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Microcontrollers, Microprocessor, FPGA Modules(1588)

Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Size / Dimension Base Product Number DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Core Processor Speed RAM Size Flash Size Module/Board Type Co-Processor Connector Type
ME-XU7-15EG-2I-D12E-R5.0 Enclustra FPGA Solutions ME-XU7-15EG-2I-D12E-R5.0 -
RFQ
 ECAD 4653 0.00000000 Enclustra FPGA Solutions Mercury+ XU7 Bulk Active -40°C ~ 85°C 2.910" L x 2.130" W (74.00mm x 54.00mm) - 2879-ME-XU7-15EG-2I-D12E-R5.0 1 ARM® Cortex®-A53, ARM® Cortex®-R5 - 2GB 16GB MPU Core Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I 168 Pin
TE0820-04-2BE21FAJ Trenz Electronic GmbH TE0820-04-2BE21FAJ -
RFQ
 ECAD 2106 0.00000000 Trenz Electronic GmbH TE0820 Bulk Obsolete 0°C ~ 85°C 1.970" L x 1.570" W (50.00mm x 40.00mm) TE0820 download ROHS3 Compliant Not Applicable 1686-TE0820-04-2BE21FAJ OBSOLETE 1 Zynq UltraScale+ XCZU2EG-1SFVC784E - 2GB 128MB MPU Core - Samtec LSHM
TE0807-03-4BE21-AK Trenz Electronic GmbH TE0807-03-4BE21-AK 1.0000
RFQ
 ECAD 2448 0.00000000 Trenz Electronic GmbH TE0807 Bulk Active 0°C ~ 85°C 2.990" L x 2.050" W (76.00mm x 52.00mm) - ROHS3 Compliant Not Applicable 1686-TE0807-03-4BE21-AK 1 Zynq™ UltraScale+™ XCZU4EG-1FBVB900E - 4GB 128MB MPU Core - Board-to-Board (BTB) Socket - 160
TE0712-03-71I36-A Trenz Electronic GmbH TE0712-03-71I36-A 361.2000
RFQ
 ECAD 2553 0.00000000 Trenz Electronic GmbH TE0712 Bulk Active -40°C ~ 85°C 1.970" L x 1.570" W (50.00mm x 40.00mm) - Not Applicable 1686-TE0712-03-71I36-A 1 Artix-7 XC7A100T-1FGG484I - 1GB 32MB FPGA Core - Board-to-Board (BTB) Socket
6254-TX-XXD-RI Critical Link LLC 6254-TX-XXD-RI 161.8400
RFQ
 ECAD 6264 0.00000000 Critical Link LLC MitySOM-AM62 Bag Active -40°C ~ 85°C 2.740" L x 1.500" W (69.60mm x 38.10mm) - ROHS3 Compliant 1 (Unlimited) 1057-6254-TX-XXD-RI 1 ARM® Cortex®-A53 1GHz 2GB - MPU Core NEON SIMD SO-DIMM-260
DC-VA-H264-10B-60-1080-MD00C-A200T System-On-Chip (SOC) Technologies Inc. DC-VA-H264-10B-60-1080-MD00C-A200T 760.2000
RFQ
 ECAD 5608 0.00000000 System-On-Chip (SOC) Technologies Inc. - Box Active - - DC-VA-H264 download 1962-DC-VA-H264-10B-60-1080-MD00C-A200T 3A991D 8473.30.1180 1 - - 512MB 32MB DSP, FPGA Core Xilinx Artix-7 XC7A200T SO-DIMM
M5475DFE NXP USA Inc. M5475DFE -
RFQ
 ECAD 8448 0.00000000 NXP USA Inc. ColdFire® Bulk Obsolete 0°C ~ 70°C 3.700" L x 4.500" W (93.40mm x 114.30mm) M5475 - RoHS non-compliant 1 (Unlimited) REACH Unaffected 5A002A1 8471.50.0150 1 ColdFire V4e, MCF5475 266MHz 64MB 2MB (Boot) MPU Core - -
TE0715-05-71C33-A Trenz Electronic GmbH TE0715-05-71C33-A 550.2000
RFQ
 ECAD 4658 0.00000000 Trenz Electronic GmbH - Bulk Active 0°C ~ 70°C 1.970" L x 1.570" W (50.00mm x 40.00mm) - ROHS3 Compliant Not Applicable 1686-TE0715-05-71C33-A 3A991A2 8471.50.0150 1 ARM Cortex-A9 125MHz 1GB 32MB MCU, FPGA Zynq-7000 (Z-7030) Samtec LSHM
TE0803-02-04EV-1EA Trenz Electronic GmbH TE0803-02-04EV-1EA -
RFQ
 ECAD 8191 0.00000000 Trenz Electronic GmbH TE0803 Bulk Obsolete 0°C ~ 85°C 2.050" L x 2.990" W (52.00mm x 76.00mm) download Not Applicable 1686-1155 5A002A1 8471.50.0150 1 Zynq UltraScale+ XCZU4EV-1SFVC784E - 2GB 128MB MPU Core - B2B
MK67Q5250V-0101YC Rohm Semiconductor MK67Q5250V-0101YC -
RFQ
 ECAD 5864 0.00000000 Rohm Semiconductor - Tray Obsolete - ROHS3 Compliant 1 (Unlimited) 3A981 8542.39.0001 100
MYC-J3352-V2-256N256D-80-I MYIR Tech Limited MYC-J3352-V2-256N256D-80-I 52.0000
RFQ
 ECAD 2196 0.00000000 MYIR Tech Limited MCC-AM335X-J Book Active -40°C ~ 85°C 2.661" L x 1.772" W (67.60mm x 45.00mm) download 3309-MYC-J3352-V2-256N256D-80-I EAR99 8543.70.9990 1 ARM® Cortex®-A8 1GHz 256MB MCU, Ethernet Core - Pin(s)
CENGLH7A404-11-504HCR-B Beacon EmbeddedWorks CENGLH7A404-11-504HCR-B -
RFQ
 ECAD 6172 0.00000000 Beacon EmbeddedWorks - Bulk Obsolete 0°C ~ 70°C 2.370" L x 2.670" W (60.20mm x 67.80mm) download Not Applicable REACH Unaffected 460-3467 4A994B 8473.30.1180 1 ARM922T, LH7A404 200MHz 64MB 32MB MPU Core - SO-DIMM-144
DOH5210C Dave Embedded Systems DOH5210C 497.4200
RFQ
 ECAD 1811 0.00000000 Dave Embedded Systems DIDO Box Active DOH5210 download ROHS3 Compliant 1 (Unlimited) 5A002A1 8473.30.1180 1 ARM® Cortex®-A8, DM8148 1GHz 1GB (NAND), 32MB (NOR) MPU, DSP Core TMS320C674x (DSP) 2 x 140 Pins 0.6mm Pitch
MA-XU3-3EG-2I-D11-R3 Enclustra FPGA Solutions MA-XU3-3EG-2I-D11-R3 742.5600
RFQ
 ECAD 7 0.00000000 Enclustra FPGA Solutions * Box Active - ROHS3 Compliant 1 (Unlimited) REACH Unaffected 5A002A4 ENC 8471.50.0150 1
TE0715-04-15-1IC Trenz Electronic GmbH TE0715-04-15-1IC -
RFQ
 ECAD 4173 0.00000000 Trenz Electronic GmbH TE0715 Bulk Obsolete -40°C ~ 85°C 1.970" L x 1.570" W (50.00mm x 40.00mm) - ROHS3 Compliant 1 (Unlimited) 1686-TE0715-04-15-1IC OBSOLETE 1 ARM Cortex-A9 125MHz 1GB 32MB MCU, FPGA Zynq-7000 (Z-7015) Samtec LSHM
TE0817-01-4AI21-A Trenz Electronic GmbH TE0817-01-4AI21-A 1.0000
RFQ
 ECAD 8040 0.00000000 Trenz Electronic GmbH Zynq® UltraScale+™ Bulk Active -40°C ~ 85°C 2.990" L x 2.050" W (76.00mm x 52.00mm) - ROHS3 Compliant Not Applicable 1686-TE0817-01-4AI21-A 1 Zynq UltraScale+ XCZU4CG-1FBVB900I - 4GB 128MB MPU Core - Board-to-Board (BTB) Socket - 240
TE0818-01-BBE21-A Trenz Electronic GmbH TE0818-01-BBE21-A 1.0000
RFQ
 ECAD 7721 0.00000000 Trenz Electronic GmbH Zynq® UltraScale+™ Bulk Active 0°C ~ 85°C 2.990" L x 2.050" W (76.00mm x 52.00mm) - ROHS3 Compliant Not Applicable 1686-TE0818-01-BBE21-A 1 Zynq UltraScale+ XCZU15EG-1FFVC900E - 4GB 128MB MPU Core - Board-to-Board (BTB) Socket - 240
DAB-002002 DAB-Embedded DAB-002002 42.0000
RFQ
 ECAD 80 0.00000000 DAB-Embedded - Bag Active -40°C ~ 85°C 0.790" L x 0.790" W (20.00mm x 20.00mm) download ROHS3 Compliant REACH Unaffected 3347-DAB-002002 5A992C 8471.50.0150 1 ARM® Cortex®-A5 - 1GB - MPU Core - -
AM3352-SOM-IND Olimex LTD AM3352-SOM-IND 52.6500
RFQ
 ECAD 1484 0.00000000 Olimex LTD - Bulk Active -40°C ~ 85°C 2.400" L x 1.500" W (61.00mm x 38.00mm) - ROHS3 Compliant 1188-AM3352-SOM-IND 1 ARM® Cortex®-A8, AM3352 1GHz 512MB - MPU Core - 40 Pin
DC-ME-01T-IZU-1 Digi DC-ME-01T-IZU-1 -
RFQ
 ECAD 6363 0.00000000 Digi Digi Connect ME® Bulk Obsolete -40°C ~ 85°C 0.750" L x 1.440" W (19.10mm x 36.70mm) - 1 (Unlimited) REACH Unaffected OBSOLETE 0000.00.0000 1 ARM7TDMI, NS7520 55MHz 8MB 2MB MPU Core - RJ45
TE0808-05-BBE21-A Trenz Electronic GmbH TE0808-05-BBE21-A 1.0000
RFQ
 ECAD 2614 0.00000000 Trenz Electronic GmbH TE0808 Bulk Active 0°C ~ 85°C 2.990" L x 2.050" W (76.00mm x 52.00mm) - ROHS3 Compliant Not Applicable 1686-TE0808-05-BBE21-A 1 Zynq UltraScale+ XCZU15EG-1FFVC900E - 4GB 128MB MPU Core - 4 x 160 Pin
TE0808-05-9BE81-AK Trenz Electronic GmbH TE0808-05-9BE81-AK 1.0000
RFQ
 ECAD 5635 0.00000000 Trenz Electronic GmbH - Bulk Active - ROHS3 Compliant Not Applicable 1686-TE0808-05-9BE81-AK 1
TE0820-05-4AE21MA Trenz Electronic GmbH TE0820-05-4AE21MA 534.4500
RFQ
 ECAD 5614 0.00000000 Trenz Electronic GmbH TE0820 Bulk Active 0°C ~ 85°C 1.970" L x 1.570" W (50.00mm x 40.00mm) download 1686-TE0820-05-4AE21MA 1 ARM® Cortex®-A53, ARM® Cortex®-R5 - 2GB 128MB MPU Core Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E Pin(s)
DLP-245PB-G DLP Design Inc. DLP-245PB-G -
RFQ
 ECAD 2349 0.00000000 DLP Design Inc. USB Bulk Obsolete - 2.300" L x 0.700" W (58.40mm x 17.80mm) DLP-245 download 1 (Unlimited) REACH Unaffected EAR99 8543.70.9860 1 PIC16F877A 20MHz 368KB 8KB MCU, USB Core FT245RL USB - B, Pin Header
TE0820-05-3BE21MA Trenz Electronic GmbH TE0820-05-3BE21MA 544.9500
RFQ
 ECAD 9684 0.00000000 Trenz Electronic GmbH TE0820 Bulk Active 0°C ~ 85°C 1.970" L x 1.570" W (50.00mm x 40.00mm) download 1686-TE0820-05-3BE21MA 1 ARM® Cortex®-A53, ARM® Cortex®-R5 - 2GB 128MB MPU Core Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E Pin(s)
TE0712-02-71I01-M Trenz Electronic GmbH TE0712-02-71I01-M -
RFQ
 ECAD 5513 0.00000000 Trenz Electronic GmbH TE0712 Bulk Obsolete -40°C ~ 85°C 1.970" L x 1.570" W (50.00mm x 40.00mm) - ROHS3 Compliant Not Applicable 1686-TE0712-02-71I01-M 3A991D 8471.50.0150 1 - 200MHz 1GB 32MB FPGA Core - Samtec LSHM
TE0890-01-P1C-5-A Trenz Electronic GmbH TE0890-01-P1C-5-A 49.3500
RFQ
 ECAD 1327 0.00000000 Trenz Electronic GmbH TE0890 Bulk Active 0°C ~ 70°C 1.060" L x 2.050" W (27.00mm x 52.00mm) TE0890 download ROHS3 Compliant Not Applicable 1686-TE0890-01-P1C-5-A EAR99 8473.30.1180 1 Xilinx Spartan-7 XC7S25 100MHz 64Mbit 64Mbit FPGA Core - Dual-pinout DIP-40 or 50mil 80 pin connector
TE0722-03-41I-4-A Trenz Electronic GmbH TE0722-03-41I-4-A 109.0000
RFQ
 ECAD 2049 0.00000000 Trenz Electronic GmbH - Bulk Active - ROHS3 Compliant Not Applicable REACH Unaffected 1686-TE0722-03-41I-4-A 1
DC-ME-01T-NC Digi DC-ME-01T-NC -
RFQ
 ECAD 8264 0.00000000 Digi Digi Connect ME® Box Obsolete -40°C ~ 85°C 1.450" L x 0.750" W (36.70mm x 19.10mm) download 1 (Unlimited) REACH Unaffected 5A002A1 DIG 8517.62.0090 1 ARM7TDMI, NS7520 55MHz 8MB 2MB MPU Core - RJ45
TE0722-02-07S-1C Trenz Electronic GmbH TE0722-02-07S-1C 93.4500
RFQ
 ECAD 4 0.00000000 Trenz Electronic GmbH TE0722 Bulk Active 0°C ~ 70°C 0.710" L x 2.010" W (18.00mm x 51.00mm) TE0722 download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 1686-1091 3A991D 8471.50.0150 1 ARM Cortex-A9 33MHz - 16MB MCU, FPGA Zynq-7000 (Z-7000S) 40 Pin
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse

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AD9208BBPZ-3000

196-LFBGA Exposed Pad

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