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Email: sales@sic-components.com
Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
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CC6301062E | 41.5300 | ![]() |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-CC6301062E | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 22 SWG | Leaded | ||||||||
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NC191LT50T5 | 27.9500 | ![]() |
9933 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LT50T5 | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 1.76 oz (50g) | - | 280°F (138°C) | No-Clean | - | Lead Free | Refrigerated | 5 | ||
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NC191SNL250 | 57.9500 | ![]() |
4547 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191SNL250 | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 4 | ||||
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NC191LT35T5 | 23.9500 | ![]() |
5877 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LT35T5 | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 1.23 oz (35g), 10cc | - | 280°F (138°C) | No-Clean | - | Lead Free | 5 | ||||
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NC191LT250 | 57.9500 | ![]() |
6340 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LT250 | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 8.8 oz (250g) | - | 280°F (138°C) | No-Clean | - | Lead Free | Refrigerated | 4 | ||
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70-0605-0910 | 173.0030 | ![]() |
8714 | 0.00000000 | Kester Solder | EM907 | Bulk | Active | Solder Paste | 70-0605 | 4 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | Lead Free | 4 | ||||
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TOL-09161 | 6.5000 | ![]() |
1770 | 0.00000000 | SparkFun Electronics | - | Bulk | Active | Wire Solder | - | 12 Months | Date of Manufacture | - | - | - | Not applicable | 1 (Unlimited) | 1568-TOL-09161 | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 3.53 oz (100g) | 0.031" (0.79mm) | - | Water Soluble | - | Leaded | |||||
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CQ-SS-6040-0.76MM | 350.0000 | ![]() |
4 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | 315-CQ-SS-6040-0.76MM | 1 | Sn60Pb40 (60/40) | Jar | - | 361°F (183°C) | - | - | Leaded | ||||||
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NC3SW.020 1LB | 77.2300 | ![]() |
1 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC3SW | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | NC3SW.0201LB | EAR99 | 8311.30.3000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 354°F (179°C) | No-Clean | 24 AWG, 25 SWG | Leaded | |||||
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NC3SW.031 1LB | 75.5400 | ![]() |
11 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC3SW | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | NC3SW.0311LB | EAR99 | 8311.30.6000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean | 20 AWG, 21 SWG | Leaded | |||||
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NC2SWLF.020 1LB | 64.0300 | ![]() |
4 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC2SW | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | NC2SWLF.0201LB | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | |||||
SMD2SWLF.015 4OZ | 26.7800 | ![]() |
3613 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 4 oz (113.40g) | 0.015" (0.38mm) | 441°F (227°C) | No-Clean, Water Soluble | - | Lead Free | |||||
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275500 | 0.4400 | ![]() |
1213 | 0.00000000 | Kester Solder | - | Bulk | Active | - | 117-275500 | 1 | ||||||||||||||||||||||
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SMD2SWLF.020 .4OZ | 10.4900 | ![]() |
6241 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | SMD2SWLF.020.4OZ | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Tube, 0.7 oz (19.85g) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Lead Free | - | |||
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24-6337-7618 | - | ![]() |
7614 | 0.00000000 | Kester Solder | 275 | Spool | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 22 SWG | Leaded | |||||||
RASW.031 4OZ | 9.4100 | ![]() |
4262 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW | 60 Months | Date of Manufacture | download | RoHS non-compliant | Not Applicable | REACH Affected | RASW.0314OZ | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Spool, 4 oz (113.40g) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | Leaded | |||||||
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TS391LT500C | 150.9500 | ![]() |
5779 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391L | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Cartridge, 17.64 oz (500g) | - | 281°F (138°C) | No-Clean | - | Lead Free | 4 | ||||
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1844641 | - | ![]() |
8268 | 0.00000000 | Harimatec Inc. | HF212 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | - | - | - | RoHS Compliant | Not Applicable | EAR99 | 8311.90.0000 | 10 | SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 | Jar, 17.64 oz (500g) | - | 408 ~ 424°F (209 ~ 218°C) | No-Clean | - | Lead Free | - | - | |||||
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90-7068-1407 | - | ![]() |
6794 | 0.00000000 | Kester Solder | 48 | Bulk | Active | Wire Solder | 90-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 3.53 oz (100g) | 0.015" (0.38mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | Lead Free | |||||
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T0051387099 | 138.0000 | ![]() |
6 | 0.00000000 | Apex Tool Group | Weller® | Spool | Active | Wire Solder | - | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | 72-T0051387099 | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 17.64 oz (500g) | 0.020" (0.51mm) | - | No-Clean | - | Lead Free | |||||
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796065 | 67.7900 | ![]() |
5176 | 0.00000000 | Harimatec Inc. | C400 | Bulk | Active | Wire Solder | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8.8 oz (250g) | 0.015" (0.38mm) | 423°F (217°C) | No-Clean | 27 AWG, 28 SWG | Lead Free | - | |||||
SMD2SWLF.031 2OZ | 16.3100 | ![]() |
7 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 2 oz (56.70g) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | - | Lead Free | |||||
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1405711 | - | ![]() |
3002 | 0.00000000 | Harimatec Inc. | MP218 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | Not Applicable | EAR99 | 8311.30.3000 | 20 | Sn63Pb37 (63/37) | Cartridge, 24.69 oz (700g) | - | 361°F (183°C) | No-Clean | - | Leaded | 4 | |||||||
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26-7000-0104 | - | ![]() |
1896 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 26-7000 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99 (99) | Spool, 5 lbs (2.27kg) | 0.093" (2.36mm) | - | Rosin Activated (RA) | 11 AWG, 13 SWG | Lead Free | |||||
SMD3SW.031 4OZ | 30.9700 | ![]() |
4 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 4 oz (113.40g) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | - | Leaded | |||||
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14-0015-0025 | - | ![]() |
2991 | 0.00000000 | Kester Solder | - | Bulk | Obsolete | Wire Solder | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Pb97.5Ag1.5Sn1 (97.5/1.5/1) | Spool, 1 lb (454 g) | 0.025" (0.64mm) | 588°F (309°C) | - | 22 AWG, 23 SWG | Leaded | - | |||||
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2080670 | 75.0211 | ![]() |
4310 | 0.00000000 | Harimatec Inc. | HF2W | Bulk | Active | Solder Paste | - | - | 32°F ~ 50°F (0°C ~ 10°C) | To ensure customer satisfaction and product integrity, air shipment is recommended. | - | RoHS non-compliant | Not Applicable | 0000.00.0000 | 10 | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | - | 361°F (183°C) | Water Soluble | - | Leaded | ||||||||
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70-4722-0910 | - | ![]() |
7126 | 0.00000000 | Kester Solder | WP601-ZH | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | - | Lead Free | - | |||||
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26-6337-8817 | 213.6555 | ![]() |
3926 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 26-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 5 lbs (2.27kg) | 0.062" (1.57mm) | 361°F (183°C) | No-Clean | 14 AWG, 16 SWG | Leaded | ||||||
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96-7068-8820 | - | ![]() |
1584 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 96-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 17.64 oz (500g) | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 24 AWG, 25 SWG | Lead Free |
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