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Sockets for ICs, Transistors(23296)

Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
06-3513-10 Aries Electronics 06-3513-10 0.9721
RFQ
 ECAD 4816 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 06-3513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 60 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
116-43-952-41-003000 Mill-Max Manufacturing Corp. 116-43-952-41-003000 19.5375
RFQ
 ECAD 6394 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Elevated, Open Frame 116-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 52 (2 x 26) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.315" (8.00mm) 10mOhm
D01-9501242 Harwin Inc. D01-9501242 -
RFQ
 ECAD 2474 0.00000000 Harwin Inc. D01-950 Bulk Obsolete -55°C ~ 125°C Through Hole SIP Elevated Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 12 (1 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.126" (3.20mm) 10mOhm
224-1275-39-0602J 3M 224-1275-39-0602J 35.2900
RFQ
 ECAD 9616 0.00000000 3M Textool™ Tube Active -55°C ~ 125°C Through Hole - 224 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 24 Beryllium Copper 0.100" (2.54mm) Beryllium Copper -
522-13-100-13-061001 Mill-Max Manufacturing Corp. 522-13-100-13-061001 -
RFQ
 ECAD 7312 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 522-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 100 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
64-9518-10H Aries Electronics 64-9518-10H 13.0844
RFQ
 ECAD 8274 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.9" (22.86mm) Row Spacing Open Frame 64-9518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 64 (2 x 32) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
614-13-144-13-041012 Mill-Max Manufacturing Corp. 614-13-144-13-041012 -
RFQ
 ECAD 2847 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 144 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.136" (3.45mm) 10mOhm
ICA-422-ZSGT Samtec Inc. ICA-422-ZSGT 5.5230
RFQ
 ECAD 3565 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-422-ZSGT 20 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
28-6552-16 Aries Electronics 28-6552-16 52.7978
RFQ
 ECAD 1277 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 28-6552 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
522-13-085-11-041002 Mill-Max Manufacturing Corp. 522-13-085-11-041002 -
RFQ
 ECAD 7454 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 522-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 85 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
ICF-308-STL-O-TR Samtec Inc. ICF-308-STL-O-TR 3.0734
RFQ
 ECAD 1415 0.00000000 Samtec Inc. ICF Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-308-STL-O-TR 450 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
824-AG66D TE Connectivity AMP Connectors 824-AG66D -
RFQ
 ECAD 1875 0.00000000 TE Connectivity AMP Connectors 800 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 824 Solder download RoHS non-compliant 1 (Unlimited) Vendor Undefined 9-1437537-8 EAR99 8536.69.4040 1,632 Polyester UL94 V-0 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 80.0µin (2.03µm) 24 (2 x 12) Copper Alloy 0.100" (2.54mm) Copper Alloy 0.125" (3.18mm) 10mOhm
34-0518-10 Aries Electronics 34-0518-10 3.1310
RFQ
 ECAD 2798 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 34-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 34 (1 x 34) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
ICF-648-STL-O Samtec Inc. ICF-648-STL-O 17.5400
RFQ
 ECAD 5310 0.00000000 Samtec Inc. ICF Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-648-STL-O 1 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
ICA-314-JGG Samtec Inc. ICA-314-JGG 8.1734
RFQ
 ECAD 9807 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-314-JGG 32 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
SMPX-32LCC-N-TR Kycon, Inc. SMPX-32LCC-N-TR 0.8908
RFQ
 ECAD 2130 0.00000000 Kycon, Inc. SMPX Tape & Reel (TR) Active -50°C ~ 105°C Surface Mount PLCC Closed Frame SMPX-32LC Solder download RoHS Compliant 1 (Unlimited) 2092-SMPX-32LCC-N-TR EAR99 8536.69.4040 450 1 A Thermoplastic, Glass Filled - 0.050" (1.27mm) Tin 160.0µin (4.06µm) Tin - 32 (2 x 7, 2 x 9) Phosphor Bronze 0.050" (1.27mm) Phosphor Bronze - 15mOhm
ICA-316-ZSST Samtec Inc. ICA-316-ZSST 3.3007
RFQ
 ECAD 9760 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-316-ZSST 28 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
44-6572-11 Aries Electronics 44-6572-11 32.6262
RFQ
 ECAD 8879 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 44-6572 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
ICF-632-TL-O Samtec Inc. ICF-632-TL-O 5.6171
RFQ
 ECAD 9313 0.00000000 Samtec Inc. ICF Tube Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-632-TL-O 14 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
ICO-324-KGT Samtec Inc. ICO-324-KGT 7.3422
RFQ
 ECAD 8225 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-324-KGT 18 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
1014-1-0257-0B-00 3M 1014-1-0257-0B-00 153.6380
RFQ
 ECAD 6907 0.00000000 3M - Bulk Active - 5
122-11-648-41-001000 Mill-Max Manufacturing Corp. 122-11-648-41-001000 21.1857
RFQ
 ECAD 9329 0.00000000 Mill-Max Manufacturing Corp. 122 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 122-11 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) - - - - 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
APO-322-T-R Samtec Inc. APO-322-T-R 8.2000
RFQ
 ECAD 5655 0.00000000 Samtec Inc. APO Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-APO-322-T-R 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 22 (2 x 11) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
ICA-316-ZHGT Samtec Inc. ICA-316-ZHGT 8.4293
RFQ
 ECAD 1780 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-316-ZHGT 28 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
AW 122-21/G-T Assmann WSW Components AW 122-21/G-T 0.5755
RFQ
 ECAD 9302 0.00000000 Assmann WSW Components * Bulk Active - 11
AR64-HZW/T-R Assmann WSW Components AR64-HZW/T-R -
RFQ
 ECAD 9280 0.00000000 Assmann WSW Components - Tube Obsolete -40°C ~ 105°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Open Frame AR64-HZ Wire Wrap download 1 (Unlimited) REACH Unaffected AE10020 EAR99 8536.69.4040 9 3 A Thermoplastic, Polyester UL94 V-0 0.100" (2.54mm) Gold - Tin 200.0µin (5.08µm) 64 (2 x 32) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - 4mOhm
23-0513-10H Aries Electronics 23-0513-10H 4.1410
RFQ
 ECAD 4204 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 23-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 23 (1 x 23) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
116-43-432-41-003000 Mill-Max Manufacturing Corp. 116-43-432-41-003000 15.4318
RFQ
 ECAD 3928 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Elevated, Open Frame 116-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.315" (8.00mm) 10mOhm
34-0511-11 Aries Electronics 34-0511-11 20.7960
RFQ
 ECAD 6044 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 125°C Through Hole SIP - 34-0511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 5 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 34 (1 x 34) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
515-13-145-17-001003 Mill-Max Manufacturing Corp. 515-13-145-17-001003 -
RFQ
 ECAD 9012 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 145 (17 x 17) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse

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196-LFBGA Exposed Pad

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