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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
17555 | - |  |
3472 | 0.00000000 | Aven Tools | - | Spool | Obsolete | Wire Solder | 0.551 lb (249.93 g) | - | - | - | - | download | Not applicable | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 3.53 oz (100g) | 0.039" (0.99mm) | 360°F (180°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Leaded | - | ||||
 |
WC9601020P | 92.5400 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-WC9601020P | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 24 AWG, 25 SWG | Lead Free | ||||||||
 |
4890-18G | 7.6500 | |
4609 | 0.00000000 | MG Chemicals | 4890 | Bulk | Active | Wire Solder | 4890 | 0.04 lb (18.14 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Tube, 0.63 oz (18g) | 0.032" (0.81mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | Leaded | - | |||
 |
24-3070-2437 | - | |
6849 | 0.00000000 | Kester Solder | Acid Cored Wire | Bulk | Obsolete | Wire Solder | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Pb70Sn30 (70/30) | Spool, 1 lb (454 g) | 0.125" (3.18mm) | 361 ~ 496°F (183 ~ 258°C) | Acid Cored | 8 AWG, 10 SWG | Leaded | - | ||||||
 |
24-6040-9703 | 68.4000 | |
91 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 24-6040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | Leaded | |||||
 |
44-7033-0000 | 123.2640 | |
9649 | 0.00000000 | Kester Solder | ULTRAPURE® | Bulk | Active | Bar Solder | 44-7033 | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn97Ag3 (97/3) | Bar, 1.66 lbs (750g) | - | 430 ~ 435°F (221 ~ 224°C) | - | - | Lead Free | - | ||||
 |
26-6040-0039 | - | |
5939 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 26-6040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 5 lbs (2.27kg) | 0.040" (1.02mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Leaded | |||||
 |
RC96L2020CQPJ | 56.5500 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-RC96L2020CQPJ | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Lead Free | ||||||||
 |
24-6337-8842 | 58.6448 | |
7610 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.025" (0.64mm) | 361°F (183°C) | No-Clean | 22 AWG, 23 SWG | Leaded | ||||||
|
550014 | - | |
5012 | 0.00000000 | Multicore | WS200™ | Syringe | Obsolete | Solder Paste | 0.165 lb (74.84 g) | 6 Months | Date of Manufacture | 35°F ~ 50°F (2°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | Not Applicable | M00515 | EAR99 | 3810.10.0000 | 18 | Sn63Pb37 (63/37) | Syringe, 2.65 oz (75g) | - | 361°F (183°C) | Water Soluble | - | Leaded | - | ||||
 |
WB964 | 91.9900 | |
3 | 0.00000000 | SRA Soldering Products | SUPER-PURE™ | Bag | Active | Bar Solder | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96Ag4 (96/4) | Bar, 1 lb (454g) | - | 430°F (221°C) | - | - | Lead Free | |||||||
 |
4935-112G | - | |
7827 | 0.00000000 | MG Chemicals | 4935 | Spool | Obsolete | Wire Solder | 60 Months | Date of Manufacture | 65°F ~ 80°F (18°C ~ 27°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 473-1247 | EAR99 | 8311.30.6000 | 1 | Sn99.5Cu0.5 (99.5/0.5) | Spool, 4 oz (113.40g) | 0.032" (0.81mm) | 442°F (228°C) | No-Clean | 20 AWG, 21 SWG | Lead Free | ||||||
 |
NC191SNL35T5 | 31.9500 | |
7793 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191SNL35T5 | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 5 | ||||
 |
WBNCC633720-2OZ | 8.7500 | |
8 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | WBNCC633720 | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 2 oz (56.70g) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | Leaded | ||||||
|
275498 | 0.4200 | |
5774 | 0.00000000 | Kester Solder | - | Bulk | Active | download | 117-275498 | 1 | ||||||||||||||||||||||
 |
397952 | 24.5700 | |
4994 | 0.00000000 | Harimatec Inc. | 366 | Bulk | Active | Wire Solder | 0.551 lb (249.93 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | Spool, 8.8 oz (250g) | 0.022" (0.56mm) | 565 ~ 574°F (296 ~ 301°C) | Rosin Activated (RA) | 23 AWG, 24 SWG | Leaded | - | |||||
 |
395439 | 57.0600 | |
95 | 0.00000000 | Harimatec Inc. | 366 | Bulk | Active | Wire Solder | 1.1 lbs (499 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | Spool, 17.64 oz (500g) | 0.050" (1.27mm) | 565 ~ 574°F (296 ~ 301°C) | Rosin Activated (RA) | 16 AWG, 18 SWG | Leaded | - | |||||
|
WBAR42/57/1 | 49.9900 | |
4966 | 0.00000000 | SRA Soldering Products | SUPER-PURE™ | Bag | Active | Bar Solder | WBAR42/57 | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-WBAR42/57/1 | EAR99 | 8311.30.3000 | 1 | Bi57Sn42Ag1 (57/42/1) | Bar, 0.5 lb (266.79g) | - | - | - | - | Lead Free | |||||
 |
EBSnCu0.7Ni 1#TRI | 68.2000 | |
100 | 0.00000000 | Amerway Inc | - | Tape & Box (TB) | Active | - | ROHS3 Compliant | REACH Affected | 2757-EBSnCu0.7Ni1#TRITB | 1 | ||||||||||||||||||||
|
NC2SWLF.015 1OZ | 12.4100 | |
24 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Wire Solder | NC2SW | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 315-NC2SWLF.0151OZ | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 oz (28.35g) | 0.015" (0.38mm) | 441°F (227°C) | No-Clean | - | - | |||
|
96-6040-8832 | - | |
1837 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 96-6040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 17.64 oz (500g) | 0.031" (0.79mm) | 361 ~ 374°F (183 ~ 190°C) | No-Clean | 20 AWG, 22 SWG | Leaded | |||||
 |
JPAGSC1501P | 162.8000 | |
50 | 0.00000000 | Canfield Technologies | - | Tube | Active | Brazing Rod | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-JPAGSC1501P | 1 | 15% Ag, 80% Cu, 5% Phos | Tube, 1 lb (454g) | - | 1190/1475°F (643/802°C) | - | - | Lead Free | ||||||||
 |
SMD291SNL10 | 24.9900 | |
36 | 0.00000000 | Chip Quik Inc. | - | Syringe | Active | Solder Paste | SMD291 | 0.077 lb (34.93 g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | Refrigerated | 3 | ||
|
26-4060-2437 | 24.6915 | |
7325 | 0.00000000 | Kester Solder | - | Bulk | Active | - | 117-26-4060-2437 | 1 | ||||||||||||||||||||||
 |
SMDLTLFP500T4C | 157.5000 | |
8639 | 0.00000000 | Chip Quik Inc. | - | Cartridge | Active | Solder Paste | SMDLTL | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Cartridge, 17.64 oz (500g) | - | 281°F (138°C) | No-Clean | - | Lead Free | 4 | ||||
 |
16-6337-0062 | 225.1088 | |
1990 | 0.00000000 | Kester Solder | Solid Core Wire | Spool | Active | Wire Solder | 16-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 5 lbs (2.27kg) | 0.062" (1.57mm) | 361°F (183°C) | - | 14 AWG, 16 SWG | Leaded | ||||||
|
15-7340-0062 | 278.7300 | |
7 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 15-7340 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 1573400062 | EAR99 | 8311.30.6000 | 25 | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | Spool, 4 lbs (1.81kg) | 0.062" (1.57mm) | 565 ~ 574°F (296 ~ 301°C) | - | 14 AWG, 16 SWG | Leaded | ||||
 |
NC191AX50T5 | 24.9500 | |
2 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-NC191AX50T5 | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 1.76 oz (50g) | - | 361°F (183°C) | No-Clean | - | Leaded | 5 | ||||
|
24-6337-8811 | - | |
4581 | 0.00000000 | Kester Solder | 245 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.030" (0.76mm) | 361°F (183°C) | No-Clean | 21 AWG, 22 SWG | Leaded | |||||||
 |
397982 | - | |
4718 | 0.00000000 | Harimatec Inc. | C502 | Spool | Obsolete | Wire Solder | 0.551 lb (249.93 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 40 | Sn63Pb37 (63/37) | Spool, 8.8 oz (250g) | 0.015" (0.38mm) | 361°F (183°C) | No-Clean | 27 AWG, 28 SWG | Leaded | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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