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Embedded(571)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0813-01-4DE11-AZ | 614.0800 |  |
1091 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0813-01-4DE11-AZ | 1 | ||||||||||||||
 |
TE0745-01-45-2I | - | |
1818 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Samtec UFPS | |||||
|
S00021-02 | - | |
8204 | 0.00000000 | Trenz Electronic GmbH | * | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-S00021-02 | 1 | ||||||||||||||
|
TE0807-03-4BE21-A | 1.0000 | |
3404 | 0.00000000 | Trenz Electronic GmbH | TE0807 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0807-03-4BE21-A | 1 | Zynq™ UltraScale+™ XCZU4EG-1FBVB900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 160 | |||||
 |
TE0715-05-51I33-A | 387.4500 | |
3 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0715-05-51I33-A | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7015) | Samtec LSHM | |||||
|
TE0821-01-3BE21ML | 521.0000 | |
1018 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0821-01-3BE21ML | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | 2 x 100 Pin | |||||
|
TE0720-03-1QFA | - | |
2680 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | - | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-1QFA | OBSOLETE | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | ||||
|
TE0745-02-71I31-AZ | 597.4500 | |
8559 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 3A991D | 8473.30.1180 | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | Board-to-Board (BTB) Socket - 160 | ||||
|
TE0803-03-3BE11-AS | - | |
4073 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0803 | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-03-3BE11-AS | OBSOLETE | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||
|
AM0010-02-3BE21MA | 572.0000 | |
3177 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.205" L x 1.575" W (56.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-AM0010-02-3BE21MA | 1 | Zynq™ UltraScale+™ ZU3EG-1E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0803-02-05EV-1EA | - | |
7687 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | Not Applicable | 1686-TE0803-02-05EV-1EA | OBSOLETE | 1 | Zynq UltraScale+ XCZU5EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
 |
TE0715-04-15-2I | - | |
1848 | 0.00000000 | Trenz Electronic GmbH | TE0715 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0715 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7015) | Samtec LSHM | ||
 |
TE0726-03-07S-1C | - | |
9214 | 0.00000000 | Trenz Electronic GmbH | TE0726 | Bulk | Obsolete | 0°C ~ 70°C | 1.570" L x 1.180" W (40.00mm x 30.00mm) | TE0726 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 1686-1094 | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 766MHz | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7007S) | CSI, DSI | |
|
TE0720-04-61C530A | 308.7000 | |
5270 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-61C530A | 1 | ARM® Cortex®-A9 | - | 256MB | 32MB | Ethernet Core | - | Board-to-Board (BTB) Socket | |||||
 |
TE0820-02-03CG-1EA | - | |
4611 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Discontinued at SIC | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | 1GB | 128MB | MPU Core | - | B2B | ||||||
|
TE0813-02-4BE81-A | 565.8400 | |
3207 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Box | Active | 0°C ~ 85°C | 2.047" L x 2.992" W (52.00mm x 76.00mm) | - | 1 (Unlimited) | 1686-TE0813-02-4BE81-A | 1 | Xilinx Zynq UltraScale+ ZU4EG | - | 2GB | 128MB | FPGA | - | BGA | ||||||
 |
TE0745-02-35-1CA | - | |
6311 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | 0°C ~ 70°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | 1 (Unlimited) | 1686-1109 | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7035) | Samtec UFPS | |||||
 |
TE0808-04-09EG-2IE | - | |
7482 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Box | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | 1 (Unlimited) | 1686-1107 | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | ||||
 |
TE0720-03-2IFC3 | - | |
4941 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0720 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8471.50.0150 | 1 | ARM Cortex-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||
 |
TE0600-03-72C11-A | 345.4500 | |
2130 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0600-03-72C11-A | 1 | Spartan-6 LX-100 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | |||||
|
TE0712-03-72C36-A | 324.4500 | |
8721 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0712-03-72C36-A | 1 | Artix-7 XC7A100T-2FGG484C | - | 1GB | 32MB | FPGA | - | Board-to-Board (BTB) Socket - 160 | |||||||
|
TE0807-03-4AI21-A | 1.0000 | |
1594 | 0.00000000 | Trenz Electronic GmbH | TE0807 | Box | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0807 | download | ROHS3 Compliant | Not Applicable | 1686-TE0807-03-4AI21-A | 1 | Zynq UltraScale+ XCZU4CG-1FBVB900I | - | 4GB | 128MB | MPU Core | - | B2B | ||||
 |
TE0712-02-200-2C | - | |
8271 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0712 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | ||
|
TE0741-04-B2C-1-AF | 880.9600 | |
4316 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-B2C-1-AF | 1 | Xilinx Kintex-7 FPGA XC7K160T-2FFG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0820-05-2BE81ML | 414.0000 | |
3489 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-2BE81ML | 1 | ||||||||||||||
|
TE0820-05-3BE81ML | 515.0000 | |
3016 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-3BE81ML | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | 2 x 100 Pin | |||||
 |
TE0741-03-325-2CF | - | |
2877 | 0.00000000 | Trenz Electronic GmbH | TE0741 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0741 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex-7 325T | 200MHz | - | 32MB | FPGA Core | - | Samtec LSHM | ||
 |
TE0630-01I | - | |
9677 | 0.00000000 | Trenz Electronic GmbH | TE0630 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.600" L x 1.900" W (40.50mm x 47.50mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-45 | 100MHz | 128MB | 8MB | FPGA, USB Core | Cypress EZ-USB FX2LP | B2B | ||||
|
TE0807-02-07EV-1E | - | |
6805 | 0.00000000 | Trenz Electronic GmbH | TE0807 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | Not Applicable | 1686-1169 | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU7EV-1FBVB900E | - | 4GB | 128MB | MPU Core | - | B2B | ||||
 |
TE0720-03-62I33MA | - | |
2325 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-62I33MA | EAR99 | 8473.30.1180 | 1 | ARM Cortex-A9 | - | 1GB | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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