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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
EXB-SN99.3CU0.7-0.5LB | 19.2500 |  |
6236 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | EXB-SN99 | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-EXB-SN99.3CU0.7-0.5LB | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Bar, 0.5 lb (227g) | - | 441°F (227°C) | - | - | Leaded | |||||
 |
NC191AX35 | 16.9500 | |
3 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-NC191AX35 | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | - | 361°F (183°C) | No-Clean | - | Leaded | 4 | ||||
 |
WBNCC633720-4OZ | 14.9900 | |
9315 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | WBNCC633720 | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 4 oz (113.40g) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | Leaded | ||||||
 |
RMA591LT250 | 84.9500 | |
1180 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | - | 6 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-RMA591LT250 | 1 | Sn42Bi57.6Ag0.4 (42/57.6/0.4) | Jar, 8.8 oz (250g) | - | 280°F (138°C) | No-Clean | - | - | ||||||
 |
24-7050-9703 | 136.0551 | |
4132 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 24-7050 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.3Ag3.7 (96.3/3.7) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | Lead Free | |||||
 |
92-7150-8850 | - | |
8039 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 92-7150 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 17.64 oz (500g) | 0.050" (1.27mm) | 354°F (179°C) | No-Clean | 16 AWG, 18 SWG | Leaded | |||||
 |
24-6337-7615 | - | |
3570 | 0.00000000 | Kester Solder | 275 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 361°F (183°C) | No-Clean | 14 AWG, 16 SWG | Leaded | |||||||
 |
91-6337-6400 | - | |
8759 | 0.00000000 | Kester Solder | 331 | Bulk | Active | Wire Solder | 91-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 8.8 oz (250g) | 0.020" (0.51mm) | 361°F (183°C) | Water Soluble | 24 AWG, 25 SWG | Leaded | |||||
 |
SMD2190 | 84.9500 | |
5582 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Jar | 0.020" (0.51mm) | 361°F (183°C) | - | - | Leaded | - | ||||||
 |
7770680000 | - | |
2351 | 0.00000000 | Kester Solder | ULTRAPURE® | Bulk | Active | Bar Solder | 07-7068 | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Bar, 5 lbs (2.27kg) | - | 423 ~ 424°F (217 ~ 218°C) | - | - | Lead Free | - | ||||
 |
SSNC-35G | 19.9900 | |
5189 | 0.00000000 | SRA Soldering Products | - | Bag | Active | Solder Paste | SSNC | 12 Months | Date of Manufacture | 37°F ~ 42°F (3°C ~ 6°C) | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-SSNC-35G | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | - | - | No-Clean | - | - | 3 | ||||
 |
24-6337-7604 | 66.8256 | |
2347 | 0.00000000 | Kester Solder | 275 | Spool | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 361°F (183°C) | No-Clean | 27 AWG, 28 SWG | Leaded | ||||||
|
WBARS99.3/.7 | 49.9900 | |
25 | 0.00000000 | SRA Soldering Products | SUPER-PURE™ | Bag | Active | Bar Solder | WBARS99 | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-WBARS99.3/.7 | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Bar, 1 lb (453.59g) | - | - | - | - | Lead Free | |||||
 |
SSNC-T5-15G | 16.9900 | |
9290 | 0.00000000 | SRA Soldering Products | - | Bag | Active | Solder Paste | SSNC-T | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Syringe, 0.53 oz (15g), 5cc | - | 361°F (183°C) | No-Clean | - | Leaded | Refrigerated | 5 | |||
|
92-6337-7619 | - | |
6714 | 0.00000000 | Kester Solder | 275 | Bulk | Active | Wire Solder | 92-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 17.64 oz (500g) | 0.025" (0.64mm) | 361°F (183°C) | No-Clean | 22 AWG, 23 SWG | Leaded | |||||
 |
SMD2SWLF.015 1OZ | 12.4100 | |
8 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 oz (28.35g) | 0.015" (0.38mm) | 441°F (227°C) | No-Clean, Water Soluble | - | Lead Free | ||||
 |
SMD291AX500T5 | 180.7500 | |
5653 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMD291 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean | - | Leaded | 5 | ||||
 |
28-5050-0654 | - | |
1997 | 0.00000000 | Kester Solder | OR421 | Bulk | Active | Wire Solder | 28-5050 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn50Pb50 (50/50) | Spool, 20 lbs (9.07kg) | 0.062" (1.57mm) | 361 ~ 420°F (183 ~ 216°C) | Water Soluble | 14 AWG, 16 SWG | Leaded | ||||||
|
23-6040-0018 | - | |
2994 | 0.00000000 | Kester Solder | 44 | Spool | Obsolete | Wire Solder | 0.5 lb (226.8 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | KE1118 | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.025" (0.64mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | Leaded | ||||
 |
24-9574-7619 | 75.5156 | |
1339 | 0.00000000 | Kester Solder | 275 | Spool | Active | Wire Solder | 24-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.025" (0.64mm) | 441°F (227°C) | No-Clean | 22 AWG, 23 SWG | Lead Free | ||||||
|
24-9574-7601 | - | |
5347 | 0.00000000 | Kester Solder | 275 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean | 20 AWG, 22 SWG | Lead Free | ||||||
|
4900-18G | 24.1600 | |
14 | 0.00000000 | MG Chemicals | 4900 | Box | Active | Wire Solder | - | - | - | 64°F ~ 81°F (18°C ~ 27°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 473-4900-18G | EAR99 | 8311.30.6000 | 12 | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) | Tube, 0.74 oz (21g) | 0.032" (0.81mm) | 423°F (217°C) | No-Clean, Rosin Activated (RA) | 21 AWG, 21 SWG | Lead Free | - | |||
 |
24-6337-0053 | 60.8900 | |
37 | 0.00000000 | Kester Solder | 44 | Spool | Active | Wire Solder | 24-6337 | 1 lb (453.59 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.050" (1.27mm) | 361°F (183°C) | Rosin Activated (RA) | 16 AWG, 18 SWG | Leaded | ||||
 |
SMD2200-25000 | 16.3900 | |
2 | 0.00000000 | Chip Quik Inc. | SMD2 | Jar | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Jar | 0.024" (0.61mm) | 361°F (183°C) | - | - | Leaded | - | ||||||
 |
T0051387799 | 88.0000 | |
1 | 0.00000000 | Apex Tool Group | Weller® | Spool | Active | Wire Solder | - | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | 72-T0051387799 | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 17.64 oz (500g) | 0.047" (1.19mm) | - | No-Clean | - | Lead Free | |||||
|
24-7070-0060 | - | |
5353 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-7070 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95Ag5 (95/5) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 430 ~ 473°F (221 ~ 245°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Lead Free | |||||
 |
WBWS633731-1LB | 40.9900 | |
1 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.031" (0.79mm) | - | No-Clean, Water Soluble | - | Leaded | - | - | ||||
 |
386825 | - | |
9172 | 0.00000000 | Harimatec Inc. | C400 | Spool | Obsolete | Wire Solder | 1.1 lbs (499 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 20 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | Leaded | - | |||||
 |
NCSW.031 1LB | 40.6700 | |
6 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NCSW | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | NCSW.0311LB | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | Leaded | |||||
 |
4900P-250G | 106.7700 | |
4 | 0.00000000 | MG Chemicals | 4900 | Bulk | Active | Solder Paste | 4900 | 24 Months | Date of Manufacture | 35°F ~ 50°F (2°C ~ 10°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | SAC305 | Jar, 8.8 oz (250g) | - | 423 ~ 430°F (217 ~ 221°C) | No-Clean | - | Lead Free | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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