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Embedded(571)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0714-04-42I-7-L | - |  |
3402 | 0.00000000 | Trenz Electronic GmbH | TE0714 | Bulk | Active | -40°C ~ 85°C | 1.570" L x 1.180" W (40.00mm x 30.00mm) | - | 1686-TE0714-04-42I-7-L | 1 | Artix-7 A35T | - | - | 16MB | FPGA | Artix-7 | - | ||||||
|
TE0745-02-45-1CA | - | |
3381 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | 0°C ~ 70°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Samtec UFPS | ||||
|
TE0803-03-4BE21-L | - | |
7953 | 0.00000000 | Trenz Electronic GmbH | * | Bulk | Active | TE0803 | - | ROHS3 Compliant | Not Applicable | 1686-TE0803-03-4BE21-L | 1 | ||||||||||||
 |
TE0720-03-61Q33FA | - | |
7695 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-61Q33FA | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||
 |
TE0715-05-71C33-A | 550.2000 | |
4658 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0715-05-71C33-A | 3A991A2 | 8471.50.0150 | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec LSHM | ||
 |
TE0715-04-15-1IC | - | |
4173 | 0.00000000 | Trenz Electronic GmbH | TE0715 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0715-04-15-1IC | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7015) | Samtec LSHM | |||
|
TE0818-01-BBE21-A | 1.0000 | |
7721 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0818-01-BBE21-A | 1 | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | ||||
|
TE0808-05-BBE21-A | 1.0000 | |
2614 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-BBE21-A | 1 | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | 4 x 160 Pin | ||||
|
TE0808-05-9BE81-AK | 1.0000 | |
5635 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-9BE81-AK | 1 | |||||||||||||
|
TE0820-05-4AE21MA | 534.4500 | |
5614 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-4AE21MA | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E | Pin(s) | ||||||
|
TE0820-05-3BE21MA | 544.9500 | |
9684 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-3BE21MA | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E | Pin(s) | ||||||
|
TE0890-01-P1C-5-A | 49.3500 | |
1327 | 0.00000000 | Trenz Electronic GmbH | TE0890 | Bulk | Active | 0°C ~ 70°C | 1.060" L x 2.050" W (27.00mm x 52.00mm) | TE0890 | download | ROHS3 Compliant | Not Applicable | 1686-TE0890-01-P1C-5-A | EAR99 | 8473.30.1180 | 1 | Xilinx Spartan-7 XC7S25 | 100MHz | 64Mbit | 64Mbit | FPGA Core | - | Dual-pinout DIP-40 or 50mil 80 pin connector | |
|
AM0010-02-2AE21MA | 426.0000 | |
2354 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.205" L x 1.575" W (56.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-AM0010-02-2AE21MA | 1 | Zynq™ UltraScale+™ ZU2CG | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket | ||||
|
TE0808-05-6BE21-AK | 1.0000 | |
5168 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-6BE21-AK | 1 | Zynq™ UltraScale+™ ZU6EG-E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 160 | ||||
|
TE0807-03-7DE21-A | 1.0000 | |
6516 | 0.00000000 | Trenz Electronic GmbH | TE0807 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0807-03-7DE21-A | 1 | Zynq UltraScale+ XCZU7EV-1FBVB900E | - | 4GB | 128MB | MPU Core | - | 4 x 160 Pin | ||||
|
TE0808-05-9GI81-A | 1.0000 | |
1856 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-9GI81-A | 1 | |||||||||||||
|
TE0835-02-MXE21-A | 5.0000 | |
3460 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 3.543" L x 2.559" W (90.00mm x 65.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0835-02-MXE21-A | 1 | Zynq™ UltraScale+™ XCZU25DR-1FFVE1156E | 1.3GHz | 4GB | 128MB | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | Board-to-Board (BTB) Socket | ||||
|
AM0010-02-4AE21MA | 549.0000 | |
1138 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.205" L x 1.575" W (56.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-AM0010-02-4AE21MA | 1 | Zynq™ UltraScale+™ ZU4CG-1E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket | ||||
|
TE0808-05-BBE81-A | 1.0000 | |
6298 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-BBE81-A | 1 | |||||||||||||
|
TE0715-05-73E33-A | 757.0000 | |
2344 | 0.00000000 | Trenz Electronic GmbH | TE0711 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0715-05-73E33-A | 1 | Zynq™ XC7Z030-3SBG485E | - | 1GB | 32MB | MPU Core | ARM Cortex-A9 | Board-to-Board (BTB) Socket | ||||
|
TE0813-01-5DI21-A | 1.0000 | |
5421 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0813-01-5DI21-A | 1 | Zynq UltraScale+ XCZU5EV-1SFVC784I | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | ||||
|
TE0715-05-21C33-A | 302.0000 | |
3599 | 0.00000000 | Trenz Electronic GmbH | TE0711 | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0715-05-21C33-A | 1 | Zynq™ XC7Z012S-1CLG485C | 766MHz | 1GB | 32MB | MPU Core | ARM Cortex-A9 | Board-to-Board (BTB) Socket | ||||
|
TE0808-05-6BE81-L | 1.0000 | |
4910 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-6BE81-L | 1 | |||||||||||||
|
TE0807-03-4BE21-AK | 1.0000 | |
2448 | 0.00000000 | Trenz Electronic GmbH | TE0807 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0807-03-4BE21-AK | 1 | Zynq™ UltraScale+™ XCZU4EG-1FBVB900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 160 | ||||
|
TE0712-03-71I36-A | 361.2000 | |
2553 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | Not Applicable | 1686-TE0712-03-71I36-A | 1 | Artix-7 XC7A100T-1FGG484I | - | 1GB | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0835-02-TXE21-A | 9.0000 | |
5016 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 3.543" L x 2.559" W (90.00mm x 65.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0835-02-TXE21-A | 1 | Zynq™ UltraScale+™ XCZU47DR-1FFVE1156E | 1.3GHz | 4GB | 512MB | MPU Core | ARM® Cortex®-A53 | Board-to-Board (BTB) Socket | ||||
 |
TE0720-03-62I33NA | - | |
1016 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-62I33NA | 3A991D | 8473.30.1180 | 1 | ARM Cortex-A9 | - | 1GB | 32GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||
 |
TE0600-03-72C21-A | 361.2000 | |
2941 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0600-03-72C21-A | 1 | Spartan-6 LX-100 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | ||||
|
TE0782-02-82I33MA | 1.0000 | |
5126 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Active | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | Not Applicable | 1686-TE0782-02-82I33MA | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7035) | Board-to-Board (BTB) Socket | |||||
 |
TE0808-05-9BE21-AK | 1.0000 | |
5765 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-05-9BE21-AK | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | 2GB | 128MB | MPU Core | - | B2B |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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