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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
614-41-650-31-012000 Mill-Max Manufacturing Corp. 614-41-650-31-012000 17.8043
RFQ
ECAD 5289 0.00000000 Mill-Max Manufacturing Corp. 614 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Carrier, Open Frame 614-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.136" (3.45mm) 10mOhm
917-43-104-41-001000 Mill-Max Manufacturing Corp. 917-43-104-41-001000 2.3300
RFQ
ECAD 230 0.00000000 Mill-Max Manufacturing Corp. 917 Tube Active -55°C ~ 125°C Surface Mount Transistor, TO-5 Closed Frame 917-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 50 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - - Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 4 (Round) Beryllium Copper - Brass Alloy 0.090" (2.29mm) -
116-87-650-41-004101 Preci-Dip 116-87-650-41-004101 8.7513
RFQ
ECAD 7570 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
123-83-648-41-001101 Preci-Dip 123-83-648-41-001101 6.5586
RFQ
ECAD 6643 0.00000000 Preci-Dip 123 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 123-83 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass 0.510" (12.95mm) 10mOhm
614-87-181-15-051112 Preci-Dip 614-87-181-15-051112 20.4629
RFQ
ECAD 6304 0.00000000 Preci-Dip 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 181 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass 0.136" (3.45mm) 10mOhm
110-87-210-41-105101 Preci-Dip 110-87-210-41-105101 0.5467
RFQ
ECAD 3753 0.00000000 Preci-Dip 110 Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.2" (5.08mm) Row Spacing Open Frame 110-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 42 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.118" (3.00mm) 10mOhm
20-7354-10 Aries Electronics 20-7354-10 11.5988
RFQ
ECAD 1817 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 20-7354 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
84-652000-11-RC Aries Electronics 84-652000-11-RC 68.0957
RFQ
ECAD 3514 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Active - Through Hole - 84-6520 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 84 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
09-7325-10 Aries Electronics 09-7325-10 9.3264
RFQ
ECAD 1714 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 09-7325 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 9 (1 x 9) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
APA-624-T-J Samtec Inc. APA-624-T-J -
RFQ
ECAD 8831 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-624 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 24 (2 x 12) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
11-7XXXX-10 Aries Electronics 11-7XXXX-10 -
RFQ
ECAD 5257 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 11-7XXX Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 11 (1 x 11) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
510-13-154-13-021003 Mill-Max Manufacturing Corp. 510-13-154-13-021003 43.0256
RFQ
ECAD 7357 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 510-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 154 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
115-44-422-41-003000 Mill-Max Manufacturing Corp. 115-44-422-41-003000 13.0063
RFQ
ECAD 7585 0.00000000 Mill-Max Manufacturing Corp. 115 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 115-44 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 18 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 200.0µin (5.08µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.095" (2.41mm) 10mOhm
ICO-318-CTT Samtec Inc. ICO-318-CTT 3.6264
RFQ
ECAD 3878 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-318-CTT 25 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
510-91-045-08-005002 Mill-Max Manufacturing Corp. 510-91-045-08-005002 22.2962
RFQ
ECAD 9207 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 45 (8 x 8) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
ICO-314-ZLGG Samtec Inc. ICO-314-ZLGG 6.0044
RFQ
ECAD 3146 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-314-ZLGG 32 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
517-87-545-17-000111 Preci-Dip 517-87-545-17-000111 23.8114
RFQ
ECAD 9875 0.00000000 Preci-Dip 517 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 517-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 545 (17 x 17) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
APO-632-T-H Samtec Inc. APO-632-T-H 11.1100
RFQ
ECAD 9927 0.00000000 Samtec Inc. APO Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-APO-632-T-H 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 32 (2 x 16) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
614-91-950-31-012000 Mill-Max Manufacturing Corp. 614-91-950-31-012000 18.0270
RFQ
ECAD 4669 0.00000000 Mill-Max Manufacturing Corp. 614 Tube Active -55°C ~ 125°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Carrier, Open Frame 614-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.136" (3.45mm) 10mOhm
551-90-056-09-041004 Mill-Max Manufacturing Corp. 551-90-056-09-041004 -
RFQ
ECAD 5535 0.00000000 Mill-Max Manufacturing Corp. 551 Bulk Active - Through Hole PGA Open Frame 551-90 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 200.0µin (5.08µm) 56 (9 x 9) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) -
ICF-628-TM-O-TR Samtec Inc. ICF-628-TM-O-TR 3.5704
RFQ
ECAD 9568 0.00000000 Samtec Inc. ICF Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-628-TM-O-TR 250 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
614-41-952-41-001000 Mill-Max Manufacturing Corp. 614-41-952-41-001000 18.8011
RFQ
ECAD 2004 0.00000000 Mill-Max Manufacturing Corp. 614 Tube Active -55°C ~ 125°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Carrier, Open Frame 614-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 52 (2 x 26) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.165" (4.19mm) 10mOhm
22-6503-30 Aries Electronics 22-6503-30 9.6900
RFQ
ECAD 9869 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 22-650 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.500" (12.70mm) -
ICF-314-F-O Samtec Inc. ICF-314-F-O 3.1053
RFQ
ECAD 3377 0.00000000 Samtec Inc. ICF Tube Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-314-F-O 32 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Gold 3.00µin (0.076µm) Tin - 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
116-87-610-41-003101 Preci-Dip 116-87-610-41-003101 0.7080
RFQ
ECAD 6659 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 42 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
116-83-420-41-004101 Preci-Dip 116-83-420-41-004101 3.8883
RFQ
ECAD 4114 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Elevated, Open Frame 116-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 21 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
614-13-299-20-096007 Mill-Max Manufacturing Corp. 614-13-299-20-096007 -
RFQ
ECAD 5881 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 299 (20 x 20) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.146" (3.71mm) 10mOhm
ICF-632-SM-O-TR Samtec Inc. ICF-632-SM-O-TR 7.1493
RFQ
ECAD 5283 0.00000000 Samtec Inc. ICF Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-632-SM-O-TR 275 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Gold - Tin - 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
550-10-400M20-000152 Preci-Dip 550-10-400M20-000152 33.7253
RFQ
ECAD 3528 0.00000000 Preci-Dip 550 Bulk Active -55°C ~ 125°C Through Hole BGA Closed Frame 550-10 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 18 1 A FR4 Epoxy Glass UL94 V-0 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 400 (20 x 20) Brass 0.050" (1.27mm) Brass 0.086" (2.20mm) 10mOhm
APO-628-T-R Samtec Inc. APO-628-T-R 10.4300
RFQ
ECAD 3179 0.00000000 Samtec Inc. APO Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-APO-628-T-R 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 28 (2 x 14) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse