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Email: sales@sic-components.com
Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
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1747469 | - | ![]() |
4443 | 0.00000000 | Harimatec Inc. | HF250DP | Bulk | Obsolete | Solder Paste | - | - | - | - | - | RoHS Compliant | Not Applicable | EAR99 | 8311.90.0000 | 10 | Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) | Cartridge, 0.88 oz (25g) | - | 423°F (217°C) | No-Clean | - | Lead Free | - | - | |||||
SMD291SNL500T5 | 198.9500 | ![]() |
8103 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMD291 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 5 | |||||
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24-6337-7402 | 114.6100 | ![]() |
77 | 0.00000000 | Kester Solder | 282 | Bulk | Active | Wire Solder | 24-6337 | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Leaded | - | |||||
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395465 | 59.4800 | ![]() |
7 | 0.00000000 | Harimatec Inc. | C502 | Bulk | Active | Wire Solder | 1 lb (453.59 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.064" (1.63mm) | 361°F (183°C) | No-Clean | 14 AWG, 16 SWG | Leaded | - | |||||
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24-6337-8842 | 58.6448 | ![]() |
7610 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.025" (0.64mm) | 361°F (183°C) | No-Clean | 22 AWG, 23 SWG | Leaded | ||||||
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23-6337-8807 | - | ![]() |
4271 | 0.00000000 | Kester Solder | 245 | Spool | Obsolete | Wire Solder | 0.5 lb (226.8 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | KE1406 | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | Leaded | ||||
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90-7068-9850 | - | ![]() |
2709 | 0.00000000 | Kester Solder | 296 | Bulk | Obsolete | Wire Solder | - | - | - | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 3.53 oz (100g) | 0.010" (0.25mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 30 AWG, 33 SWG | Lead Free | - | |||||
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24-6337-9721 | 41.7837 | ![]() |
8570 | 0.00000000 | Kester Solder | 285 | Spool | Active | Wire Solder | 1 lb (453.59 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | KE1199 | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 14 AWG, 16 SWG | Leaded | ||||
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92-6337-6402 | - | ![]() |
1081 | 0.00000000 | Kester Solder | 331 | Bulk | Active | Wire Solder | 92-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 17.64 oz (500g) | 0.031" (0.79mm) | 361°F (183°C) | Water Soluble | 20 AWG, 22 SWG | Leaded | |||||
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DKS-63/37-NC-02OZ | 12.7200 | ![]() |
8929 | 0.00000000 | DIGIKEY STANDARD | - | Bulk | Active | - | Not Applicable | 4937-DKS-63/37-NC-02OZ | 1 | |||||||||||||||||||||
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SMD4300SNL500T4C | 127.5000 | ![]() |
6259 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® SMD4300 | Cartridge | Active | Solder Paste | SMD4300 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 17.64 oz (500g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | 4 | ||||
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70-1302-0510 | 133.8050 | ![]() |
2790 | 0.00000000 | Kester Solder | R231 | Bulk | Active | Solder Paste | 70-1302 | 4 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | - | 361°F (183°C) | Rosin Mildly Activated (RMA) | - | Leaded | 3 | ||||
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24-6337-8500 | - | ![]() |
2116 | 0.00000000 | Kester Solder | 232 | Bulk | Obsolete | Wire Solder | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361°F (183°C) | - | 20 AWG, 22 SWG | Leaded | - | ||||||
SMDSWLF.015 2OZ | 18.4200 | ![]() |
4 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 2 oz (56.70g) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | |||||
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91-7068-8844 | 77.5721 | ![]() |
8825 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 91-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8.8 oz (250g) | 0.015" (0.38mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 27 AWG, 28 SWG | Lead Free | |||||
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SMD2SW.031 1LB | 38.7700 | ![]() |
5 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Leaded | - | ||||
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96-6040-8832 | - | ![]() |
1837 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 96-6040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 17.64 oz (500g) | 0.031" (0.79mm) | 361 ~ 374°F (183 ~ 190°C) | No-Clean | 20 AWG, 22 SWG | Leaded | |||||
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397952 | 24.5700 | ![]() |
4994 | 0.00000000 | Harimatec Inc. | 366 | Bulk | Active | Wire Solder | 0.551 lb (249.93 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | Spool, 8.8 oz (250g) | 0.022" (0.56mm) | 565 ~ 574°F (296 ~ 301°C) | Rosin Activated (RA) | 23 AWG, 24 SWG | Leaded | - | |||||
SMDLTLFP60T4 | 40.9500 | ![]() |
8221 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste, Two Part Mix | SMDLTL | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 2.12 oz (60g) | - | 281°F (138°C) | No-Clean | - | Lead Free | 4 | ||||||
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24-6337-0061 | 57.1400 | ![]() |
87 | 0.00000000 | Kester Solder | 44 | Spool | Active | Wire Solder | 24-6337 | 1 lb (453.59 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 361°F (183°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Leaded | ||||
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70-0605-0810 | 146.0660 | ![]() |
8037 | 0.00000000 | Kester Solder | EM907 | Bulk | Active | Solder Paste | 70-0605 | 4 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | Lead Free | 3 | ||||
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92-6337-0027 | - | ![]() |
6373 | 0.00000000 | Kester Solder | 44 | Bulk | Obsolete | Wire Solder | 92-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 17.64 oz (500g) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Leaded | |||||
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70-0102-0611 | 174.5600 | ![]() |
6 | 0.00000000 | Kester Solder | EP256 | Bulk | Active | Solder Paste | 70-0102 | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn63Pb37 (63/37) | Cartridge, 21.16 oz (600g) | - | 361°F (183°C) | No-Clean | - | Leaded | 3 | ||||
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SMDLTLFP250T4 | 83.9500 | ![]() |
6 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMDLTL | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 8.8 oz (250g) | - | 281°F (138°C) | No-Clean | - | Lead Free | Refrigerated | 4 | |||
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24-6337-8846 | 41.6564 | ![]() |
6582 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 361°F (183°C) | No-Clean | 18 AWG, 19 SWG | Leaded | ||||||
733002 | 100.1500 | ![]() |
8525 | 0.00000000 | Harimatec Inc. | C511™ | Bulk | Active | Wire Solder | 1 lb (453.59 g) | - | - | - | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 423°F (217°C) | No-Clean | 20 AWG, 21 SWG | Lead Free | - | ||||||
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SMDAL50 | 25.9500 | ![]() |
1 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Solder Paste | SMDAL | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3.5 (96.5/3.5) | Jar, 1.76 oz (50g) | - | 430°F (221°C) | Water Soluble | - | Lead Free | 3 | ||||
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386824 | 59.6100 | ![]() |
37 | 0.00000000 | Harimatec Inc. | 370 | Bulk | Active | Wire Solder | 1 lb (453.59 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 17.64 oz (500g) | 0.024" (0.61mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | Leaded | - | |||||
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NC191LT15T5 | 14.9500 | ![]() |
5733 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LT15T5 | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 0.53 oz (15g), 5cc | - | 280°F (138°C) | No-Clean | - | Lead Free | 5 | ||||
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CWSN60 NCCW2.2 .015 | 56.1500 | ![]() |
100 | 0.00000000 | Amerway Inc | - | Box | Active | Wire Solder | CWSN60 | - | - | - | - | RoHS non-compliant | 2757-CWSN60NCCW2.2.015 | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.015" (0.38mm) | - | - | - | - |
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