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Embedded(571)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0808-05-BBE21-A | 1.0000 |  |
2614 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-BBE21-A | 1 | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | 4 x 160 Pin | |||||
|
TE0820-05-4AE21MA | 534.4500 | |
5614 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-4AE21MA | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E | Pin(s) | |||||||
|
TE0808-05-9BE81-AK | 1.0000 | |
5635 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-9BE81-AK | 1 | ||||||||||||||
 |
TE0808-04-6BE21-A | - | |
8732 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Discontinued at SIC | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-6BE21-A | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU6EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | ||
|
TE0890-01-P1C-5-A | 49.3500 | |
1327 | 0.00000000 | Trenz Electronic GmbH | TE0890 | Bulk | Active | 0°C ~ 70°C | 1.060" L x 2.050" W (27.00mm x 52.00mm) | TE0890 | download | ROHS3 Compliant | Not Applicable | 1686-TE0890-01-P1C-5-A | EAR99 | 8473.30.1180 | 1 | Xilinx Spartan-7 XC7S25 | 100MHz | 64Mbit | 64Mbit | FPGA Core | - | Dual-pinout DIP-40 or 50mil 80 pin connector | ||
|
TE0820-05-3BE21MA | 544.9500 | |
9684 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-3BE21MA | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E | Pin(s) | |||||||
|
TE0821-01-3AE31PA | 571.0000 | |
6107 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0821-01-3AE31PA | 1 | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | 4GB | 128MB | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | 2 x 100 Pin | |||||
|
TE0820-05-4DI81MA | 1.0000 | |
8431 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-4DI81MA | 1 | ||||||||||||||
|
TE0803-03-5DE11-A | - | |
2661 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0803 | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-03-5DE11-A | OBSOLETE | 1 | Zynq UltraScale+ XCZU5EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||
|
TE0818-01-BBE21-A | 1.0000 | |
7721 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0818-01-BBE21-A | 1 | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
 |
TE0808-04-9BE21-A | - | |
7640 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-9BE21-A | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | ||
|
TE0813-01-4DE11-A | 633.2000 | |
6859 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0813-01-4DE11-A | 1 | Zynq UltraScale+ XCZU4EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0720-03-1QFL | - | |
4629 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | - | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-1QFL | OBSOLETE | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | ||||
|
TE0720-03-62I33GA | - | |
3366 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-62I33GA | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||||
 |
TE0710-02-100-2IF | - | |
4550 | 0.00000000 | Trenz Electronic GmbH | TE0710 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8473.30.1180 | 1 | Artix-7 A100T | 100MHz | 512MB | 32MB | FPGA Core | - | Samtec LSHM | |||
 |
TE0715-04-30-1I3 | - | |
1237 | 0.00000000 | Trenz Electronic GmbH | TE0715 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0715 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec LSHM | ||
|
TE0803-02-04EG-1E3 | - | |
8360 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | Not Applicable | 1686-TE0803-02-04EG-1E3 | OBSOLETE | 1 | Zynq UltraScale+ XCZU4EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
 |
TE0715-05-71I33-L | 550.2000 | |
4938 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | 1686-TE0715-05-71I33-L | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec LSHM | |||||||
|
TE0714-04-42I-7-C | - | |
6900 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | 1686-TE0714-04-42I-7-C | 1 | ||||||||||||||||
|
TE0813-01-4AE11-A | 509.7100 | |
1532 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0813-01-4AE11-A | 1 | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
 |
TE0720-03-2IF | - | |
7175 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0720 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 1686-1017 | EAR99 | 8471.50.0150 | 1 | ARM Cortex-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||
 |
TE0300-01IBM | 164.0000 | |
9586 | 0.00000000 | Trenz Electronic GmbH | TE0300 | Bulk | Not For New Designs | 0°C ~ 70°C | 1.600" L x 1.900" W (40.50mm x 47.50mm) | TE0300 | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-3E | 125MHz | 64MB | 4MB | FPGA, USB Core | Cypress FX2 USB 2.0 | B2B | |||
 |
TE0728-03-1Q | 517.6500 | |
6264 | 0.00000000 | Trenz Electronic GmbH | TE0728 | Bulk | Active | - | 2.360" L x 2.360" W (60.00mm x 60.00mm) | TE0728 | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec SEM | |||
 |
TE0745-01-45-1C | - | |
7141 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Samtec UFPS | |||||
|
TE0712-02-82C36-L | - | |
3733 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Discontinued at SIC | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-82C36-L | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
|
TE0813-01-5DE11-A | 1.0000 | |
1310 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0813-01-5DE11-A | 1 | Zynq UltraScale+ XCZU5EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0803-02-04EV-1EA | - | |
8191 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | Not Applicable | 1686-1155 | 5A002A1 | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU4EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
|
TE0803-03-4DE11-A | - | |
3131 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0803 | download | ROHS3 Compliant | Not Applicable | 1686-1181 | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU4EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||
|
TE0820-03-04CG-1ED | - | |
6574 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.570" L x 1.970" W (40.00mm x 50.00mm) | download | Not Applicable | 1686-1175 | OBSOLETE | 0000.00.0000 | 1 | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
 |
TE0725-03-100-2I9 | 209.0000 | |
8843 | 0.00000000 | Trenz Electronic GmbH | TE0725 | Bulk | Active | -40°C ~ 85°C | 2.870" L x 1.380" W (73.00mm x 35.00mm) | TE0725 | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 100MHz | - | 32MB | FPGA Core | - | 50 Pin |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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