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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
92-6337-9717 | - |  |
4796 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 92-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 17.64 oz (500g) | 0.025" (0.64mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 22 AWG, 23 SWG | Leaded | |||||
 |
SMD2170 | 97.9500 | |
1387 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.014" (0.36mm) | 361°F (183°C) | - | - | Leaded | |||||
 |
RASW.031 1LB | 40.6700 | |
5 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW | 60 Months | Date of Manufacture | download | RoHS non-compliant | Not Applicable | REACH Affected | RASW.0311LB | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | Leaded | ||||||
 |
91-7068-7603 | 73.4856 | |
2732 | 0.00000000 | Kester Solder | 275 | Bulk | Active | Wire Solder | 91-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8.8 oz (250g) | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | |||||
 |
24-6337-9706 | - | |
2421 | 0.00000000 | Kester Solder | 285 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.093" (2.36mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 11 AWG, 13 SWG | Leaded | ||||||
 |
4867-227G | - | |
5316 | 0.00000000 | MG Chemicals | 4860 | Spool | Obsolete | Wire Solder | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 2 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.050" (1.27mm) | 361°F (183°C) | No-Clean | 16 AWG, 18 SWG | Leaded | - | ||||||
 |
SMDLTLFP250T3 | 69.9500 | |
5134 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMDLTL | 0.551 lb (249.93 g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 8.8 oz (250g) | - | 281°F (138°C) | No-Clean | - | Lead Free | Refrigerated | 3 | ||
 |
WBWS633720-2OZ | 8.7500 | |
5 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-WBWS633720-2OZ | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Spool, 2 oz (56.70g) | 0.020" (0.51mm) | - | No-Clean, Water Soluble | - | Leaded | - | - | |||
|
70-0203-0311 | - | |
8419 | 0.00000000 | Kester Solder | EP256HA | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn62Pb36Ag2 (62/36/2) | Cartridge, 21.16 oz (600g) | - | 354°F (179°C) | No-Clean | - | Leaded | - | ||||||
 |
SMD2200 | 81.9500 | |
6767 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Jar | 0.024" (0.61mm) | 361°F (183°C) | - | - | Leaded | - | ||||||
|
818006 | - | |
8637 | 0.00000000 | Harimatec Inc. | C400 | Bulk | Active | Wire Solder | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 400 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.028" (0.71mm) | 361°F (183°C) | No-Clean | 21 AWG, 22 SWG | Leaded | - | ||||||
 |
24-6337-8817 | 59.3900 | |
8305 | 0.00000000 | Kester Solder | 245 | Spool | Active | Wire Solder | 24-6337 | 1 lb (453.59 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 361°F (183°C) | No-Clean | 14 AWG, 16 SWG | Leaded | ||||
 |
4894-454G | - | |
9693 | 0.00000000 | MG Chemicals | 4890 | Spool | Obsolete | Wire Solder | 4894 | 1 lb (453.59 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.025" (0.64mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | Leaded | - | |||
|
92-7059-6442 | - | |
8334 | 0.00000000 | Kester Solder | 331 | Bulk | Obsolete | Wire Solder | 92-7059 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn95.8Ag3.5Cu0.7 (95.8/3.5/0.7) | Spool, 17.64 oz (500g) | 0.025" (0.64mm) | - | Water Soluble | 22 AWG, 23 SWG | Lead Free | |||||
 |
4895-227G | 50.5400 | |
8 | 0.00000000 | MG Chemicals | 4890 | Spool | Active | Wire Solder | 4895 | 0.5 lb (226.8 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 3 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.032" (0.81mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | Leaded | - | |||
 |
83-3000-0000 | - | |
1961 | 0.00000000 | Kester Solder | - | Bag | Active | Wire Solder | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH info available upon request | 2368-83-3000-0000 | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Tube, 1.3 oz (36.85g) | 0.050" (1.27mm) | - | Rosin Activated (RA) | 16 AWG, 18 SWG | Leaded | ||||||
|
92-7150-9702 | - | |
8443 | 0.00000000 | Kester Solder | 285 | Bulk | Obsolete | Wire Solder | 92-7150 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 17.64 oz (500g) | 0.020" (0.51mm) | 354°F (179°C) | Rosin Mildly Activated (RMA) | 24 AWG, 25 SWG | Leaded | |||||
 |
SMDSW.020 4OZ | 17.0200 | |
9 | 0.00000000 | Chip Quik Inc. | - | Spool | Active | Wire Solder | SMDSW | 0.25 lb (113.4 g) | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 4 oz (113.40g) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Leaded | - | |||
 |
70-0202-0510 | 113.5240 | |
1780 | 0.00000000 | Kester Solder | EP256HA | Bulk | Active | Solder Paste | 70-0202 | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean | - | Leaded | 3 | ||||
 |
4884-454G | 71.5700 | |
3 | 0.00000000 | MG Chemicals | 4880 | Spool | Active | Wire Solder | 4884 | 1 lb (453.59 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 3 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.025" (0.64mm) | 361°F (183°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | Leaded | - | |||
 |
389261 | 58.9500 | |
85 | 0.00000000 | Harimatec Inc. | 370 | Bulk | Active | Wire Solder | 0.551 lb (249.93 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 8.8 oz (250g) | 0.015" (0.38mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | Leaded | - | |||||
 |
673828 | 59.7600 | |
10 | 0.00000000 | Harimatec Inc. | C400 | Bulk | Active | Wire Solder | 0.55 lb (249.48 g) | - | - | 59°F ~ 86°F (15°C ~ 30°C) | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8.8 oz (250g) | 0.022" (0.56mm) | 423°F (217°C) | No-Clean | 23 AWG, 24 SWG | Lead Free | ||||||
|
92-9574-7618 | 47.4680 | |
6840 | 0.00000000 | Kester Solder | 275 | Bulk | Active | Wire Solder | 92-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 17.64 oz (500g) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean | 20 AWG, 22 SWG | Lead Free | |||||
|
92-7068-7605 | - | |
6750 | 0.00000000 | Kester Solder | 275 | Bulk | Active | Wire Solder | 92-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 17.64 oz (500g) | 0.040" (1.02mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 18 AWG, 19 SWG | Lead Free | |||||
|
9132 | 3.0000 | |
96 | 0.00000000 | GC Electronics | * | Bulk | Active | download | RoHS non-compliant | Vendor Undefined | REACH info available upon request | 2266-9132 | EAR99 | 8311.30.3000 | 1 | |||||||||||||||||
|
91-7059-8843 | - | |
7938 | 0.00000000 | Kester Solder | 245 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn95.8Ag3.5Cu0.7 (95.8/3.5/0.7) | Spool, 8.8 oz (250g) | 0.015" (0.38mm) | - | No-Clean | 27 AWG, 28 SWG | Lead Free | ||||||
 |
26-6040-6411 | 192.3745 | |
1740 | 0.00000000 | Kester Solder | 331 | Bulk | Active | Wire Solder | 26-6040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 5 lbs (2.27kg) | 0.062" (1.57mm) | 361 ~ 374°F (183 ~ 190°C) | Water Soluble | 14 AWG, 16 SWG | Leaded | |||||
 |
RCBLF227L2062E | 33.4400 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-RCBLF227L2062E | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 8 oz (227g), 1/2 lb | 0.062" (1.57mm) | 440°F (227°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Lead Free | ||||||||
|
86-6337-0118 | - | |
2486 | 0.00000000 | Kester Solder | - | Bulk | Active | Wire Solder | 86-6337 | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 5.51 lbs (2.5kg) | 0.118" (3.00mm) | 361°F (183°C) | - | 9 AWG, 11 SWG | Leaded | - | ||||
 |
CQ-SS-SNBIAG-0.35MM-25000 | 59.9500 | |
10 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | 315-CQ-SS-SNBIAG-0.35MM-25000 | EAR99 | 8311.90.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar | 0.014" (0.36mm) | 280°F (138°C) | - | - | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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