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Microcontrollers, Microprocessor, FPGA Modules(1588)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0807-02-4BE21-A | - |  |
1216 | 0.00000000 | Trenz Electronic GmbH | * | Bulk | Obsolete | download | Not Applicable | 1686-TE0807-02-4BE21-A | OBSOLETE | 1 | ||||||||||||||
 |
TE0745-02-81C11-A | - | |
5073 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0745 | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-81C11-A | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7035) | Samtec ST5 | ||
|
TEC0850-03-015EG1E | - | |
9065 | 0.00000000 | Trenz Electronic GmbH | TEC0850 | Bulk | Obsolete | - | - | TEC0850 | - | ROHS3 Compliant | Not Applicable | 1686-TEC0850-03-015EG1E | OBSOLETE | 1 | Zynq UltraScale+ XCZU15EG-1FFVB1156E | - | 8GB | 128MB | MCU, FPGA | - | CompactPCI Serial Backplane | |||
|
TE0841-02-31I21-A | - | |
4921 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0841 | download | ROHS3 Compliant | Not Applicable | 1686-TE0841-02-31I21-A | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU035 | - | 2GB | 64MB | FPGA Core | - | B2B | ||
|
TE0808-04-9BE21-L | 1.0000 | |
6225 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Box | Active | - | - | TE0808 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-9BE21-L | 1 | - | - | 4GB | 128MB | MPU Core | - | B2B | ||||
|
TE0808-04-09EG-1EL | - | |
2300 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-09EG-1EL | OBSOLETE | 1 | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | ||||
|
TE0808-04-6BE21-L | 1.0000 | |
2784 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-6BE21-L | 1 | Zynq UltraScale+ XCZU6EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | ||||
|
TE0808-04-6BE21-AK | 1.0000 | |
4607 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-6BE21-AK | 1 | Zynq UltraScale+ XCZU6EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | ||||
|
TE0745-02-71I11-AK | - | |
5264 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0745 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-71I11-AK | OBSOLETE | 1 | ARM® Cortex®-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec ST5 | |||
|
TE0745-02-45-3EA | - | |
3087 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Box | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-45-3EA | OBSOLETE | 1 | ARM® Cortex®-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Samtec ST5 | ||||
|
TE0808-05-9GI21-A | 1.0000 | |
1927 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Box | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 5A002A4 | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU9EG-2FFVC900I | - | 4GB | 128MB | MPU Core | - | B2B | ||||
|
DC-VA-H264-10B-60-4K-MD00C-SX660 | 1.0000 | |
6265 | 0.00000000 | System-On-Chip (SOC) Technologies Inc. | H.264-HD Encoder | Box | Active | - | - | DC-VA-H264 | download | 1962-DC-VA-H264-10B-60-4K-MD00C-SX660 | 1 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | 512MB | 128KB | FPGA Core | - | - | ||||||
|
DC-VA-H264-10B-60-1080-OPVXC-0000 | 2.0000 | |
9744 | 0.00000000 | System-On-Chip (SOC) Technologies Inc. | * | Box | Active | DC-VA-H264 | download | 1962-DC-VA-H264-10B-60-1080-OPVXC-0000 | 1 | |||||||||||||||
|
2EC-VA-H264-10B-30-1080-MD00C-A200T | 974.4000 | |
2861 | 0.00000000 | System-On-Chip (SOC) Technologies Inc. | - | Box | Active | - | - | 2EC-VA | download | 1962-2EC-VA-H264-10B-30-1080-MD00C-A200T | 3A991D | 8473.30.1180 | 1 | - | - | 512MB | 32MB | DSP, FPGA Core | Xilinx Artix-7 XC7A200T | SO-DIMM | ||||
|
DC-VA-H264-10B-60-4K-OPVIC-0000 | 2.0000 | |
5772 | 0.00000000 | System-On-Chip (SOC) Technologies Inc. | * | Box | Active | DC-VA-H264 | download | 1962-DC-VA-H264-10B-60-4K-OPVIC-0000 | 1 | |||||||||||||||
|
2DC-VA-H264-10B-30-1080-MD00C-A200T | 974.4000 | |
1993 | 0.00000000 | System-On-Chip (SOC) Technologies Inc. | - | Box | Active | - | - | 2DC-VA | download | 1962-2DC-VA-H264-10B-30-1080-MD00C-A200T | 3A991D | 8473.30.1180 | 1 | - | - | 512MB | 32MB | DSP, FPGA Core | Xilinx Artix-7 XC7A200T | SO-DIMM | ||||
|
EC-VA-H264-10B-60-1080-MD00C-A200T | 760.2000 | |
2321 | 0.00000000 | System-On-Chip (SOC) Technologies Inc. | - | Box | Active | - | - | EC-VA-H264 | download | 1962-EC-VA-H264-10B-60-1080-MD00C-A200T | 3A991D | 8473.30.1180 | 1 | - | - | 512MB | 32MB | DSP, FPGA Core | Xilinx Artix-7 XC7A200T | SO-DIMM | ||||
|
DC-VA-MEPG2-8B-60-1080-OPVXC-0000 | 2.0000 | |
7374 | 0.00000000 | System-On-Chip (SOC) Technologies Inc. | * | Box | Active | DC-VA-MEPG2 | download | 1962-DC-VA-MEPG2-8B-60-1080-OPVXC-0000 | 1 | |||||||||||||||
|
4EC-VA-H265-10B-60-1080-MD00C-SX660 | 2.0000 | |
9455 | 0.00000000 | System-On-Chip (SOC) Technologies Inc. | H.265-HD Encoder | Box | Active | - | - | download | 1962-4EC-VA-H265-10B-60-1080-MD00C-SX660 | 1 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | 512MB | 128KB | FPGA Core | - | - | |||||||
 |
MYC-C7Z015-4E1D-766-I | 225.0000 | |
5873 | 0.00000000 | MYIR Tech Limited | Zynq®-7000 | Box | Active | -40°C ~ 85°C | 2.950" L x 2.170" W (75.00mm x 55.00mm) | download | ROHS3 Compliant | 3309-MYC-C7Z015-4E1D-766-I | EAR99 | 8473.30.1180 | 1 | ARM® Cortex®-A9 | 766MHz | 1GB | 4GB | MPU, FPGA Core | Zynq-7000 (Z-7015) | Board-to-Board (BTB) Socket | ||||
|
MYC-YA151C-4E512D-65-C-T | 33.0000 | |
5 | 0.00000000 | MYIR Tech Limited | - | Box | Active | 0°C ~ 70°C | 1.540" L x 1.460" W (39.00mm x 37.00mm) | download | ROHS3 Compliant | Not Applicable | Vendor Undefined | 3309-MYC-YA151C-4E512D-65-C-T | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A7, ARM® Cortex®-M4 | 650MHz | 512MB | 4GB | MPU Core | - | Pin Header | ||
|
TE0820-04-4BI21KL | - | |
6501 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-4BI21KL | OBSOLETE | 1 | - | - | - | - | - | - | |||||
|
TE0820-04-2BE21-V1 | - | |
6334 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2BE21-V1 | OBSOLETE | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||
|
TE0720-03-61Q33FAB | - | |
2944 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | - | - | download | Not Applicable | 1686-TE0720-03-61Q33FAB | OBSOLETE | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | |||||
|
TE0720-03-61Q43MA | - | |
3443 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | - | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-61Q43MA | 1 | ARM Cortex-A9 | - | - | - | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||
|
TE0720-03-S006C1 | - | |
7959 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | - | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-S006C1 | 1 | ARM Cortex-A9 | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||
 |
TE0720-03-62I33ML | - | |
8195 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-62I33ML | EAR99 | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 1GB | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||
|
TE0720-03-S009C1 | - | |
1594 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-S009C1 | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | |||||
|
TE0741-04-A2I-1-A | 502.9500 | |
4754 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-A2I-1-A | 1 | Xilinx Kintex-7 FPGA XC7K70T-2FBG676I | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||||
 |
M100PF-2AC | 524.0000 | |
7106 | 0.00000000 | ARIES Embedded | PolarFire™ | Box | Active | 0°C ~ 70°C | - | - | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | 3199-M100PF-2AC | 3A991 | 8471.50.0150 | 1 | - | - | 1GB | - | FPGA | - | Board-to-Board (BTB) Socket |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
Wishlist (0 Items)