1.650" W (74.00mm x 42.00mm) | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | 3A991 | 8471.50.0150 | 1 | ARM Cortex-A9 (Dual Core) | 800MHz | 1GB | 4GB | FPGA | - | 360 Pin | |||
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SPIDERSOM L | 42.0000 | ![]() |
21 | 0.00000000 | ARIES Embedded | - | Box | Active | 0°C ~ 70°C | 2.760" L x 1.380" W (70.00mm x 35.00mm) | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | 3199-SPIDERSOML | 3A991 | 8471.50.0150 | 1 | - | 25MHz | - | - | FPGA Core | - | 230 Pin | ||
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SOMIMX8MMQ-11-1BE4SMIR | - | ![]() |
8538 | 0.00000000 | Beacon EmbeddedWorks | i.MX 8M | Bulk | Active | -40°C ~ 85°C | 1.100" L x 1.500" W (28.00mm x 38.00mm) | download | 460-SOMIMX8MMQ-11-1BE4SMIR | 1 | ARM® Cortex™-A53, ARM® Cortex™-M4 | 1.8GHz, 400MHz | 4GB | - | MCU Core | - | USB |
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