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Microcontrollers, Microprocessor, FPGA Modules(1588)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0745-02-71I11-A | - |  |
2876 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0745 | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-71I11-A | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec ST5 | ||
 |
DC-ME-01T-IZU | - | |
5670 | 0.00000000 | Digi | Digi Connect ME® | Bulk | Obsolete | -40°C ~ 85°C | 0.750" L x 1.440" W (19.10mm x 36.70mm) | - | 1 (Unlimited) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 1 | ARM7TDMI, NS7520 | 55MHz | 8MB | 2MB | MPU Core | - | RJ45 | ||||
 |
EC-VA-H264-10B-30-1080-MXC-LL | - | |
1490 | 0.00000000 | System-On-Chip (SOC) Technologies Inc. | H.264-HD Encoder | Bulk | Discontinued at SIC | 0°C ~ 85°C | 2.700" L x 2.000" W (68.00mm x 51.00mm) | download | RoHS Compliant | 0000.00.0000 | 1 | Artix-7 A200T | - | 256KB | 32MB | FPGA Core | - | SO-DIMM-204 | ||||||
|
FS-3030 | - | |
1036 | 0.00000000 | Digi | - | Bulk | Obsolete | - | 1 (Unlimited) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 1 | |||||||||||||
 |
TE0600-02IMVF | - | |
8750 | 0.00000000 | Trenz Electronic GmbH | TE0600 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-150 | 125MHz | 1GB | 16MB | FPGA Core | - | Samtec LSHM | ||||
 |
TE0726-03IM | - | |
4926 | 0.00000000 | Trenz Electronic GmbH | TE0726 | Bulk | Obsolete | 0°C ~ 70°C | 1.180" L x 1.570" W (30.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0726-03IM | OBSOLETE | 1 | ARM Cortex-A9 | - | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | CSI, DSI | ||||
 |
OSD32MP153A-512M-IAA | - | |
6517 | 0.00000000 | Octavo Systems LLC | - | Tray | Active | -40°C ~ 85°C | 0.710" L x 0.710" W (18.00mm x 18.00mm) | download | 1676-OSD32MP153A-512M-IAA | 65 | Arm® Dual Cortex®-A7, Arm® Cortex®-M4 | 650MHz | 512MB | - | MPU Core | NEON™ SIMD | 302-BGA | |||||||
|
L138-FI-325-RC | 756.5800 | |
1 | 0.00000000 | Critical Link LLC | MityDSP-L138F | Bag | Obsolete | 0°C ~ 70°C | 2.660" L x 2.000" W (67.60mm x 50.80mm) | L138-FI | download | ROHS3 Compliant | 1 (Unlimited) | 3A991A2 | 8473.30.1180 | 1 | ARM926EJ-S, OMAP-L138 | 456MHz | 128MB | 256MB (NAND), 16MB (NOR) | MPU, DSP, FPGA Core | TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA) | SO-DIMM-200 | |||
 |
TE0720-03-62I33MAN | - | |
9415 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-62I33MAN | 1 | ARM Cortex-A9 | - | 1GB | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||
|
TE0820-05-2BI81ML | 459.0000 | |
3508 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-2BI81ML | 1 | ||||||||||||||
|
TE0820-05-2BE81MA | 426.0000 | |
3844 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-2BE81MA | 1 | ||||||||||||||
|
TE0783-02-92I33MA | 2.0000 | |
8541 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Active | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | - | ROHS3 Compliant | 1686-TE0783-02-92I33MA | 1 | Zynq™ 7000 XC7Z045-2FFG900I | - | 1GB | 32MB | MPU Core | ARM Cortex-A9 | Board-to-Board (BTB) Socket | ||||||
|
TE0803-04-3AE11-AK | 476.0000 | |
7348 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-3AE11-AK | 1 | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 160 | |||||
|
TE0808-05-6BE21-A | 1.0000 | |
1068 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-6BE21-A | 1 | Zynq™ UltraScale+™ ZU6EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | 4 x 160 Pin | |||||
|
TE0865-02-DGE23MA | 5.0000 | |
1218 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 3.937" L x 2.953" W (100.00mm x 75.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0865-02-DGE23MA | 1 | Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E | - | 4GB | 256MB | MPU Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0817-01-7DE21-A | 1.0000 | |
4119 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0817-01-7DE21-A | 1 | Zynq UltraScale+ XCZU7EV-1FBVB900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0725LP-01-72I-1T | 212.1900 | |
3317 | 0.00000000 | Trenz Electronic GmbH | TE0725 | Bulk | Active | -40°C ~ 85°C | 2.870" L x 1.380" W (73.00mm x 35.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0725LP-01-72I-1T | 1 | Artix™ 7 XC7A100T-2CSG324I | 25MHz | - | 64MB | FPGA | - | 2 x 50 Pin | |||||
|
TE0820-05-5DI21MA | 1.0000 | |
4868 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-5DI21MA | 1 | Zynq UltraScale+ XCZU5EV-1SFVC784I | - | 2GB | 128MB | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | 2 x 100 Pin | |||||
|
AM0010-02-5DI21MA | 1.0000 | |
7444 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 2.220" L x 1.575" W (56.40mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-AM0010-02-5DI21MA | 1 | Zynq™ UltraScale+™ ZU5EV-1I | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0820-05-2AI81MA | 414.0000 | |
7931 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-2AI81MA | 1 | ||||||||||||||
|
TE0745-02-93E31-AK | 2.0000 | |
5313 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | 1686-TE0745-02-93E31-AK | 1 | Zynq™ 7045 SoC XC7Z045-3FFG676E | - | 1GB | 64MB | MPU Core | ARM Cortex-A9 | Board-to-Board (BTB) Socket | ||||||
|
TE0813-01-3BE11-A | 520.9300 | |
3537 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0813-01-3BE11-A | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0808-05-9GI81-AK | 1.0000 | |
9045 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-9GI81-AK | 1 | ||||||||||||||
|
TE0716-01-61C32-A | 313.0000 | |
1239 | 0.00000000 | Trenz Electronic GmbH | TE0711 | Bulk | Active | 0°C ~ 70°C | 2.559" L x 1.772" W (65.00mm x 45.00mm) | - | ROHS3 Compliant | 1686-TE0716-01-61C32-A | 1 | Zynq™ 7000 SoC XC7Z020 | - | 1GB | 32MB | FPGA | - | Board-to-Board (BTB) Socket, USB | ||||||
|
TE0821-01-3BE21MA | 527.0000 | |
5971 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0821-01-3BE21MA | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | 2 x 100 Pin | |||||
|
TE0818-01-9GI21-AK | 1.0000 | |
9517 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | 1686-TE0818-01-9GI21-AK | 1 | Zynq UltraScale+ XCZU9EG-2FFVC900I | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | ||||||
|
TE0727-02-41C34 | 105.5300 | |
3714 | 0.00000000 | Trenz Electronic GmbH | TE0722 | Bulk | Active | 0°C ~ 70°C | 2.559" L x 1.181" W (65.00mm x 30.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0727-02-41C34 | 1 | Zynq™ XC7Z010-1CLG225C | - | 512MB | 16MB | FPGA | - | USB | |||||
|
TE0715-05-52I33-A | 419.0000 | |
2425 | 0.00000000 | Trenz Electronic GmbH | TE0711 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0715-05-52I33-A | 1 | Zynq™ 7015 XC7Z015-2CLG485I | - | 1GB | 32MB | MPU Core | ARM Cortex-A9 | Board-to-Board (BTB) Socket | |||||
|
TE0808-05-BBE81-AK | 1.0000 | |
8978 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-BBE81-AK | 1 | ||||||||||||||
 |
A10S-P9-A5E-RI-SB | 2.0000 | |
5908 | 0.00000000 | Critical Link LLC | MitySOM | Bag | Active | -40°C ~ 85°C | 4.000" L x 4.000" W (101.50mm x 101.50mm) | A10S-P9 | download | 1 (Unlimited) | 1057-A10S-P9-A5E-RI-SB | 3A991A2 | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1.2GHz | 4GB | - | MPU, FPGA Core | NEON™ SIMD | Board-to-Board (BTB) |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
Wishlist (0 Items)