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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
4894-227G | 50.5400 |  |
21 | 0.00000000 | MG Chemicals | 4890 | Spool | Active | Wire Solder | 4894 | 0.5 lb (226.8 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 3 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.025" (0.64mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | Leaded | - | |||
 |
77-7031-1900 | - | |
9028 | 0.00000000 | Kester Solder | ULTRAPURE® | Bulk | Active | Bar Solder | 77-7031 | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn97Cu2Sb0.8Ag0.2 (97/2/0.8/0.2) | Bar, 7.4 lbs (3.36kg) | - | - | - | - | Lead Free | - | ||||
 |
44-6337-0030 | 43.4000 | |
432 | 0.00000000 | Kester Solder | - | Bulk | Active | Bar Solder | 44-6337 | 24 Months | Date of Manufacture | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Bar, 1.66 lbs (750g) | - | 361°F (183°C) | - | - | Leaded | ||||||
 |
4876-227G | - | |
4691 | 0.00000000 | MG Chemicals | 4870 | Spool | Obsolete | Wire Solder | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 2 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.040" (1.02mm) | 361 ~ 376°F (183 ~ 191°C) | No-Clean | 18 AWG, 19 SWG | Leaded | - | ||||||
 |
NC3SW.020 0.3OZ | 5.9900 | |
35 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC3SW | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-NC3SW.0200.3OZ | EAR99 | 8311.30.3000 | 1 | Sn62Pb36Ag2 (62/36/2) | Tube, 0.3 oz (8.51g) | 0.020" (0.51mm) | 354°F (179°C) | No-Clean | 24 AWG, 25 SWG | Leaded | |||||
 |
WBWS633720-4OZ | 14.9900 | |
19 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-WBWS633720-4OZ | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 4 oz (113.40g) | 0.020" (0.51mm) | - | No-Clean, Water Soluble | - | Leaded | - | - | |||
 |
WBRASAC31-2OZ | 13.5000 | |
15 | 0.00000000 | SRA Soldering Products | - | Box | Active | Wire Solder | - | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-WBRASAC31-2OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 2 oz (56.70g) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | - | Lead Free | ||||
 |
CQ-SS-SNBIAG-0.50MM-25000 | 62.9500 | |
6 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | 315-CQ-SS-SNBIAG-0.50MM-25000 | EAR99 | 8311.90.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar | 0.020" (0.51mm) | 280°F (138°C) | - | - | - | |||||
 |
26-6040-8227 | - | |
1707 | 0.00000000 | Kester Solder | 88 | Bulk | Active | Wire Solder | 26-6040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 5 lbs (2.27kg) | 0.062" (1.57mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Leaded | ||||||
 |
NC191SNL15T5 | 16.9500 | |
3013 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191SNL15T5 | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 0.53 oz (15g), 5cc | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 5 | ||||
 |
SSLFNC-T5-15G | 17.9900 | |
9204 | 0.00000000 | SRA Soldering Products | - | Bag | Active | Solder Paste | SSLFNC | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 0.53 oz (15g), 5cc | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | Refrigerated | 5 | |||
 |
TS391LT250 | 84.9500 | |
1121 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391L | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 8.8 oz (250g) | - | 281°F (138°C) | No-Clean | - | Lead Free | 4 | ||||
 |
24-6337-6403 | 55.5600 | |
228 | 0.00000000 | Kester Solder | 331 | Spool | Active | Wire Solder | 24-6337 | 1 lb (453.59 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361°F (183°C) | Water Soluble | 20 AWG, 22 SWG | Leaded | ||||
 |
WC96L2031E | 50.9000 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 20 AWG, 22 SWG | Lead Free | |||||||||
 |
SMD2195-25000 | 16.7900 | |
13 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.022" (0.56mm) | 361°F (183°C) | - | - | Leaded | |||||
 |
NC191LT250T5 | 67.9500 | |
2 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LT250T5 | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 8.8 oz (250g) | - | 280°F (138°C) | No-Clean | - | Lead Free | 5 | ||||
 |
T0051386799 | 118.0000 | |
3 | 0.00000000 | Apex Tool Group | Weller® | Spool | Active | Wire Solder | - | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | 72-T0051386799 | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 17.64 oz (500g) | 0.047" (1.19mm) | - | No-Clean | - | Lead Free | |||||
 |
NC191LTA50T5 | 27.9500 | |
1338 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA50T5 | EAR99 | 3810.10.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Jar, 1.76 oz (50g) | - | 279°F (137°C) | No-Clean | - | - | 5 | ||||
 |
289398 | - | |
2876 | 0.00000000 | Harimatec Inc. | - | Bulk | Obsolete | - | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 400 | - | - | - | - | - | - | - | - | ||||||
 |
SMDSWLF.006 5G | 29.9900 | |
2 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | - | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMDSWLF.0065G | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 0.176 oz (5g) | 0.006" (0.15mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | ||||
 |
70-5022-0910 | 157.9640 | |
2238 | 0.00000000 | Kester Solder | - | Bulk | Active | Solder Paste | 70-5022 | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | Not Applicable | REACH Unaffected | 117-70-5022-0910 | EAR99 | 8311.90.0000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | - | Water Soluble | - | Lead Free | Refrigerated | 4 | |||
 |
NC191AX50T5 | 24.9500 | |
2 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-NC191AX50T5 | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 1.76 oz (50g) | - | 361°F (183°C) | No-Clean | - | Leaded | 5 | ||||
 |
CQ-SS-SNBIAG-0.30MM-25000 | 59.9500 | |
5 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | 315-CQ-SS-SNBIAG-0.30MM-25000 | EAR99 | 8311.90.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar | 0.012" (0.31mm) | 280°F (138°C) | - | - | - | |||||
 |
NC191LT50 | 18.9500 | |
7437 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LT50 | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 1.76 oz (50g) | - | 280°F (138°C) | No-Clean | - | Lead Free | 4 | ||||
 |
T0051388499 | 33.0000 | |
3 | 0.00000000 | Apex Tool Group | Weller® | Spool | Active | Wire Solder | - | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | 72-T0051388499 | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 3.53 oz (100g) | 0.020" (0.51mm) | - | No-Clean | - | Lead Free | |||||
 |
SMD3SW.031 1OZ | 14.3500 | |
2 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 1 oz (28.35g) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | - | Leaded | ||||
 |
WC63L2031 | 31.3500 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC63L2031 | 1 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 361°F (183°C) | Water Soluble | 20 AWG, 22 SWG | Leaded | ||||||||
|
1846154 | - | |
5847 | 0.00000000 | Harimatec Inc. | HF212 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | - | - | - | RoHS Compliant | Not Applicable | EAR99 | 8311.90.0000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423°F (217°C) | No-Clean | - | Lead Free | - | - | |||||
 |
CWSN60WRMAP .032 | 47.2100 | |
100 | 0.00000000 | Amerway Inc | - | Box | Active | Wire Solder | CWSN60 | - | - | - | - | RoHS non-compliant | 2757-CWSN60WRMAP.032 | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.032" (0.81mm) | - | - | - | - | |||||||||
 |
SMDLTLFP250T4 | 83.9500 | |
6 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMDLTL | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 8.8 oz (250g) | - | 281°F (138°C) | No-Clean | - | Lead Free | Refrigerated | 4 |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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