- RFQ
- BOM
-
Contact Us
Tel: +86-0755-83501315
Email: sales@sic-components.com
- Chinese
- English
- French
- German
- Portuguese
- Spanish
- Russian
- Japanese
- Korean
- Arabic
- Irish
- Greek
- Turkish
- Italian
- Danish
- Romanian
- Indonesian
- Czech
- Afrikaans
- Swedish
- Polish
- Basque
- Catalan
- Esperanto
- Hindi
- Lao
- Albanian
- Amharic
- Armenian
- Azerbaijani
- Belarusian
- Bengali
- Bosnian
- Bulgarian
- Cebuano
- Chichewa
- Corsican
- Croatian
- Dutch
- Estonian
- Filipino
- Finnish
- Frisian
- Galician
- Georgian
- Gujarati
- Haitian
- Hausa
- Hawaiian
- Hebrew
- Hmong
- Hungarian
- Icelandic
- Igbo
- Javanese
- Kannada
- Kazakh
- Khmer
- Kurdish
- Kyrgyz
- Latin
- Latvian
- Lithuanian
- Luxembou..
- Macedonian
- Malagasy
- Malay
- Malayalam
- Maltese
- Maori
- Marathi
- Mongolian
- Burmese
- Nepali
- Norwegian
- Pashto
- Persian
- Punjabi
- Serbian
- Sesotho
- Sinhala
- Slovak
- Slovenian
- Somali
- Samoan
- Scots Gaelic
- Shona
- Sindhi
- Sundanese
- Swahili
- Tajik
- Tamil
- Telugu
- Thai
- Ukrainian
- Urdu
- Uzbek
- Vietnamese
- Welsh
- Xhosa
- Yiddish
- Yoruba
- Zulu
- Kinyarwanda
- Tatar
- Oriya
- Turkmen
- Uyghur
Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
SMD3SWLT.040 10G | 19.1500 |  |
4 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD3SWLT.04010G | EAR99 | 8311.30.6000 | 1 | Bi58Sn42 (58/42) | Spool, 0.35 oz (10g) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | Lead Free | |||
 |
CWSAC WRMAP3 .032 | 97.2800 | |
100 | 0.00000000 | Amerway Inc | - | Box | Active | Wire Solder | CWSAC | - | - | - | - | ROHS3 Compliant | 2757-CWSACWRMAP3.032 | 25 | Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) | Spool, 1 lb (453.59g) | 0.032" (0.81mm) | - | - | - | - | |||||||
 |
CWSN60NCCW2 .062 1# | 43.4100 | |
100 | 0.00000000 | Amerway Inc | - | Box | Active | Wire Solder | CWSN60 | - | - | - | - | RoHS non-compliant | 2757-CWSN60NCCW2.0621# | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.062" (1.57mm) | - | - | - | - | |||||||
 |
83-6337-0027 | - | |
1596 | 0.00000000 | Kester Solder | 83 | Bag | Active | Wire Solder | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | 2368-83-6337-0027 | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Tube, 0.50 oz (14.17g) | 0.031" (0.79mm) | - | Rosin Activated (RA) | 20 AWG, 22 SWG | Leaded | |||||
 |
2591111 | 26.6000 | |
5557 | 0.00000000 | Harimatec Inc. | LOCTITE® GC 50 | Bulk | Active | Solder Paste | 6 Months | Date of Manufacture | 41°F ~ 77°F (5°C ~ 25°C) | download | ROHS3 Compliant | Not Applicable | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge | - | 423°F (217°C) | No-Clean | - | Lead Free | 5 | |||||
 |
2472691 | - | |
5533 | 0.00000000 | Harimatec Inc. | LOCTITE® GC 18 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | 41°F ~ 77°F (5°C ~ 25°C) | download | ROHS3 Compliant | Not Applicable | EAR99 | 3810.10.0000 | 30 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | - | 423°F (217°C) | No-Clean | - | Lead Free | - | |||||
 |
NC191LTA35T5 | 23.9500 | |
9504 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA35T5 | EAR99 | 3810.10.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Syringe, 1.23 oz (35g), 10cc | - | 279°F (137°C) | No-Clean | - | - | 5 | ||
 |
SMD291SNLT7 | 69.9500 | |
1 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | SMD291 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD291SNLT7 | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 0.35 oz (10g), 5cc | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | - | 7 | ||
 |
NC3SWLF.031 0.5OZ | 5.5800 | |
23 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC3SW | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC3SWLF.0310.5OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3.5 (96.5/3.5) | Tube, 0.50 oz (14.17g) | 0.031" (0.79mm) | 430°F (221°C) | No-Clean | 20 AWG, 21 SWG | - | |||
 |
NC3SWLF.020 0.3OZ | 5.7700 | |
35 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC3SW | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC3SWLF.0200.3OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3.5 (96.5/3.5) | Tube, 0.3 oz (8.51g) | 0.020" (0.51mm) | 430°F (221°C) | No-Clean | 24 AWG, 25 SWG | - | |||
 |
NC191LTA35 | 17.9500 | |
3 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA35 | EAR99 | 3810.10.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Syringe, 1.23 oz (35g), 10cc | - | 279°F (137°C) | No-Clean | - | - | 4 | ||
 |
EXB-SN63PB37 | 23.0200 | |
8512 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | EXB-SN63 | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-EXB-SN63PB37 | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Bar, 1 lb (454g) | - | 361°F (183°C) | - | - | Leaded | |||
 |
NC2SW.031 0.5OZ | 2.9400 | |
295 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC2SW | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-NC2SW.0310.5OZ | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Tube, 0.50 oz (14.17g) | 0.031" (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean | 20 AWG, 21 SWG | Leaded | |||
 |
SMD291SNL40T7 | 199.9500 | |
2 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | SMD291 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD291SNL40T7 | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.41 oz (40g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | - | 7 | ||
|
24-6337-7631 | - | |
2841 | 0.00000000 | Kester Solder | 275 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.010" (0.25mm) | 361°F (183°C) | No-Clean | 30 AWG, 33 SWG | Leaded | |||||
 |
RCBLF22701062P | 56.0000 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-RCBLF22701062P | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 1 lb (453.59g) | 0.062" (1.57mm) | 440°F (227°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Lead Free | ||||||
 |
CC60L2031 | 30.2700 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-CC60L2031 | 1 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 363°F (184°C) | No-Clean | 20 AWG, 22 SWG | Leaded | ||||||
 |
WC60L2062P | 27.6000 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC60L2062P | 1 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.062" (1.57mm) | 363°F (184°C) | Water Soluble | 14 AWG, 16 SWG | Leaded | ||||||
 |
RC60L2020 | 47.4100 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-RC60L2020 | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 363°F (184°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Leaded | ||||||
 |
WCBLF22701031 | 58.9200 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-WCBLF22701031 | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 1 lb (453.59g) | 0.031" (0.79mm) | 440°F (227°C) | Water Soluble | 20 AWG, 22 SWG | Lead Free | ||||||
 |
RC63L2062E | 29.6700 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-RC63L2062E | 1 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.062" (1.57mm) | 361°F (183°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Leaded | ||||||
 |
CCBLF22701031P | 58.9200 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-CCBLF22701031P | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 1 lb (453.59g) | 0.031" (0.79mm) | 440°F (227°C) | No-Clean | 20 AWG, 22 SWG | Lead Free | ||||||
 |
WC63L2020P | 36.6400 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC63L2020P | 1 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 361°F (183°C) | Water Soluble | 24 AWG, 25 SWG | Leaded | ||||||
 |
CCBLF227L2020 | 40.8400 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-CCBLF227L2020 | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 440°F (227°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | ||||||
 |
RC6301020E | 48.8600 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-RC6301020E | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Leaded | ||||||
 |
CC96L2020ESAC | 56.5500 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-CC96L2020ESAC | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | ||||||
 |
RC6001031P | 42.3800 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-RC6001031P | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 363°F (184°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Leaded | ||||||
|
WC6301020P | 48.8600 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC6301020P | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 361°F (183°C) | Water Soluble | 24 AWG, 25 SWG | Leaded | ||||||
 |
RC96L2031EAG3 | 50.9000 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-RC96L2031EAG3 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Lead Free | ||||||
 |
WC96L2062PSAC | 49.1600 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-WC96L2062PSAC | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8 oz (227g), 1/2 lb | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 14 AWG, 16 SWG | Lead Free |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
Wishlist (0 Items)