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Integrated Circuits (ICs)(1935)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Type | Output Type | Supplier Device Package | Other Names | ECCN | HTSUS | Standard Package | Number of Elements | Voltage - Supply, Single/Dual (±) | Voltage - Input Offset (Max) | Current - Input Bias (Max) | Current - Output (Typ) | Current - Quiescent (Max) | CMRR, PSRR (Typ) | Propagation Delay (Max) | Hysteresis | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Clock Rate | Non-Volatile Memory | On-Chip RAM | Voltage - Core |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
LPC2114FBD64/01,15 | 12.4000 |  |
2 | 0.00000000 | NXP Semiconductors | LPC2100 | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | 64-LQFP (10x10) | 2156-LPC2114FBD64/01,15 | 25 | 46 | ARM7TDMI-S | 16/32-Bit | 60MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART | PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | A/D 4x10b SAR | Internal | |||||||||||||||||||||||||||||||
|
LPC2926FBD144,557 | 13.1000 | |
298 | 0.00000000 | NXP Semiconductors | LPC2900 | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | 144-LQFP (20x20) | 2156-LPC2926FBD144,557 | 23 | 104 | ARM968E-S | 16/32-Bit | 125MHz | CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB | DMA, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 16K x 8 | 56K x 8 | 2.7V ~ 3.6V | A/D 24x10b SAR | Internal | ||||||||||||||||||||||||||||||
|
FS32K144HRT0CLHT | - | |
9916 | 0.00000000 | NXP Semiconductors | S32K | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | 64-LQFP (10x10) | 2156-FS32K144HRT0CLHT | 1 | 89 | ARM® Cortex®-M4F | 32-Bit | 80MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | 512KB (512K x 8) | FLASH | 4K x 8 | 64K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR; D/A 1x8b | External, Internal | |||||||||||||||||||||||||||||||
|
LPC1112FHI33/102,5 | 1.7600 | |
2 | 0.00000000 | NXP Semiconductors | LPC11xx | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | 2156-LPC1112FHI33/102,5 | 171 | 28 | ARM® Cortex®-M0 | 32-Bit | 50MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | A/D 8x10b SAR | Internal | ||||||||||||||||||||||||||||||
|
LPC55S69JBD100K | 5.9100 | |
1 | 0.00000000 | NXP Semiconductors | LPC55S6x | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | 100-HLQFP (14x14) | 2156-LPC55S69JBD100K | 51 | 64 | ARM® Cortex®-M33 | 32-Bit | 150MHz | Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT | 640KB (640K x 8) | FLASH | - | 320K x 8 | 1.8V ~ 3.6V | A/D 10x16b SAR | Internal | ||||||||||||||||||||||||||||||
|
DSP56311VL150 | - | |
2534 | 0.00000000 | NXP Semiconductors | DSP563xx | Bulk | Active | -40°C ~ 100°C (TJ) | Surface Mount | 196-LBGA | Fixed Point | 196-PBGA (15x15) | 2156-DSP56311VL150 | 1 | Host Interface, SCI, SSI | 3.30V | 150MHz | ROM (576B) | 384kB | 1.80V | ||||||||||||||||||||||||||||||||||||
|
LPC1311FHN33/01,55 | 1.9000 | |
306 | 0.00000000 | NXP Semiconductors | LPC13xx | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | 2156-LPC1311FHN33/01,55 | 158 | 28 | ARM® Cortex®-M3 | 32-Bit | 72MHz | I²C, Microwire, SPI, SSI, UART/USART | Brown-out Detect/Reset, POR, WDT | 8KB (8K x 8) | FLASH | - | 4K x 8 | 2V ~ 3.6V | A/D 8x10b | Internal | ||||||||||||||||||||||||||||||
|
SPC5646CCF0VLU1R | - | |
9891 | 0.00000000 | NXP Semiconductors | MPC56xx Qorivva | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 176-LQFP | 176-LQFP (24x24) | 2156-SPC5646CCF0VLU1R | 1 | 147 | e200z4d, e200z0h | 32-Bit Dual-Core | 80MHz, 120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 3MB (3M x 8) | FLASH | 4K x 16 | 256K x 8 | 3V ~ 5.5V | A/D 46x10b, 24x12b | Internal | ||||||||||||||||||||||||||||||
|
LS1028ACE7NQA | 89.2300 | |
90 | 0.00000000 | NXP Semiconductors | QorIQ® Layerscape | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 448-BFBGA | 448-FBGA (17x17) | 2156-LS1028ACE7NQA | 4 | ARM® Cortex®-A72 | 1.3GHz | 2 Core, 64-Bit | - | DDR3L, DDR4 | Yes | - | 1Gbps (1), 2.5Gbps (5) | SATA 6Gbps (1) | USB 3.0 (2) | - | Secure Boot, TrustZone® | CANbus, I²C, SPI, UART | ||||||||||||||||||||||||||||||
|
NCX2200GW,125 | 0.1800 | |
99 | 0.00000000 | NXP Semiconductors | - | Bulk | Active | -40°C ~ 85°C | Surface Mount | 5-TSSOP, SC-70-5, SOT-353 | General Purpose | Complementary, Rail-to-Rail | 5-TSSOP | 2156-NCX2200GW,125 | 1,636 | 1 | 1.3V ~ 5.5V | 30mV @ 5.5V | 1pA @ 5.5V | 68mA @ 5.5V | 9µA | 70dB CMRR, 80dB PSRR | 800ns (Typ) | 20mV | ||||||||||||||||||||||||||||||||
|
MC7457RX1000NC | 437.5700 | |
2 | 0.00000000 | NXP Semiconductors | MPC7457 | Bulk | Active | 0°C ~ 105°C (TA) | Surface Mount | 483-BCBGA, FCBGA | 483-FCCBGA (29x29) | 2156-MC7457RX1000NC | 1 | PowerPC G4 | 1GHz | 1 Core, 32-Bit | Multimedia; SIMD | - | No | - | - | - | - | 1.5V, 1.8V, 2.5V | - | - | ||||||||||||||||||||||||||||||
|
LS1088ASE7MQA | 154.7200 | |
40 | 0.00000000 | NXP Semiconductors | QorlQ LS1 | Bulk | Active | 0°C ~ 105°C (TJ) | Surface Mount | 780-BFBGA | 780-FBGA (23x23) | 2156-LS1088ASE7MQA | 2 | ARM® Cortex®-A53 | 1.2GHz | 8 Core, 64-Bit | Multimedia; NEON™ SIMD | DDR4 | No | - | 10GbE (2), 1GbE (8) | SATA 6Gbps (1) | USB 3.0 + PHY (2) | 1.2V | Secure Boot, TrustZone® | DUART, eMMC/SD/SDIO, I²C, IFC, PCI, SPI, UART | ||||||||||||||||||||||||||||||
|
MCIMX6S8DVM10AC | 29.7300 | |
180 | 0.00000000 | NXP Semiconductors | i.MX6S | Bulk | Active | 0°C ~ 95°C (TJ) | Surface Mount | 624-LFBGA | 624-MAPBGA (21x21) | 2156-MCIMX6S8DVM10AC | 11 | ARM® Cortex®-A9 | 1GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | DDR3, DDR3L, LPDDR2 | Yes | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Bluetooth, CANbus, ESAI, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | |||||||||||||||||||||||||||||||
|
MIMX8ML4DVNLZAB | 39.1600 | |
5 | 0.00000000 | NXP Semiconductors | i.MX8M | Bulk | Active | 0°C ~ 95°C (TJ) | Surface Mount | 548-LFBGA | 548-LFBGA (15x15) | 2156-MIMX8ML4DVNLZAB | 5A992C | 8542.31.0001 | 8 | ARM® Cortex®-A53 | 1.8GHz | 4 Core, 64-Bit | ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP | DDR4, LPDDR4 | Yes | HTML, LVDS, MIPI-CSI, MIPI-DSI | GbE (2) | - | USB 2.0 + PHY (2), USB 3.0 + PHY (2) | - | ARM TZ, CAAM, RDC | |||||||||||||||||||||||||||||
|
LPC1113JHN33/203E | - | |
2011 | 0.00000000 | NXP Semiconductors | LPC11xx | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | 2156-LPC1113JHN33/203E | 1 | 28 | ARM® Cortex®-M0 | 32-Bit | 50MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 24KB (24K x 8) | FLASH | - | 4K x 8 | 1.8V ~ 3.6V | A/D 8x10b SAR | Internal | ||||||||||||||||||||||||||||||
|
MPC561CVR40 | - | |
8850 | 0.00000000 | NXP Semiconductors | - | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 388-BBGA | 388-PBGA (27x27) | 2156-MPC561CVR40 | 1 | 16 | PowerPC | 32-Bit | 40MHz | CANbus, EBI/EMI, SCI, SPI, UART/USART | POR, PWM, WDT | - | ROMless | - | 32K x 8 | 2.5V ~ 2.7V | A/D 32x10b SAR | External | ||||||||||||||||||||||||||||||
|
LPC11U37HFBD64/4QL | 4.3500 | |
750 | 0.00000000 | NXP Semiconductors | LPC11U3x | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | 64-LQFP (10x10) | 2156-LPC11U37HFBD64/4QL | 70 | 54 | ARM® Cortex®-M0 | 32-Bit | 50MHz | I²C, Microwire, SmartCard, SPI, SSP, UART/USART, USB | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 10K x 8 | 1.8V ~ 3.6V | A/D 8x10b SAR | Internal | ||||||||||||||||||||||||||||||
|
LPC54018J2MET180E | 7.4300 | |
69 | 0.00000000 | NXP Semiconductors | LPC54018JxM | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 180-TFBGA | 180-TFBGA (12x12) | 2156-LPC54018J2MET180E | 41 | 137 | ARM® Cortex®-M4 | 32-Bit | 180MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | 2MB (2M x 8) | FLASH | - | 360K x 8 | 1.71V ~ 3.6V | A/D 12x12b SAR | External, Internal | ||||||||||||||||||||||||||||||
|
LPC3230FET296/01,5 | 3.8600 | |
199 | 0.00000000 | NXP Semiconductors | LPC3200 | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 296-TFBGA | 296-TFBGA (15x15) | 2156-LPC3230FET296/01,5 | 78 | 51 | ARM926EJ-S | 16/32-Bit | 266MHz | EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG | DMA, I²S, LCD, Motor Control PWM, PWM, WDT | - | ROMless | - | 256K x 8 | 0.9V ~ 3.6V | A/D 3x10b SAR | Internal | ||||||||||||||||||||||||||||||
|
MK21DX128AVMC5 | 6.7900 | |
161 | 0.00000000 | NXP Semiconductors | Kinetis K20 | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | 121-MAPBGA (8x8) | 2156-MK21DX128AVMC5 | 45 | 64 | ARM® Cortex®-M4 | 32-Bit | 50MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 1x16b SAR; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||
|
MCF54452VR266557 | - | |
1538 | 0.00000000 | NXP Semiconductors | - | Bulk | Active | 2156-MCF54452VR266557 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||
|
S29GL064S70DHI010 | - | |
8833 | 0.00000000 | NXP Semiconductors | - | Bulk | Active | 2156-S29GL064S70DHI010 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||
|
LPC2926FBD144,551 | 13.1000 | |
230 | 0.00000000 | NXP Semiconductors | LPC2900 | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | 144-LQFP (20x20) | 2156-LPC2926FBD144,551 | 23 | 104 | ARM968E-S | 16/32-Bit | 125MHz | CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB | DMA, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 16K x 8 | 56K x 8 | 2.7V ~ 3.6V | A/D 24x10b SAR | Internal | ||||||||||||||||||||||||||||||
|
LPC2294HBD144/01,5 | - | |
4544 | 0.00000000 | NXP Semiconductors | - | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 144-LQFP | 144-LQFP (20x20) | 2156-LPC2294HBD144/01,5 | 1 | 112 | ARM7TDMI-S | 16/32-Bit | 60MHz | CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART | POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 16K x 8 | 1.65V ~ 1.95V, 3V ~ 3.6V | A/D 8x10b SAR | Internal | ||||||||||||||||||||||||||||||
|
MKL13Z32VLH4 | 2.7500 | |
3361 | 0.00000000 | NXP Semiconductors | - | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | 64-LQFP (10x10) | 2156-MKL13Z32VLH4 | 97 | 54 | ARM® Cortex®-M0+ | 32-Bit | 48MHz | FlexIO, I²C, IrDA, SPI, UART/USART | DMA, PWM, WDT | 32KB (32K x 8) | FLASH | - | 4K x 8 | 1.71V ~ 3.6V | A/D 20x16b SAR; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||
|
MCIMX6U1AVM10AC | 48.1600 | |
600 | 0.00000000 | NXP Semiconductors | i.MX6S | Bulk | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | 624-MAPBGA (21x21) | 2156-MCIMX6U1AVM10AC | 7 | ARM® Cortex®-A9 | 1GHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | DDR3, DDR3L, LPDDR2 | Yes | HDMI, Keypad, LCD, LVDS, MIPI | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Bluetooth, CANbus, ESAI, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | ||||||||||||||||||||||||||||||
|
MIMX8MN2DVTJZAA | 19.4100 | |
250 | 0.00000000 | NXP Semiconductors | - | Bulk | Active | 0°C ~ 95°C (TJ) | Surface Mount | 486-LFBGA | 486-LFBGA (14x14) | 2156-MIMX8MN2DVTJZAA | 16 | ARM® Cortex®-A53, ARM® Cortex®-M7 | 1.5GHz, 750MHz | 2 Core, 64-Bit | Multimedia; NEON™ MPE | DDR3L, DDR4, LPDDR4 | Yes | LCD, MIPI-CSI, MIPI-DSI | GbE (1) | - | USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 3.3V | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | AC'97, I²C, I²S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART | ||||||||||||||||||||||||||||||
|
S912XD128F2CAA | - | |
6857 | 0.00000000 | NXP Semiconductors | S12XD | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 80-QFP | 80-QFP (14x14) | 2156-S912XD128F2CAA | 1 | 59 | HCS12X | 16-Bit | 80MHz | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 2.35V ~ 2.75V | A/D 8x10b SAR | External, Internal | ||||||||||||||||||||||||||||||
|
MCIMX6U1AVM08AC | 38.9500 | |
600 | 0.00000000 | NXP Semiconductors | i.MX6S | Bulk | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | 624-MAPBGA (21x21) | 2156-MCIMX6U1AVM08AC | 8 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | DDR3, DDR3L, LPDDR2 | Yes | HDMI, Keypad, LCD, LVDS, MIPI | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Bluetooth, CANbus, ESAI, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | ||||||||||||||||||||||||||||||
|
LS1012AXE7EKA | 25.5500 | |
840 | 0.00000000 | NXP Semiconductors | QorlQ LS1 | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 211-VFLGA | 211-FCLGA (9.6x9.6) | 2156-LS1012AXE7EKA | 12 | ARM® Cortex®-A53 | 600MHz | 1 Core, 64-Bit | - | DDR3L | - | - | GbE (2) | SATA 6Gbps (1) | USB 2.0 (1), USB 3.0 + PHY | - | Secure Boot, TrustZone® |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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