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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
44-7050-0000 | 117.0064 |  |
5009 | 0.00000000 | Kester Solder | ULTRAPURE® | Bulk | Active | Bar Solder | 44-7050 | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.3Ag3.7 (96.3/3.7) | Bar, 1.66 lbs (750g) | - | 430 ~ 444°F (221 ~ 223°C) | - | - | Lead Free | - | ||||
 |
24-9574-7618 | 73.0100 | |
192 | 0.00000000 | Kester Solder | 275 | Spool | Active | Wire Solder | 24-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean | 20 AWG, 22 SWG | Lead Free | ||||||
 |
SMD291AX250T4 | 50.9500 | |
1 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMD291 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | - | 361°F (183°C) | No-Clean | - | Leaded | Refrigerated | 4 | |||
 |
2064242 | - | |
2586 | 0.00000000 | Harimatec Inc. | LOCTITE® GC 10 | Bulk | Obsolete | Solder Paste | 12 Months | Date of Manufacture | 41°F ~ 77°F (5°C ~ 25°C) | - | - | RoHS Compliant | Not Applicable | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 29.98 oz (850g) | - | 423°F (217°C) | No-Clean | - | Lead Free | - | ||||||
 |
70-4021-0819 | - | |
7454 | 0.00000000 | Kester Solder | NP505-HR | Bulk | Active | Solder Paste | 70-4021 | 12 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 24.69 oz (700g) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | Lead Free | 3 | ||||
 |
24-6337-9727 | 68.7100 | |
124 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | Leaded | |||||
|
91-7068-9816 | - | |
5566 | 0.00000000 | Kester Solder | 296 | Bulk | Obsolete | Wire Solder | - | - | - | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8.8 oz (250g) | 0.015" (0.38mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 27 AWG, 28 SWG | Lead Free | - | |||||
 |
EXB-SN96.5AG3.0CU0.5 | 64.8800 | |
18 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | EXB-SN96 | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-EXB-SN96.5AG3.0CU0.5 | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Bar, 1 lb (454g) | - | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | |||||
|
24-7050-0039 | - | |
3399 | 0.00000000 | Kester Solder | 44 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.3Ag3.7 (96.3/3.7) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Lead Free | ||||||
 |
24-6337-0039 | 60.3600 | |
188 | 0.00000000 | Kester Solder | 44 | Spool | Active | Wire Solder | 24-6337 | 1 lb (453.59 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 361°F (183°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Leaded | ||||
 |
SMD2SW.020 .4OZ | 5.8900 | |
9 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | SMD2SW.020.4OZ | EAR99 | 8311.90.0000 | 1 | Sn60Pb40 (60/40) | Tube, 0.4 oz (11.34g) | 0.020" (0.51mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Leaded | - | |||
|
24-7317-9716 | 97.3000 | |
13 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 24-7317 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Pb88Sn10Ag2 (88/10/2) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 514 ~ 570°F (268 ~ 299°C) | Rosin Mildly Activated (RMA) | 18 AWG, 19 SWG | Leaded | |||||
 |
TS391SNL | 16.9500 | |
1566 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391S | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 0.53 oz (15g), 5cc | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 4 | ||||
 |
24-6040-8800 | - | |
8122 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 24-6040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361 ~ 374°F (183 ~ 190°C) | No-Clean | 20 AWG, 22 SWG | Leaded | ||||||
 |
SMD291AX500T3 | 75.9500 | |
1 | 0.00000000 | Chip Quik Inc. | - | Cartridge | Active | Solder Paste | SMD291 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean | - | Leaded | 3 | ||||
 |
17551LF | 5.2000 | |
9944 | 0.00000000 | Aven Tools | - | Bag | Obsolete | Wire Solder | 17551 | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 20 | Sn99.3Cu0.7 (99.3/0.7) | Tube, 0.71 oz (20g) | 0.039" (0.99mm) | 440°F (227°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Lead Free | - | |||||
 |
24-9574-1407 | - | |
2999 | 0.00000000 | Kester Solder | 48 | Bulk | Active | Wire Solder | 24-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 441°F (227°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | Lead Free | |||||
|
04-0020-0000 | - | |
9829 | 0.00000000 | Kester Solder | - | Bulk | Obsolete | Bar Solder | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Pb79Sn20Sb1 (79/20/1) | Bar, 1.66 lbs (750g) | - | - | - | - | Leaded | - | ||||||
 |
SMD2036-25000 | 24.9900 | |
4 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | 0.018" (0.46mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | |||||
 |
TS391AX10 | 26.9500 | |
9841 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391A | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | - | 361°F (183°C) | No-Clean | - | Leaded | 4 | ||||
|
1179443 | 14.4895 | |
3476 | 0.00000000 | Harimatec Inc. | 381™ | Bulk | Not For New Designs | Wire Solder | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 40 | Sn63Pb37 (63/37) | Spool, 8.8 oz (250g) | 0.022" (0.56mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 23 AWG, 24 SWG | Leaded | - | ||||||
 |
SMDSWLF.031 1OZ | 11.3800 | |
25 | 0.00000000 | Chip Quik Inc. | - | Spool | Active | Wire Solder | SMDSW | 0.062 lb (28.12 g) | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 oz (28.35g) | 0.031" (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Lead Free | - | |||
|
23-6040-0027 | - | |
1025 | 0.00000000 | Kester Solder | 44 | Spool | Obsolete | Wire Solder | 0.5 lb (226.8 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | KE1117 | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Leaded | ||||
 |
SMD291SNL15T4 | 20.9500 | |
10 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste, Two Part Mix | SMD291 | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 0.53 oz (15g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 4 | ||||
|
24-7080-0634 | - | |
7166 | 0.00000000 | Kester Solder | OR421 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95Sb5 (95/5) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 450 ~ 464°F (232 ~ 240°C) | Water Soluble | 20 AWG, 21 SWG | Lead Free | ||||||
 |
WC60L2031 | 30.2700 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC60L2031 | 1 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 363°F (184°C) | Water Soluble | 20 AWG, 22 SWG | Leaded | ||||||||
|
91-6337-9703 | - | |
3810 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 91-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 8.8 oz (250g) | 0.015" (0.38mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | Leaded | |||||
 |
96-7069-9515 | 183.0600 | |
141 | 0.00000000 | Kester Solder | 268 | Bulk | Active | Wire Solder | 96-7069 | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | KE1809 | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 17.64 oz (500g) | 0.015" (0.38mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 27 AWG, 28 SWG | Lead Free | ||||
 |
14-6337-0125 | 38.1780 | |
3873 | 0.00000000 | Kester Solder | Solid Core Wire | Spool | Active | Wire Solder | 14-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.125" (3.18mm) | 361°F (183°C) | - | 8 AWG, 10 SWG | Leaded | ||||||
 |
386851 | 58.5200 | |
1 | 0.00000000 | Harimatec Inc. | C502 | Bulk | Active | Wire Solder | 1.1 lbs (499 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.022" (0.56mm) | 361°F (183°C) | No-Clean | 23 AWG, 24 SWG | Leaded | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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