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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
SMD2140-25000 | 21.9900 |  |
3 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.008" (0.20mm) | 361°F (183°C) | - | - | Leaded | |||||
 |
SMD2170-25000 | 19.9500 | |
5 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.014" (0.36mm) | 361°F (183°C) | - | - | Leaded | |||||
 |
SMD291SNL50T6 | 99.9500 | |
2 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Solder Paste | SMD291 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD291SNL50T6 | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 6 | ||||
 |
CQ100GE.020 1LB | 64.0300 | |
27 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | CQ100G | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-CQ100GE.0201LB | EAR99 | 8311.90.0000 | 1 | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean | - | Lead Free | |||||
 |
WBNCC633720 | 45.9900 | |
10 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | Leaded | |||||||
 |
WBNCC633731-2OZ | 7.5000 | |
3 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | WBNCC633731 | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 2 oz (56.70g) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | Leaded | ||||||
 |
SSNC-T5-250G | 79.9900 | |
1865 | 0.00000000 | SRA Soldering Products | - | Bag | Active | Solder Paste | SSNC-T | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | - | 361°F (183°C) | No-Clean | - | Leaded | 5 | |||||
 |
EXB-SN96.5AG3.0CU0.5-0.5LB | 34.4400 | |
60 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | EXB-SN96 | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-EXB-SN96.5AG3.0CU0.5-0.5LB | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Bar, 0.5 lb (227g) | - | 423 ~ 428°F (217 ~ 220°C) | - | - | Leaded | |||||
 |
NC191LTA500T5C | 135.9000 | |
1 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA500T5C | EAR99 | 3810.10.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Cartridge, 17.64 oz (500g) | - | 279°F (137°C) | No-Clean | - | - | 5 | ||||
 |
NC191LTA50 | 18.9500 | |
6823 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA50 | EAR99 | 3810.10.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Jar, 1.76 oz (50g) | - | 279°F (137°C) | No-Clean | - | - | 4 | ||||
 |
NC191LTA250 | 57.9500 | |
8544 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA250 | EAR99 | 3810.10.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Jar, 8.8 oz (250g) | - | 279°F (137°C) | No-Clean | - | - | 4 | ||||
 |
NCSW.020 0.3OZ | 3.1800 | |
8 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NCSW | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-NCSW.0200.3OZ | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Tube, 0.3 oz (8.51g) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | Leaded | |||||
 |
NCSWLF.031 0.5OZ | 4.6700 | |
627 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NCSW | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NCSWLF.0310.5OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Tube, 0.50 oz (14.17g) | 0.031" (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | 20 AWG, 21 SWG | - | |||||
 |
WBRA633731-4OZ | 13.9900 | |
18 | 0.00000000 | SRA Soldering Products | - | Box | Active | Wire Solder | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 4 oz (113.40g) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | - | Leaded | |||||
 |
SMD4300LTLFP250T4 | 106.8000 | |
4295 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | - | 6 Months | Date of Manufacture | 32°F ~ 77°F (0°C ~ 25°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 8.8 oz (250g) | - | 280°F (138°C) | No-Clean | - | Lead Free | |||||
 |
TS391SNL250 | 69.9500 | |
8241 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391S | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 4 | ||||
|
MMF301501 | 318.6600 | |
1333 | 0.00000000 | Micro-Measurements (Division of Vishay Precision Group) | - | Spool | Active | Wire Solder | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | 450-20R | EAR99 | 3810.10.0000 | 1 | Sn95Sb5 (95/5) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 450 ~ 460°F (232 ~ 238°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Lead Free | - | ||||||
 |
77-6337-0030 | - | |
5847 | 0.00000000 | Kester Solder | ULTRAPURE® | Bulk | Active | Bar Solder | 77-6337 | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 5 | Sn63Pb37 (63/37) | Bar, 10 lbs (4.54kg) | - | 361°F (183°C) | - | - | Leaded | - | ||||
 |
70-0102-0311 | 177.7400 | |
5604 | 0.00000000 | Kester Solder | EP256 | Bulk | Active | Solder Paste | 70-0102 | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn62Pb36Ag2 (62/36/2) | Cartridge, 21.16 oz (600g) | - | 354°F (179°C) | No-Clean | - | Leaded | 3 | ||||
|
24-7040-8802 | - | |
7084 | 0.00000000 | Kester Solder | 245 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3.5 (96.5/3.5) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 430°F (221°C) | No-Clean | 20 AWG, 22 SWG | Lead Free | ||||||
|
24-6337-7612 | - | |
8976 | 0.00000000 | Kester Solder | 275 | Spool | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.050" (1.27mm) | 361°F (183°C) | No-Clean | 16 AWG, 18 SWG | Leaded | |||||||
|
DKS-63/37-NC-02OZ | 12.7200 | |
8929 | 0.00000000 | DIGIKEY STANDARD | - | Bulk | Active | - | Not Applicable | 4937-DKS-63/37-NC-02OZ | 1 | |||||||||||||||||||||
 |
24-6337-8846 | 41.6564 | |
6582 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 361°F (183°C) | No-Clean | 18 AWG, 19 SWG | Leaded | ||||||
 |
24-6337-7601 | - | |
9874 | 0.00000000 | Kester Solder | 275 | Spool | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 22 SWG | Leaded | ||||||
|
24-6040-9759 | - | |
1721 | 0.00000000 | Kester Solder | 285 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.050" (1.27mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Mildly Activated (RMA) | 16 AWG, 18 SWG | Leaded | ||||||
 |
SMD291SNL500T5 | 198.9500 | |
8103 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMD291 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 5 | ||||
|
TOL-10243 | 27.5000 | |
6375 | 0.00000000 | SparkFun Electronics | - | Bulk | Active | Wire Solder | - | - | - | - | - | - | ROHS3 Compliant | 1 (Unlimited) | 1568-TOL-10243 | 1 | Sn96.35Cu0.5Sb0.15Ag3 (96.35/0.5/0.15/3) | Spool, 4 oz (113.40g) | 0.031" (0.79mm) | - | Water Soluble | - | Lead Free | |||||||
 |
77-7033-0000 | - | |
3081 | 0.00000000 | Kester Solder | ULTRAPURE® | Bulk | Active | Bar Solder | 77-7033 | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn97Ag3 (97/3) | Bar, 5 lbs (2.27kg) | - | 430 ~ 435°F (221 ~ 224°C) | - | - | Lead Free | - | ||||
 |
70-2102-0518 | - | |
5238 | 0.00000000 | Kester Solder | R562 | Bulk | Active | Solder Paste | 70-2102 | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Cartridge, 49.38 oz (1.4kg) | - | 361°F (183°C) | Water Soluble | - | Leaded | 3 | ||||
 |
24-6337-6422 | 76.2800 | |
323 | 0.00000000 | Kester Solder | 331 | Spool | Active | Wire Solder | 24-6337 | 1 lb (453.59 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 361°F (183°C) | Water Soluble | 27 AWG, 28 SWG | Leaded |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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