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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
146-87-624-41-035101 Preci-Dip 146-87-624-41-035101 2.2244
RFQ
ECAD 6167 0.00000000 Preci-Dip 146 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 146-87 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.150" (3.81mm) 10mOhm
1-1825410-1 TE Connectivity AMP Connectors 1-1825410-1 -
RFQ
ECAD 3246 0.00000000 TE Connectivity AMP Connectors Diplomate DL Tray Obsolete -55°C ~ 125°C Through Hole SIP Closed Frame 1825410 Solder - Not applicable 1 (Unlimited) Vendor Undefined EAR99 8536.69.4040 800 Thermoplastic, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 11 (1 x 11) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) 30mOhm
614-83-650-31-012101 Preci-Dip 614-83-650-31-012101 5.0862
RFQ
ECAD 6756 0.00000000 Preci-Dip 614 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Carrier, Open Frame 614-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass 0.136" (3.45mm) 10mOhm
510-13-179-18-117002 Mill-Max Manufacturing Corp. 510-13-179-18-117002 47.1584
RFQ
ECAD 6260 0.00000000 Mill-Max Manufacturing Corp. 510 Tube Active -55°C ~ 125°C Through Hole PGA Open Frame 510-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 179 (18 x 18) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
517-83-296-19-131111 Preci-Dip 517-83-296-19-131111 20.2234
RFQ
ECAD 4373 0.00000000 Preci-Dip 517 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 517-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 296 (19 x 19) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
SIP050-1X27-160BLF Amphenol ICC (FCI) SIP050-1X27-160BLF -
RFQ
ECAD 4602 0.00000000 Amphenol ICC (FCI) SIP050-1x Bulk Obsolete - Through Hole SIP Closed Frame SIP050 Solder download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 400 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 27 (1 x 27) Beryllium Copper 0.100" (2.54mm) Brass 0.095" (2.41mm) -
515-93-025-05-000001 Mill-Max Manufacturing Corp. 515-93-025-05-000001 -
RFQ
ECAD 4850 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 515-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 25 (5 x 5) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
ICO-422-ATT Samtec Inc. ICO-422-ATT 6.0055
RFQ
ECAD 6183 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 105°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-422-ATT 20 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
110-13-632-61-001000 Mill-Max Manufacturing Corp. 110-13-632-61-001000 23.7658
RFQ
ECAD 4667 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 110-13 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) -
523-93-161-15-005001 Mill-Max Manufacturing Corp. 523-93-161-15-005001 -
RFQ
ECAD 9738 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 161 (15 x 15) - 0.100" (2.54mm) - 0.510" (12.95mm) -
10-0508-21 Aries Electronics 10-0508-21 7.6952
RFQ
ECAD 5155 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 10-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 10 (1 x 10) Beryllium Copper - Brass 0.360" (9.14mm) -
06-1518-11H Aries Electronics 06-1518-11H 1.4393
RFQ
ECAD 4002 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 06-1518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
1571994-2 TE Connectivity AMP Connectors 1571994-2 -
RFQ
ECAD 7449 0.00000000 TE Connectivity AMP Connectors 510 Bulk Obsolete - Through Hole SIP Closed Frame 1571994 Solder download RoHS Compliant 1 (Unlimited) Vendor Undefined 510-AG91D-2LF EAR99 8536.69.4040 2,500 Thermoplastic, Polyester UL94 V-0 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin 20.0µin (0.51µm) 2 (1 x 2) Beryllium Copper 0.100" (2.54mm) Copper 0.125" (3.18mm) -
515-93-036-06-000002 Mill-Max Manufacturing Corp. 515-93-036-06-000002 -
RFQ
ECAD 2321 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 515-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 36 (6 x 6) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
14-0511-10 Aries Electronics 14-0511-10 6.0449
RFQ
ECAD 2264 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 105°C Through Hole SIP - 14-0511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 50.0µin (1.27µm) 14 (1 x 14) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
ICO-324-MTT Samtec Inc. ICO-324-MTT 4.1039
RFQ
ECAD 8843 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-324-MTT 18 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
ICA-320-SGG Samtec Inc. ICA-320-SGG 4.8200
RFQ
ECAD 5 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame ICA-320 Solder download ROHS3 Compliant 1 (Unlimited) REACH Affected Q7139266 EAR99 8536.69.4040 22 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
7100265152 3M 7100265152 149.4180
RFQ
ECAD 3130 0.00000000 3M - Bulk Active - 19-7100265152 5
3MM8591928 3M 3MM8591928 -
RFQ
ECAD 3277 0.00000000 3M - - Obsolete - - - - - - RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 5 - - - - - - - - - - - - -
14-7350-10 Aries Electronics 14-7350-10 10.7988
RFQ
ECAD 7831 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 14-7350 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 14 (1 x 14) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
28-C212-30 Aries Electronics 28-C212-30 18.4726
RFQ
ECAD 9614 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 28-C212 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.040" (1.02mm) -
200-6317-9UN-1900 3M 200-6317-9UN-1900 -
RFQ
ECAD 4975 0.00000000 3M Textool™ Bulk Obsolete -55°C ~ 150°C Through Hole PGA, ZIF (ZIP) - 200 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polyethersulfone (PES) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 289 (17 x 17) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
517-83-265-12-000111 Preci-Dip 517-83-265-12-000111 16.6069
RFQ
ECAD 4952 0.00000000 Preci-Dip 517 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 517-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 265 (12 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
40-81250-310C Aries Electronics 40-81250-310C 22.1379
RFQ
ECAD 6179 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 40-8125 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
115-91-642-41-001000 Mill-Max Manufacturing Corp. 115-91-642-41-001000 14.5465
RFQ
ECAD 3711 0.00000000 Mill-Max Manufacturing Corp. 115 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 115-91 Solder download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
40-1508-20 Aries Electronics 40-1508-20 14.2690
RFQ
ECAD 8149 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 40-1508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
612-41-642-41-004000 Mill-Max Manufacturing Corp. 612-41-642-41-004000 18.9724
RFQ
ECAD 9371 0.00000000 Mill-Max Manufacturing Corp. 612 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Carrier, Open Frame 612-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.273" (6.93mm) 10mOhm
115-43-952-41-001000 Mill-Max Manufacturing Corp. 115-43-952-41-001000 17.1816
RFQ
ECAD 2237 0.00000000 Mill-Max Manufacturing Corp. 115 Tube Active -55°C ~ 125°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Open Frame 115-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 52 (2 x 26) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
614-91-628-41-001000 Mill-Max Manufacturing Corp. 614-91-628-41-001000 16.6325
RFQ
ECAD 1855 0.00000000 Mill-Max Manufacturing Corp. 614 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Carrier, Open Frame 614-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.165" (4.19mm) 10mOhm
24-351000-10 Aries Electronics 24-351000-10 22.6841
RFQ
ECAD 4772 0.00000000 Aries Electronics Correct-A-Chip® 351000 Bulk Active - Through Hole - 24-3510 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected Q3115742 EAR99 8536.69.4040 16 - - 0.026" (0.65mm) - - Tin-Lead 200.0µin (5.08µm) SSOP DIP, 0.3" (7.62mm) Row Spacing 24 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse