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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Type Material Base Product Number Accessory Type For Use With/Related Products Thickness Weight Shelf Life Shelf Life Start Storage/Refrigeration Temperature Shipping Info DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Composition Form Pitch Diameter Number of Positions Melting Point Flux Type Wire Gauge Process SIC Storage Mesh Type Inner Dimension Outer Dimension Thermal Center Pad
NC2SWLF.015 1OZ Chip Quik Inc. NC2SWLF.015 1OZ 12.4100
RFQ
ECAD 24 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active Wire Solder NC2SW - - - - - download ROHS3 Compliant Not Applicable REACH Unaffected 315-NC2SWLF.0151OZ EAR99 8311.30.6000 1 Sn99.3Cu0.7 (99.3/0.7) Spool, 1 oz (28.35g) 0.015" (0.38mm) 441°F (227°C) No-Clean - -
SMDSWLT.040 20G Chip Quik Inc. SMDSWLT.040 20G 34.4600
RFQ
ECAD 16 0.00000000 Chip Quik Inc. SMD Bulk Active Wire Solder SMDSW - - - download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8311.30.6000 1 Bi57Sn42Ag1 (57/42/1) Spool, 0.7 oz (20g) 0.040" (1.02mm) 280°F (138°C) No-Clean, Rosin Activated (RA) 18 AWG, 19 SWG Lead Free
TS391SNL50 Chip Quik Inc. TS391SNL50 17.9500
RFQ
ECAD 8 0.00000000 Chip Quik Inc. - Bulk Active Solder Paste TS391S 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C) - download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 3810.10.0000 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g) - 423 ~ 428°F (217 ~ 220°C) No-Clean - Lead Free 4
PA0008-S Chip Quik Inc. PA0008-S 11.5900
RFQ
ECAD 5862 0.00000000 Chip Quik Inc. Proto-Advantage PA Bulk Active SOIC Stainless Steel PA0008 0.0040" (0.102mm) download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 7218.10.0000 1 0.050" (1.27mm) 20 - 1.300" L x 0.900" W (33.02mm x 22.86mm) -
CN0072-S Chip Quik Inc. CN0072-S 21.5800
RFQ
ECAD 6537 0.00000000 Chip Quik Inc. Proto-Advantage CN Bulk Active - Stainless Steel 0.0040" (0.102mm) - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 7326.90.8688 1 - 200 - 3.900" L x 1.350" W (99.06mm x 34.29mm) -
PA0205-S Chip Quik Inc. PA0205-S 11.5900
RFQ
ECAD 5820 0.00000000 Chip Quik Inc. Proto-Advantage PA Bulk Active RQFP Stainless Steel 0.0040" (0.102mm) download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8515.19.0000 1 0.020" (0.50mm) 240 1.260" L x 1.260" W (32.00mm x 32.00mm) 2.600" L x 1.800" W (66.04mm x 45.72mm) -
CQ-SS-SNBIAG-0.50MM-25000 Chip Quik Inc. CQ-SS-SNBIAG-0.50MM-25000 62.9500
RFQ
ECAD 6 0.00000000 Chip Quik Inc. - Bulk Active Solder Sphere - 24 Months Date of Manufacture - - download ROHS3 Compliant 1 (Unlimited) 315-CQ-SS-SNBIAG-0.50MM-25000 EAR99 8311.90.0000 1 Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar 0.020" (0.51mm) 280°F (138°C) - - -
TS391LT250 Chip Quik Inc. TS391LT250 84.9500
RFQ
ECAD 1121 0.00000000 Chip Quik Inc. - Bulk Active Solder Paste TS391L 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C) - download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 3810.10.0000 1 Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g) - 281°F (138°C) No-Clean - Lead Free 4
FPC080P040-S Chip Quik Inc. FPC080P040-S 11.5900
RFQ
ECAD 3643 0.00000000 Chip Quik Inc. Proto-Advantage FPC Bulk Active FPC/FFC Stainless Steel FPC080 0.0040" (0.102mm) download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 7218.10.0000 1 0.031" (0.80mm) 40 - 1.950" L x 0.900" W (49.53mm x 22.86mm) 1.563" L x 0.157" W (39.70mm x 4.00mm)
NC191LTA50T5 Chip Quik Inc. NC191LTA50T5 27.9500
RFQ
ECAD 1338 0.00000000 Chip Quik Inc. Smooth Flow™ Bulk Active Solder Paste NC191 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 315-NC191LTA50T5 EAR99 3810.10.0000 1 Bi57Sn42Ag1 (57/42/1) Jar, 1.76 oz (50g) - 279°F (137°C) No-Clean - - 5
NC191LT50 Chip Quik Inc. NC191LT50 18.9500
RFQ
ECAD 7437 0.00000000 Chip Quik Inc. Smooth Flow™ Bulk Active Solder Paste NC191 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 315-NC191LT50 EAR99 3810.10.0000 1 Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 1.76 oz (50g) - 280°F (138°C) No-Clean - Lead Free 4
SMD3SW.031 1OZ Chip Quik Inc. SMD3SW.031 1OZ 14.3500
RFQ
ECAD 2 0.00000000 Chip Quik Inc. SMD3 Bulk Active Wire Solder SMD3S - - - - - download ROHS3 Compliant Not Applicable REACH Affected EAR99 8311.90.0000 1 Sn62Pb36Ag2 (62/36/2) Spool, 1 oz (28.35g) 0.031" (0.79mm) 354°F (179°C) No-Clean, Water Soluble - Leaded
REMKIT-NL Chip Quik Inc. REMKIT-NL 11.9500
RFQ
ECAD 7 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active Removal Alloy SMD Components - - - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 315-REMKIT-NL EAR99 8311.30.3000 1
SMD291SNL10T5 Chip Quik Inc. SMD291SNL10T5 38.9500
RFQ
ECAD 1709 0.00000000 Chip Quik Inc. - Syringe Active Solder Paste SMD291 0.077 lb (34.93 g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 3810.10.0000 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (35g), 10cc - 423 ~ 428°F (217 ~ 220°C) No-Clean - Lead Free Refrigerated 5
REM16-NL Chip Quik Inc. REM16-NL 70.4900
RFQ
ECAD 2 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active Removal Alloy SMD Components - - - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 315-REM16-NL EAR99 8311.90.0000 1
REM16 Chip Quik Inc. REM16 70.4900
RFQ
ECAD 3 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active Removal Alloy SMD Components - - - download RoHS non-compliant 1 (Unlimited) REACH Affected 315-REM16 EAR99 8311.30.3000 1
JET551LT10T5 Chip Quik Inc. JET551LT10T5 47.9500
RFQ
ECAD 7802 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active Solder Paste - 12 Months Date of Manufacture - - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 315-JET551LT10T5 EAR99 3810.10.0000 1 Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 1.23 oz (35g), 10cc - 280°F ~ 338°F (138°C ~ 170°C) No-Clean - -
CQ9LF-0.5 Chip Quik Inc. CQ9LF-0.5 9.9500
RFQ
ECAD 18 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active Flux - Rosin Mildly Activated (RMA) CQ9LF 24 Months Date of Manufacture 37°F ~ 77°F (3°C ~ 25°C) download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 315-CQ9LF-0.5 EAR99 3810.10.0000 1 Bottle, 0.50 oz (14.17g)
SMD291SNL500T5 Chip Quik Inc. SMD291SNL500T5 198.9500
RFQ
ECAD 8103 0.00000000 Chip Quik Inc. - Jar Active Solder Paste SMD291 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 3810.10.0000 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g) - 423 ~ 428°F (217 ~ 220°C) No-Clean - Lead Free 5
GEN-DR040-P40-S Chip Quik Inc. GEN-DR040-P40-S 17.5900
RFQ
ECAD 9408 0.00000000 Chip Quik Inc. Proto-Advantage GEN Bulk Active - Stainless Steel GEN-D - - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 7326.90.8688 1 0.016" (0.40mm) 40 - - -
SMDLTLFP60T4 Chip Quik Inc. SMDLTLFP60T4 40.9500
RFQ
ECAD 8221 0.00000000 Chip Quik Inc. - Bulk Active Solder Paste, Two Part Mix SMDLTL 24 Months Date of Manufacture 37°F ~ 77°F (3°C ~ 25°C) download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8311.30.6000 1 Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 2.12 oz (60g) - 281°F (138°C) No-Clean - Lead Free 4
PA0100-S Chip Quik Inc. PA0100-S 11.5900
RFQ
ECAD 5528 0.00000000 Chip Quik Inc. Proto-Advantage PA Bulk Active LGA Stainless Steel 0.0040" (0.102mm) download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 7218.10.0000 1 0.039" (1.00mm) 16 0.295" L x 0.173" W (7.50mm x 4.40mm) 1.300" L x 0.900" W (33.02mm x 22.86mm) -
TS391LT50 Chip Quik Inc. TS391LT50 21.9500
RFQ
ECAD 9665 0.00000000 Chip Quik Inc. - Bulk Active Solder Paste TS391L 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C) - download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 3810.10.0000 1 Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 1.76 oz (50g) - 281°F (138°C) No-Clean - Lead Free 4
RMA591 Chip Quik Inc. RMA591 24.9900
RFQ
ECAD 5 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active Flux - Rosin Mildly Activated (RMA) 24 Months Date of Manufacture 37°F ~ 77°F (3°C ~ 25°C) download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 315-RMA591 EAR99 3402.90.5030 1 Syringe, 0.35 oz (10g), 10cc
NC191AX250 Chip Quik Inc. NC191AX250 44.9500
RFQ
ECAD 1898 0.00000000 Chip Quik Inc. Smooth Flow™ Bulk Active Solder Paste NC191 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) download RoHS non-compliant 1 (Unlimited) REACH Affected 315-NC191AX250 EAR99 3810.10.0000 1 Sn63Pb37 (63/37) Jar, 8.8 oz (250g) - 361°F (183°C) No-Clean - Leaded 4
SMD291AX Chip Quik Inc. SMD291AX 14.9900
RFQ
ECAD 40 0.00000000 Chip Quik Inc. - Syringe Active Solder Paste SMD291 0.033 lb (14.97 g) 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. download RoHS non-compliant Not Applicable REACH Affected SMD 291AX EAR99 3810.10.0000 1 Sn63Pb37 (63/37) Syringe, 0.53 oz (15g), 5cc - 361°F (183°C) No-Clean - Leaded Refrigerated 3
CQ2LF-128 Chip Quik Inc. CQ2LF-128 245.9500
RFQ
ECAD 2643 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active Flux - Rosin Activated (RA), Lead Free, Water-Soluble, Liquid CQ2LF 24 Months Date of Manufacture 37°F ~ 77°F (3°C ~ 25°C) download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 3810.10.0000 1 Jug, 128 oz (3.62kg)
RASW.020 .4OZ Chip Quik Inc. RASW.020 .4OZ 5.8100
RFQ
ECAD 3 0.00000000 Chip Quik Inc. - Bulk Active Wire Solder RASW.020 - download RoHS non-compliant Not Applicable REACH Affected RASW.020.4OZ EAR99 8311.30.6000 1 Sn63Pb37 (63/37) Tube, 0.4 oz (11.34g) 0.020" (0.51mm) 361°F (183°C) Rosin Activated (RA) 24 AWG, 25 SWG Leaded
PA0078-S Chip Quik Inc. PA0078-S 11.5900
RFQ
ECAD 4311 0.00000000 Chip Quik Inc. Proto-Advantage PA Bulk Active TVSOP Stainless Steel 0.0040" (0.102mm) download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 7218.10.0000 1 0.016" (0.40mm) 24 - 1.300" L x 0.900" W (33.02mm x 22.86mm) -
SMDLTLFP15T4 Chip Quik Inc. SMDLTLFP15T4 19.9500
RFQ
ECAD 7 0.00000000 Chip Quik Inc. - Jar Active Solder Paste, Two Part Mix SMDLTL 24 Months Date of Manufacture 37°F ~ 77°F (3°C ~ 25°C) - download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 3810.10.0000 1 Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 0.53 oz (15g) - 281°F (138°C) No-Clean - Lead Free 4
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse