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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Type Material Base Product Number Accessory Type For Use With/Related Products Thickness Weight Shelf Life Shelf Life Start Storage/Refrigeration Temperature Shipping Info DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Composition Form Pitch Diameter Number of Positions Melting Point Flux Type Wire Gauge Process SIC Storage Mesh Type Inner Dimension Outer Dimension Thermal Center Pad
SMD2190-25000 Chip Quik Inc. SMD2190-25000 16.9900
RFQ
ECAD 7131 0.00000000 Chip Quik Inc. SMD2 Jar Active Solder Sphere 24 Months Date of Manufacture - download RoHS non-compliant Not Applicable REACH Unaffected EAR99 8311.30.3000 1 Sn63Pb37 (63/37) Jar 0.020" (0.51mm) 361°F (183°C) - - Leaded -
SMD2140-25000 Chip Quik Inc. SMD2140-25000 21.9900
RFQ
ECAD 3 0.00000000 Chip Quik Inc. SMD2 Bulk Active Solder Sphere - 24 Months Date of Manufacture - - download RoHS non-compliant Not Applicable REACH Affected EAR99 8311.90.0000 1 Sn63Pb37 (63/37) Jar 0.008" (0.20mm) 361°F (183°C) - - Leaded
SMD2170-25000 Chip Quik Inc. SMD2170-25000 19.9500
RFQ
ECAD 5 0.00000000 Chip Quik Inc. SMD2 Bulk Active Solder Sphere - 24 Months Date of Manufacture - - download RoHS non-compliant Not Applicable REACH Affected EAR99 8311.90.0000 1 Sn63Pb37 (63/37) Jar 0.014" (0.36mm) 361°F (183°C) - - Leaded
SMD291SNL50T6 Chip Quik Inc. SMD291SNL50T6 99.9500
RFQ
ECAD 2 0.00000000 Chip Quik Inc. SMD Bulk Active Solder Paste SMD291 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 315-SMD291SNL50T6 EAR99 8311.90.0000 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g) - 422 ~ 428°F (217 ~ 220°C) No-Clean - Lead Free 6
CQ100GE.020 1LB Chip Quik Inc. CQ100GE.020 1LB 64.0300
RFQ
ECAD 27 0.00000000 Chip Quik Inc. - Bulk Active Wire Solder CQ100G - - - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 315-CQ100GE.0201LB EAR99 8311.90.0000 1 Sn99.244Cu0.7 (Ni0.05/Ge0.006) Spool, 1 lb (454 g) 0.020" (0.51mm) 441°F (227°C) No-Clean - Lead Free
EXB-SN96.5AG3.0CU0.5-0.5LB Chip Quik Inc. EXB-SN96.5AG3.0CU0.5-0.5LB 34.4400
RFQ
ECAD 60 0.00000000 Chip Quik Inc. Super Low Dross™ Bulk Active Bar Solder EXB-SN96 - - - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 315-EXB-SN96.5AG3.0CU0.5-0.5LB EAR99 8311.90.0000 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Bar, 0.5 lb (227g) - 423 ~ 428°F (217 ~ 220°C) - - Leaded
NC191LTA500T5C Chip Quik Inc. NC191LTA500T5C 135.9000
RFQ
ECAD 1 0.00000000 Chip Quik Inc. Smooth Flow™ Bulk Active Solder Paste NC191 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 315-NC191LTA500T5C EAR99 3810.10.0000 1 Bi57Sn42Ag1 (57/42/1) Cartridge, 17.64 oz (500g) - 279°F (137°C) No-Clean - - 5
NC191LTA50 Chip Quik Inc. NC191LTA50 18.9500
RFQ
ECAD 6823 0.00000000 Chip Quik Inc. Smooth Flow™ Bulk Active Solder Paste NC191 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 315-NC191LTA50 EAR99 3810.10.0000 1 Bi57Sn42Ag1 (57/42/1) Jar, 1.76 oz (50g) - 279°F (137°C) No-Clean - - 4
NC191LTA250 Chip Quik Inc. NC191LTA250 57.9500
RFQ
ECAD 8544 0.00000000 Chip Quik Inc. Smooth Flow™ Bulk Active Solder Paste NC191 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 315-NC191LTA250 EAR99 3810.10.0000 1 Bi57Sn42Ag1 (57/42/1) Jar, 8.8 oz (250g) - 279°F (137°C) No-Clean - - 4
NCSW.020 0.3OZ Chip Quik Inc. NCSW.020 0.3OZ 3.1800
RFQ
ECAD 8 0.00000000 Chip Quik Inc. - Bulk Active Wire Solder NCSW - - - download RoHS non-compliant 1 (Unlimited) REACH Affected 315-NCSW.0200.3OZ EAR99 8311.30.3000 1 Sn63Pb37 (63/37) Tube, 0.3 oz (8.51g) 0.020" (0.51mm) 361°F (183°C) No-Clean 24 AWG, 25 SWG Leaded
NCSWLF.031 0.5OZ Chip Quik Inc. NCSWLF.031 0.5OZ 4.6700
RFQ
ECAD 627 0.00000000 Chip Quik Inc. - Bulk Active Wire Solder NCSW - - - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 315-NCSWLF.0310.5OZ EAR99 8311.30.6000 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Tube, 0.50 oz (14.17g) 0.031" (0.79mm) 423 ~ 428°F (217 ~ 220°C) No-Clean 20 AWG, 21 SWG -
SMD4300LTLFP250T4 Chip Quik Inc. SMD4300LTLFP250T4 106.8000
RFQ
ECAD 4295 0.00000000 Chip Quik Inc. - Bulk Active Solder Paste - 6 Months Date of Manufacture 32°F ~ 77°F (0°C ~ 25°C) - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 3810.10.0000 1 Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g) - 280°F (138°C) No-Clean - Lead Free
TS391SNL250 Chip Quik Inc. TS391SNL250 69.9500
RFQ
ECAD 8241 0.00000000 Chip Quik Inc. - Bulk Active Solder Paste TS391S 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C) - download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 3810.10.0000 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g) - 423 ~ 428°F (217 ~ 220°C) No-Clean - Lead Free 4
SMD291SNL500T5 Chip Quik Inc. SMD291SNL500T5 198.9500
RFQ
ECAD 8103 0.00000000 Chip Quik Inc. - Jar Active Solder Paste SMD291 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 3810.10.0000 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g) - 423 ~ 428°F (217 ~ 220°C) No-Clean - Lead Free 5
SMD4300AX250T5 Chip Quik Inc. SMD4300AX250T5 98.9500
RFQ
ECAD 4 0.00000000 Chip Quik Inc. CHIPQUIK® SMD4300 Jar Active Solder Paste SMD4300 0.551 lb (249.93 g) 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8311.30.6000 1 Sn63Pb37 (63/37) Jar, 8.8 oz (250g) - 361°F (183°C) No-Clean, Water Soluble - Leaded Refrigerated 5
WS991LT35T4 Chip Quik Inc. WS991LT35T4 42.4400
RFQ
ECAD 6 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active Solder Paste - 12 Months Date of Manufacture 37°F ~ 77°F (3°C ~ 25°C) - download ROHS3 Compliant Not Applicable REACH Unaffected 315-WS991LT35T4 EAR99 3810.10.0000 1 Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 1.23 oz (34.869g) - 280°F (138°C) Water Soluble - - 4
IPC0222-S Chip Quik Inc. IPC0222-S 12.9300
RFQ
ECAD 1754 0.00000000 Chip Quik Inc. Proto-Advantage IPC Bulk Active QFN Stainless Steel 0.0040" (0.102mm) - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 7326.90.8688 1 0.039" (1.00mm) 12 0.157" L x 0.157" W (4.00mm x 4.00mm) 1.300" L x 0.900" W (33.02mm x 22.86mm) 0.083" L x 0.083" W (2.10mm x 2.10mm)
IPC0092-S Chip Quik Inc. IPC0092-S 11.5900
RFQ
ECAD 4601 0.00000000 Chip Quik Inc. Proto-Advantage IPC Bulk Active PowerSSOP Stainless Steel 0.0040" (0.102mm) download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 7218.10.0000 1 0.026" (0.65mm) 30 0.433" L x 0.240" W (11.00mm x 6.10mm) 1.300" L x 0.900" W (33.02mm x 22.86mm) 0.162" L x 0.154" W (4.11mm x 3.91mm)
SMDSW.020 1LB Chip Quik Inc. SMDSW.020 1LB 41.5100
RFQ
ECAD 4 0.00000000 Chip Quik Inc. - Bulk Active Wire Solder SMDSW - - - - download RoHS non-compliant Not Applicable REACH Affected EAR99 8311.30.3000 1 Sn63Pb37 (63/37) Spool, 1 lb (454 g) 0.020" (0.51mm) 361°F (183°C) No-Clean, Water Soluble 24 AWG, 25 SWG Leaded -
SMD291AX Chip Quik Inc. SMD291AX 14.9900
RFQ
ECAD 40 0.00000000 Chip Quik Inc. - Syringe Active Solder Paste SMD291 0.033 lb (14.97 g) 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. download RoHS non-compliant Not Applicable REACH Affected SMD 291AX EAR99 3810.10.0000 1 Sn63Pb37 (63/37) Syringe, 0.53 oz (15g), 5cc - 361°F (183°C) No-Clean - Leaded Refrigerated 3
RASW.020 4OZ Chip Quik Inc. RASW.020 4OZ 10.8700
RFQ
ECAD 4 0.00000000 Chip Quik Inc. - Bulk Active Wire Solder RASW.020 60 Months Date of Manufacture download RoHS non-compliant Not Applicable REACH Affected RASW.0204OZ EAR99 8311.30.6000 1 Sn63Pb37 (63/37) Spool, 4 oz (113.40g) 0.020" (0.51mm) 361°F (183°C) Rosin Activated (RA) 24 AWG, 25 SWG Leaded
SMD4300AX500T5C Chip Quik Inc. SMD4300AX500T5C 180.7500
RFQ
ECAD 1534 0.00000000 Chip Quik Inc. CHIPQUIK® SMD4300 Cartridge Active Solder Paste SMD4300 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8311.30.6000 1 Sn63Pb37 (63/37) Cartridge, 17.64 oz (500g) - 361°F (183°C) No-Clean, Water Soluble - Leaded 5
CQ-SS-SNBIAG-0.25MM-25000 Chip Quik Inc. CQ-SS-SNBIAG-0.25MM-25000 57.9500
RFQ
ECAD 5 0.00000000 Chip Quik Inc. - Bulk Active Solder Sphere - 24 Months Date of Manufacture - - download ROHS3 Compliant 1 (Unlimited) 315-CQ-SS-SNBIAG-0.25MM-25000 EAR99 8311.90.0000 1 Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar 0.010" (0.25mm) 280°F (138°C) - - -
SMD2195 Chip Quik Inc. SMD2195 83.9500
RFQ
ECAD 2 0.00000000 Chip Quik Inc. SMD2 Bulk Active Solder Sphere - 24 Months Date of Manufacture - - download RoHS non-compliant Not Applicable REACH Affected EAR99 8311.90.0000 1 Sn63Pb37 (63/37) Jar 0.022" (0.56mm) 361°F (183°C) - - Leaded
SMDSWLF.020 8OZ Chip Quik Inc. SMDSWLF.020 8OZ 57.4000
RFQ
ECAD 10 0.00000000 Chip Quik Inc. - Bulk Active Wire Solder SMDSW - - - - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8311.30.3000 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 8 oz (227g), 1/2 lb 0.020" (0.51mm) 423 ~ 428°F (217 ~ 220°C) No-Clean, Water Soluble 24 AWG, 25 SWG Lead Free -
CQ-SS-SNBIAG-0.30MM-25000 Chip Quik Inc. CQ-SS-SNBIAG-0.30MM-25000 59.9500
RFQ
ECAD 5 0.00000000 Chip Quik Inc. - Bulk Active Solder Sphere - 24 Months Date of Manufacture - - download ROHS3 Compliant 1 (Unlimited) 315-CQ-SS-SNBIAG-0.30MM-25000 EAR99 8311.90.0000 1 Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar 0.012" (0.31mm) 280°F (138°C) - - -
SMDSWLF.031 .7OZ Chip Quik Inc. SMDSWLF.031 .7OZ 9.9900
RFQ
ECAD 5 0.00000000 Chip Quik Inc. SMD Bulk Active Wire Solder SMDSW - - - - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected SMDSWLF.031.7OZ EAR99 8311.90.0000 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Tube, 0.7 oz (19.85g) 0.031" (0.79mm) 423 ~ 428°F (217 ~ 220°C) No-Clean, Water Soluble 20 AWG, 21 SWG Lead Free -
SMDSN60BI40 Chip Quik Inc. SMDSN60BI40 19.9500
RFQ
ECAD 2919 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active Wire Solder - 60 Months Date of Manufacture - - download ROHS3 Compliant Not Applicable REACH Unaffected 315-SMDSN60BI40 EAR99 8311.30.6000 1 Sn60Bi40 (60/40) Spool 0.031" (0.79mm) 280°F ~ 338°F (138°C ~ 170°C) - - Lead Free
REM16 Chip Quik Inc. REM16 70.4900
RFQ
ECAD 3 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active Removal Alloy SMD Components - - - download RoHS non-compliant 1 (Unlimited) REACH Affected 315-REM16 EAR99 8311.30.3000 1
GEN-DR050-P40-S Chip Quik Inc. GEN-DR050-P40-S 17.5900
RFQ
ECAD 4879 0.00000000 Chip Quik Inc. Proto-Advantage GEN Bulk Active - Stainless Steel GEN-D - - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 7326.90.8688 1 0.020" (0.50mm) 40 - - -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse