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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Size / Dimension Base Product Number DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Core Processor Speed RAM Size Flash Size Module/Board Type Co-Processor Connector Type
TE0820-05-4DE81MA Trenz Electronic GmbH TE0820-05-4DE81MA 622.0000
RFQ
 ECAD 6570 0.00000000 Trenz Electronic GmbH - Bulk Active - ROHS3 Compliant Not Applicable 1686-TE0820-05-4DE81MA 1
TE0720-04-61C33MA Trenz Electronic GmbH TE0720-04-61C33MA 279.0000
RFQ
 ECAD 2903 0.00000000 Trenz Electronic GmbH TE0722 Bulk Active 0°C ~ 70°C 1.970" L x 1.570" W (50.00mm x 40.00mm) - ROHS3 Compliant Not Applicable 1686-TE0720-04-61C33MA 1 Zynq™ XC7Z020-1CLG484C - 8GB 32MB MPU Core ARM Cortex-A9 Board-to-Board (BTB) Socket
TE0715-05-51I33-L Trenz Electronic GmbH TE0715-05-51I33-L 358.0000
RFQ
 ECAD 3263 0.00000000 Trenz Electronic GmbH TE0711 Bulk Active -40°C ~ 85°C 1.970" L x 1.570" W (50.00mm x 40.00mm) - ROHS3 Compliant Not Applicable 1686-TE0715-05-51I33-L 1 Zynq™ 7015 XC7Z015-1CLG485I - 1GB 32MB MPU Core ARM Cortex-A9 Board-to-Board (BTB) Socket
TE0813-01-3AE11-A Trenz Electronic GmbH TE0813-01-3AE11-A 447.9600
RFQ
 ECAD 8335 0.00000000 Trenz Electronic GmbH Zynq® UltraScale+™ Bulk Active 0°C ~ 85°C 2.990" L x 2.050" W (76.00mm x 52.00mm) - ROHS3 Compliant Not Applicable 1686-TE0813-01-3AE11-A 1 Zynq UltraScale+ XCZU3CG-1SFVC784E - 2GB 128MB MPU Core - Board-to-Board (BTB) Socket - 240
TE0818-01-9GI21-A Trenz Electronic GmbH TE0818-01-9GI21-A 1.0000
RFQ
 ECAD 5039 0.00000000 Trenz Electronic GmbH Zynq® UltraScale+™ Bulk Active -40°C ~ 85°C 2.990" L x 2.050" W (76.00mm x 52.00mm) - ROHS3 Compliant Not Applicable 1686-TE0818-01-9GI21-A 1 Zynq UltraScale+ XCZU9EG-2FFVC900I - 4GB 128MB MPU Core - Board-to-Board (BTB) Socket - 240
TE0820-05-2BI21ML Trenz Electronic GmbH TE0820-05-2BI21ML 459.0000
RFQ
 ECAD 9735 0.00000000 Trenz Electronic GmbH TE0820 Bulk Active -40°C ~ 85°C 1.970" L x 1.570" W (50.00mm x 40.00mm) - ROHS3 Compliant Not Applicable 1686-TE0820-05-2BI21ML 1 Zynq UltraScale+ XCZU2EG-1SFVC784I - 2GB 128MB MPU Core ARM® Cortex®-A53, ARM® Cortex®-R5 2 x 100 Pin
AM0010-02-4DE21MA Trenz Electronic GmbH AM0010-02-4DE21MA 673.0000
RFQ
 ECAD 8421 0.00000000 Trenz Electronic GmbH Zynq® UltraScale+™ Bulk Active 0°C ~ 85°C 2.220" L x 1.575" W (56.40mm x 40.00mm) - ROHS3 Compliant Not Applicable 1686-AM0010-02-4DE21MA 1 Zynq™ UltraScale+™ ZU4EV - 4GB 128MB MPU Core - Board-to-Board (BTB) Socket
TE0817-01-7DI21-A Trenz Electronic GmbH TE0817-01-7DI21-A 2.0000
RFQ
 ECAD 6465 0.00000000 Trenz Electronic GmbH Zynq® UltraScale+™ Bulk Active -40°C ~ 85°C 2.990" L x 2.050" W (76.00mm x 52.00mm) - ROHS3 Compliant Not Applicable 1686-TE0817-01-7DI21-A 1 Zynq UltraScale+ XCZU7EV-1FBVB900I - 4GB 128MB MPU Core - Board-to-Board (BTB) Socket - 240
TE0807-03-7DE21-AK Trenz Electronic GmbH TE0807-03-7DE21-AK 2.0000
RFQ
 ECAD 1165 0.00000000 Trenz Electronic GmbH TE0807 Bulk Active 0°C ~ 85°C 2.990" L x 2.050" W (76.00mm x 52.00mm) - ROHS3 Compliant Not Applicable 1686-TE0807-03-7DE21-AK 1 Zynq UltraScale+ XCZU7EV-1FBVB900E - 4GB 128MB MPU Core - Board-to-Board (BTB) Socket - 160
AM0010-02-5DE21MA Trenz Electronic GmbH AM0010-02-5DE21MA 1.0000
RFQ
 ECAD 1842 0.00000000 Trenz Electronic GmbH Zynq® UltraScale+™ Bulk Active 0°C ~ 85°C 2.220" L x 1.575" W (56.40mm x 40.00mm) - ROHS3 Compliant Not Applicable 1686-AM0010-02-5DE21MA 1 Zynq™ UltraScale+™ ZU5EV-1E - 4GB 128MB MPU Core - Board-to-Board (BTB) Socket
TE0808-05-6BE81-A Trenz Electronic GmbH TE0808-05-6BE81-A 1.0000
RFQ
 ECAD 1899 0.00000000 Trenz Electronic GmbH - Bulk Active - ROHS3 Compliant Not Applicable 1686-TE0808-05-6BE81-A 1
TE0830-01-ABI26FAP Trenz Electronic GmbH TE0830-01-ABI26FAP -
RFQ
 ECAD 5512 0.00000000 Trenz Electronic GmbH Zynq® UltraScale+™ Bulk Active -40°C ~ 85°C 4.724" L x 4.724" W (120.00mm x 120.00mm) - ROHS3 Compliant Not Applicable 1686-TE0830-01-ABI26FAP 1 Zynq UltraScale+ ZU11EG-1I - 16GB 128MB MPU Core - 2 x 400 Pin
TE0710-02-42I21-A Trenz Electronic GmbH TE0710-02-42I21-A 164.0000
RFQ
 ECAD 6364 0.00000000 Trenz Electronic GmbH TE0711 Bulk Active -40°C ~ 85°C 1.970" L x 1.570" W (50.00mm x 40.00mm) - ROHS3 Compliant Not Applicable 1686-TE0710-02-42I21-A 1 Artix™ 7 XC7A35T-2CSG324I - 512MB 32MB FPGA - 2 x 100 Pin
TE0808-05-6BE81-AK Trenz Electronic GmbH TE0808-05-6BE81-AK 1.0000
RFQ
 ECAD 5939 0.00000000 Trenz Electronic GmbH - Bulk Active - ROHS3 Compliant Not Applicable 1686-TE0808-05-6BE81-AK 1
TE0820-05-3BE21ML Trenz Electronic GmbH TE0820-05-3BE21ML 534.4500
RFQ
 ECAD 8388 0.00000000 Trenz Electronic GmbH TE0820 Bulk Active 0°C ~ 85°C 1.970" L x 1.570" W (50.00mm x 40.00mm) download 1686-TE0820-05-3BE21ML 1 ARM® Cortex®-A53, ARM® Cortex®-R5 - 2GB 128MB MPU Core Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E Pin(s)
TE0803-03-2AE11-A Trenz Electronic GmbH TE0803-03-2AE11-A -
RFQ
 ECAD 3216 0.00000000 Trenz Electronic GmbH TE0803 Bulk Obsolete 0°C ~ 85°C 2.050" L x 2.990" W (52.00mm x 76.00mm) TE0803 download ROHS3 Compliant Not Applicable 5A002A TRE 8471.50.0150 1 Zynq UltraScale+ XCZU2CG-1SFVC784E - 2GB 128MB MPU Core - B2B
TE0808-05-BBE21-AZ Trenz Electronic GmbH TE0808-05-BBE21-AZ 361.2000
RFQ
 ECAD 4913 0.00000000 Trenz Electronic GmbH - Box Active 0°C ~ 85°C 2.050" L x 2.990" W (52.00mm x 76.00mm) download ROHS3 Compliant 1 (Unlimited) 1 Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E - 2GB 128MB FPGA Core - Board-to-Board (BTB) Socket
TE0630-02IBF Trenz Electronic GmbH TE0630-02IBF 303.4500
RFQ
 ECAD 5125 0.00000000 Trenz Electronic GmbH TE0630 Bulk Active -40°C ~ 85°C 1.600" L x 1.900" W (40.50mm x 47.50mm) TE0630 - ROHS3 Compliant Not Applicable 0000.00.0000 1 Spartan-6 LX-75 100MHz 128MB 8MB FPGA, USB Core Cypress EZ-USB FX2LP B2B
TE0600-03-52I11-C Trenz Electronic GmbH TE0600-03-52I11-C -
RFQ
 ECAD 8935 0.00000000 Trenz Electronic GmbH - Bulk Active -40°C ~ 85°C 1.970" L x 1.570" W (50.00mm x 40.00mm) download ROHS3 Compliant 1 (Unlimited) 1686-TE0600-03-52I11-C 1 Spartan-6 LX-45 125MHz 256MB 16MB FPGA Core - Samtec LSHM
TE0841-02-41I21-A Trenz Electronic GmbH TE0841-02-41I21-A 2.0000
RFQ
 ECAD 3256 0.00000000 Trenz Electronic GmbH TE0841 Bulk Active -40°C ~ 85°C 1.970" L x 1.570" W (50.00mm x 40.00mm) TE0841 download ROHS3 Compliant 1 (Unlimited) 1686-TE0841-02-41I21-A 3A991D 8471.50.0150 1 Kintex UltraScale KU40 - 2GB 64MB MCU, FPGA - B2B
TE0803-02-05EV-1EA Trenz Electronic GmbH TE0803-02-05EV-1EA -
RFQ
 ECAD 7687 0.00000000 Trenz Electronic GmbH TE0803 Bulk Obsolete 0°C ~ 85°C 2.050" L x 2.990" W (52.00mm x 76.00mm) - Not Applicable 1686-TE0803-02-05EV-1EA OBSOLETE 1 Zynq UltraScale+ XCZU5EV-1SFVC784E - 2GB 128MB MPU Core - B2B
TE0711-01-35-2I Trenz Electronic GmbH TE0711-01-35-2I 145.9500
RFQ
 ECAD 8397 0.00000000 Trenz Electronic GmbH TE0711 Bulk Active -40°C ~ 85°C 1.970" L x 1.570" W (50.00mm x 40.00mm) TE0711 download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 3A991D 8471.50.0150 1 Artix-7 A35T 100MHz - 32MB FPGA Core - Samtec LSHM
TE0720-04-61Q33ML Trenz Electronic GmbH TE0720-04-61Q33ML 340.2000
RFQ
 ECAD 4514 0.00000000 Trenz Electronic GmbH - Bulk Active -40°C ~ 85°C 1.970" L x 1.570" W (50.00mm x 40.00mm) - ROHS3 Compliant Not Applicable 1686-TE0720-04-61Q33ML 1 ARM® Cortex®-A9 - 1GB 32MB Ethernet Core - Board-to-Board (BTB) Socket
TE0745-01-45-2I Trenz Electronic GmbH TE0745-01-45-2I -
RFQ
 ECAD 1818 0.00000000 Trenz Electronic GmbH TE0745 Bulk Discontinued at SIC -40°C ~ 85°C 2.050" L x 2.990" W (52.00mm x 76.00mm) download ROHS3 Compliant REACH Unaffected 3A991D 8471.50.0150 1 ARM® Cortex®-A9 1GB 32MB MCU, FPGA Zynq-7000 (Z-7045) Samtec UFPS
TE0745-02-30-1IA-K Trenz Electronic GmbH TE0745-02-30-1IA-K -
RFQ
 ECAD 2648 0.00000000 Trenz Electronic GmbH TE0745 Bulk Obsolete -40°C ~ 85°C 2.050" L x 2.990" W (52.00mm x 76.00mm) download ROHS3 Compliant 1 (Unlimited) 1686-TE0745-02-30-1IA-K OBSOLETE 1 ARM® Cortex®-A9 - 1GB 64MB MCU, FPGA Zynq-7000 (Z-7030) Samtec ST5
TE0813-01-4DE11-AZ Trenz Electronic GmbH TE0813-01-4DE11-AZ 614.0800
RFQ
 ECAD 1091 0.00000000 Trenz Electronic GmbH - Bulk Active - ROHS3 Compliant Not Applicable 1686-TE0813-01-4DE11-AZ 1
TE0745-02-71I31-AZ Trenz Electronic GmbH TE0745-02-71I31-AZ 597.4500
RFQ
 ECAD 8559 0.00000000 Trenz Electronic GmbH TE0745 Bulk Active -40°C ~ 85°C 2.050" L x 2.990" W (52.00mm x 76.00mm) download ROHS3 Compliant Not Applicable 3A991D 8473.30.1180 1 ARM Cortex-A9 - 1GB 64MB MCU, FPGA Zynq-7000 (Z-7030) Board-to-Board (BTB) Socket - 160
TE0818-01-6BE21-A Trenz Electronic GmbH TE0818-01-6BE21-A 1.0000
RFQ
 ECAD 9084 0.00000000 Trenz Electronic GmbH Zynq® UltraScale+™ Bulk Active 0°C ~ 85°C 2.990" L x 2.050" W (76.00mm x 52.00mm) - ROHS3 Compliant Not Applicable 1686-TE0818-01-6BE21-A 1 Zynq UltraScale+ XCZU6EG-1FFVC900E - 4GB 128MB MPU Core - Board-to-Board (BTB) Socket - 240
TE0726-03-07S-1C Trenz Electronic GmbH TE0726-03-07S-1C -
RFQ
 ECAD 9214 0.00000000 Trenz Electronic GmbH TE0726 Bulk Obsolete 0°C ~ 70°C 1.570" L x 1.180" W (40.00mm x 30.00mm) TE0726 download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 1686-1094 3A991D 8471.50.0150 1 ARM Cortex-A9 766MHz 512MB 16MB MCU, FPGA Zynq-7000 (Z-7007S) CSI, DSI
TE0720-04-61C530A Trenz Electronic GmbH TE0720-04-61C530A 308.7000
RFQ
 ECAD 5270 0.00000000 Trenz Electronic GmbH - Bulk Active 0°C ~ 70°C 1.970" L x 1.570" W (50.00mm x 40.00mm) - ROHS3 Compliant Not Applicable 1686-TE0720-04-61C530A 1 ARM® Cortex®-A9 - 256MB 32MB Ethernet Core - Board-to-Board (BTB) Socket
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse

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SIC
AD9208BBPZ-3000

196-LFBGA Exposed Pad

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