Tel: +86-0755-83501315
Email: sales@sic-components.com
Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() |
TE0820-03-3BE21FA | - | ![]() |
9961 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1 (Unlimited) | 1686-TE0820-03-3BE21FA | OBSOLETE | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||||
![]() |
TE0803-03-4BI21-A | - | ![]() |
3292 | 0.00000000 | Trenz Electronic GmbH | * | Bulk | Active | TE0803 | - | ROHS3 Compliant | Not Applicable | 1686-TE0803-03-4BI21-A | 1 | |||||||||||||
![]() |
TE0803-02-04CG-1EA | - | ![]() |
9145 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | Not Applicable | 1686-TE0803-02-04CG-1EA | OBSOLETE | 1 | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
![]() |
TE0803-02-04EG-1ID | - | ![]() |
6788 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | - | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | Not Applicable | 1686-TE0803-02-04EG-1ID | OBSOLETE | 1 | - | - | - | - | MPU Core | - | B2B | |||||
![]() |
TEC0850-03-BBEX1-A | - | ![]() |
4029 | 0.00000000 | Trenz Electronic GmbH | * | Bulk | Active | TEC0850 | - | ROHS3 Compliant | Not Applicable | 1686-TEC0850-03-BBEX1-A | 1 | |||||||||||||
![]() |
SCM-20260E-B | 55.0000 | ![]() |
4058 | 0.00000000 | GHI Electronics, LLC | - | Box | Active | -40°C ~ 85°C | - | SCM-20260 | download | ROHS3 Compliant | REACH Unaffected | 1711-SCM-20260E-B | 3A991A2 | 8473.30.1180 | 1 | SITCore | 480MHz | 32MB | 16MB | MPU Core | - | - | ||
![]() |
L138-DG-225-RI-1 | - | ![]() |
8183 | 0.00000000 | Critical Link LLC | MityDSP-L138F | Bulk | Obsolete | -40°C ~ 85°C | 2.660" L x 2.000" W (67.60mm x 50.80mm) | - | 1057-L138-DG-225-RI-1 | OBSOLETE | 1 | ARM926EJ-S, OMAP-L138 | 375MHz | 8kB (Internal), 128MB (External) | 256MB (NAND), 8MB (NOR) | MPU, DSP, FPGA Core | TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA) | SO-DIMM-200 | ||||||
![]() |
1810-DG-225-RI | - | ![]() |
1503 | 0.00000000 | Critical Link LLC | MitySOM | Bulk | Obsolete | -40°C ~ 85°C | 2.660" L x 2.000" W (67.60mm x 50.80mm) | download | 1057-1810-DG-225-RI | OBSOLETE | 1 | Spartan-6, XC6SLX16 | 375MHz | 8kB (Internal), 128MB (External) | 256MB (NAND), 8MB (NOR) | MPU, FPGA Core | Spartan-6, XC6SLX16 | SO-DIMM-200 | ||||||
![]() |
DG8065101418900 | 22.7300 | ![]() |
10 | 0.00000000 | Intel | * | Bulk | Active | - | Not applicable | 3 (168 Hours) | Vendor Undefined | 0000.00.0000 | 1 | |||||||||||||
![]() |
D8087-1 | 426.8500 | ![]() |
397 | 0.00000000 | Rochester Electronics, LLC | * | Bulk | Active | download | RoHS non-compliant | 3 (168 Hours) | Vendor Undefined | EAR99 | 8542.39.0001 | 1 | ||||||||||||
![]() |
TE0745-02-72I31-A | 781.2100 | ![]() |
3987 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-72I31-A | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | Board-to-Board (BTB) Socket - 480 | |||||
![]() |
TE0745-02-93E31-A | 2.0000 | ![]() |
9075 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-93E31-A | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | |||||
![]() |
TE0745-02-92I31-AK | 1.0000 | ![]() |
8083 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-92I31-AK | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | |||||
![]() |
TE0745-02-92I31-F | 2.0000 | ![]() |
5572 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-92I31-F | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | |||||
![]() |
TE0745-02-92I31-A | 1.0000 | ![]() |
5510 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-92I31-A | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | |||||
![]() |
TE0745-02-92I31-B | - | ![]() |
9269 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-92I31-B | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | |||||
![]() |
TE0745-02-92I11-F | - | ![]() |
3557 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-92I11-F | OBSOLETE | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ||||
![]() |
S00005 | - | ![]() |
5633 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Obsolete | - | ROHS3 Compliant | Not Applicable | 1686-S00005 | OBSOLETE | 1 | |||||||||||||
![]() |
TE0745-02-93E11-KA | - | ![]() |
8013 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-93E11-KA | OBSOLETE | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ||||
![]() |
TE0782-02-82I33FA | - | ![]() |
7041 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0782-02-82I33FA | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7035) | Board-to-Board (BTB) Socket - 480 | |||||
SOMIMX8MMQ-10-1BE4SMIR | 353.0028 | ![]() |
7246 | 0.00000000 | Beacon EmbeddedWorks | i.MX 8M Mini | Bulk | Active | -40°C ~ 85°C | 1.100" L x 1.500" W (28.00mm x 38.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 5A992C SC | 8542.39.0001 | 1 | ARM® Cortex®-A53, ARM® Cortex™-M4 | 1.8GHz, 400MHz | 4GB | 32GB | MPU Core | - | 3 x 100 Pins HD Connectors | ||||
![]() |
TE0803-04-4DE21-L | 676.2000 | ![]() |
2188 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-4DE21-L | 1 | Zynq UltraScale+ XCZU4EV-1SFVC784E | - | 4GB | 128MB | MPU Core | - | B2B | |||||
![]() |
TE0803-04-4DE11-A | 649.9500 | ![]() |
9559 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-4DE11-A | 1 | Zynq UltraScale+ XCZU4EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
![]() |
TE0729-02-2IRA | - | ![]() |
1815 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Discontinued at SIC | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0729-02-2IRA | 1 | ARM Cortex-A9 | - | 512MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | |||||
![]() |
TE0712-02-82I36-A | - | ![]() |
4636 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-82I36-A | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
![]() |
TE0712-02-81I36-L | - | ![]() |
2842 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-81I36-L | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
![]() |
SM-K26-XCL2GI | 585.0000 | ![]() |
466 | 0.00000000 | AMD | Zynq® UltraScale+™ Kria™ | Box | Active | -40°C ~ 100°C (TJ) | 3.030" L x 2.360" W (77.00mm x 60.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 122-SM-K26-XCL2GI | 5A992C | 8471.50.0150 | 1 | ARM® Cortex®-A53 | 533MHz, 1.333GHz | 4GB | 16GB eMMC, 64MB QSPI | FPGA Core | Arm® Cortex®-R5F | 2 x 240 Pin | |||
![]() |
TE0720-03-61Q43GA | - | ![]() |
8263 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-61Q43GA | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||
![]() |
TE0720-03-61Q33FL | - | ![]() |
4524 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-61Q33FL | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||||
![]() |
TE0720-03-62I12GA | - | ![]() |
3757 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-62I12GA | OBSOLETE | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B |
Daily average RFQ Volume
Standard Product Unit
Worldwide Manufacturers
In-stock Warehouse