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Embedded(571)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0745-02-71I11-A | - |  |
2876 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0745 | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-71I11-A | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec ST5 | ||
 |
TE0712-02-72C36-A | - | |
7432 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Discontinued at SIC | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-72C36-A | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
 |
TE0820-04-4AE21FA | - | |
7763 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-4AE21FA | OBSOLETE | 1 | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||
 |
TE0820-03-04EV-1EA | - | |
8249 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.570" L x 1.970" W (40.00mm x 50.00mm) | download | Not Applicable | 1686-1161 | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU4EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
 |
TE0722-02I | 114.4500 | |
24 | 0.00000000 | Trenz Electronic GmbH | TE0722 | Bulk | Active | -40°C ~ 85°C | 0.710" L x 2.010" W (18.00mm x 51.00mm) | TE0722 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 1686-1018 | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 33MHz | - | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | 40 Pin | |
 |
TE0741-03-070-2CF | - | |
7713 | 0.00000000 | Trenz Electronic GmbH | TE0741 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0741 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex-7 70T | 200MHz | - | 32MB | FPGA Core | - | Samtec LSHM | ||
 |
TE0841-01-035-1I | - | |
2094 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU35 | 4GB | 32MB | FPGA Core | - | Samtec LSHM | |||||
|
TE0803-02-04CG-1EB | 724.5000 | |
9854 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0803 | download | ROHS3 Compliant | Not Applicable | 1686-1153 | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | 2GB | 256MB | MPU Core | - | B2B | ||
 |
TE0713-02-100-2C | - | |
1858 | 0.00000000 | Trenz Electronic GmbH | TE0713 | Bulk | Obsolete | 0°C ~ 70°C | 1.570" L x 1.970" W (40.00mm x 50.00mm) | TE0713 | download | Not Applicable | 1686-1166 | 3A991D | 8471.50.0150 | 1 | Artix-7 XC7A100T-2FGG484C | 200MHz | 1GB | 32MB | FPGA Core | - | B2B | |||
|
TE0820-05-4DE21MA | 655.2000 | |
7365 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-4DE21MA | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E | Pin(s) | |||||||
|
TE0820-05-2BE21MA | 455.7000 | |
6454 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-2BE21MA | 1 | ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E | Pin(s) | |||||||
|
TE0820-05-2AI21MA | 455.7000 | |
7712 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | Not Applicable | 1686-TE0820-05-2AI21MA | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I | Pin(s) | ||||||
|
TE0820-05-2BI81MA | 459.0000 | |
3339 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-2BI81MA | 1 | ||||||||||||||
|
TE0820-05-4DE81MA | 622.0000 | |
6570 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-4DE81MA | 1 | ||||||||||||||
|
TE0720-04-61C33MA | 279.0000 | |
2903 | 0.00000000 | Trenz Electronic GmbH | TE0722 | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-61C33MA | 1 | Zynq™ XC7Z020-1CLG484C | - | 8GB | 32MB | MPU Core | ARM Cortex-A9 | Board-to-Board (BTB) Socket | |||||
|
TE0715-05-51I33-L | 358.0000 | |
3263 | 0.00000000 | Trenz Electronic GmbH | TE0711 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0715-05-51I33-L | 1 | Zynq™ 7015 XC7Z015-1CLG485I | - | 1GB | 32MB | MPU Core | ARM Cortex-A9 | Board-to-Board (BTB) Socket | |||||
|
TE0813-01-3AE11-A | 447.9600 | |
8335 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0813-01-3AE11-A | 1 | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0818-01-9GI21-A | 1.0000 | |
5039 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0818-01-9GI21-A | 1 | Zynq UltraScale+ XCZU9EG-2FFVC900I | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0820-05-2BI21ML | 459.0000 | |
9735 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-2BI21ML | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784I | - | 2GB | 128MB | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | 2 x 100 Pin | |||||
|
AM0010-02-4DE21MA | 673.0000 | |
8421 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.220" L x 1.575" W (56.40mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-AM0010-02-4DE21MA | 1 | Zynq™ UltraScale+™ ZU4EV | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0817-01-7DI21-A | 2.0000 | |
6465 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0817-01-7DI21-A | 1 | Zynq UltraScale+ XCZU7EV-1FBVB900I | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0807-03-7DE21-AK | 2.0000 | |
1165 | 0.00000000 | Trenz Electronic GmbH | TE0807 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0807-03-7DE21-AK | 1 | Zynq UltraScale+ XCZU7EV-1FBVB900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 160 | |||||
|
AM0010-02-5DE21MA | 1.0000 | |
1842 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.220" L x 1.575" W (56.40mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-AM0010-02-5DE21MA | 1 | Zynq™ UltraScale+™ ZU5EV-1E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0808-05-6BE81-A | 1.0000 | |
1899 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-6BE81-A | 1 | ||||||||||||||
|
TE0830-01-ABI26FAP | - | |
5512 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 4.724" L x 4.724" W (120.00mm x 120.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0830-01-ABI26FAP | 1 | Zynq UltraScale+ ZU11EG-1I | - | 16GB | 128MB | MPU Core | - | 2 x 400 Pin | |||||
|
TE0710-02-42I21-A | 164.0000 | |
6364 | 0.00000000 | Trenz Electronic GmbH | TE0711 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0710-02-42I21-A | 1 | Artix™ 7 XC7A35T-2CSG324I | - | 512MB | 32MB | FPGA | - | 2 x 100 Pin | |||||
|
TE0808-05-6BE81-AK | 1.0000 | |
5939 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-6BE81-AK | 1 | ||||||||||||||
 |
TE0715-04-71I33-L | - | |
3070 | 0.00000000 | Trenz Electronic GmbH | TE0715 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0715-04-71I33-L | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec LSHM | |||
|
TE0715-04-52I33-A | - | |
1109 | 0.00000000 | Trenz Electronic GmbH | TE0715 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0715-04-52I33-A | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7015) | Samtec LSHM | |||||
 |
TE0726-03-11C64-A | 162.4000 | |
3805 | 0.00000000 | Trenz Electronic GmbH | TE0726 | Bulk | Active | 0°C ~ 70°C | 1.180" L x 1.570" W (30.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0726-03-11C64-A | 1 | ARM Cortex-A9 | - | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7007S) | CSI, DSI |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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